Patents by Inventor Allen Dee

Allen Dee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bump to package substrate solder joint
    Patent number: 12341126
    Abstract: A method of assembling a flipchip semiconductor package, includes placing a semiconductor die having circuitry electrically coupled to bond pads with bumps having solder paste thereon onto bonding features of a package substrate. Arc welding is used using an arc welding apparatus including a biased electrode having a tip spaced apart from the solder paste, wherein electrical current generated by the arc welding melts the solder paste to provide a solder connection.
    Type: Grant
    Filed: April 27, 2022
    Date of Patent: June 24, 2025
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Dolores Milo, Michael Milo, Allen Dee
  • BUMP TO PACKAGE SUBSTRATE SOLDER JOINT
    Publication number: 20230352441
    Abstract: A method of assembling a flipchip semiconductor package, includes placing a semiconductor die having circuitry electrically coupled to bond pads with bumps having solder paste thereon onto bonding features of a package substrate. Arc welding is used using an arc welding apparatus including a biased electrode having a tip spaced apart from the solder paste, wherein electrical current generated by the arc welding melts the solder paste to provide a solder connection.
    Type: Application
    Filed: April 27, 2022
    Publication date: November 2, 2023
    Inventors: Dolores Milo, Michael Milo, Allen Dee