Patents by Inventor ALLEN F.C. LIN

ALLEN F.C. LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • IN-MOLD LABEL AND METHOD FOR PRODUCING THE SAME
    Publication number: 20140087135
    Abstract: Provided is an in-mold label and a method for producing the in-mold label which has a heat-sealable resin layer with a plurality of interlaced and continuous-arranged micro-protrusions. While the in-mold label is combined on a surface of a specific article, the micro-protrusions may provide multiple blister-exhausting paths. As a result, it is effective to drive out the blisters as combining the label and the article. The in-mold label particularly includes a substrate made of a thermoplastic resin material, a printed layer on the substrate's one surface, and the other surface made of heat-sealable resin. With an embossing process, the heat-sealable resin layer having the interlaced and continuous-arranged micro-protrusions is formed. The in-mold label can be sealed to the article surface excellently since the micro-protrusions form the multiple paths for exhausting the blisters effectively.
    Type: Application
    Filed: December 2, 2013
    Publication date: March 27, 2014
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: ALLEN F.C. LIN, HONG KUO CHENG
  • In-mold label and method for producing the same
    Patent number: 8628711
    Abstract: Provided is an in-mold label and a method for producing the in-mold label which has a heat-sealable resin layer with a plurality of interlaced and continuous-arranged micro-protrusions. While the in-mold label is combined on a surface of a specific article, the micro-protrusions may provide multiple blister-exhausting paths. As a result, it is effective to drive out the blisters as combining the label and the article. The in-mold label particularly includes a substrate made of a thermoplastic resin material, a printed layer on the substrate's one surface, and the other surface made of heat-sealable resin. With an embossing process, the heat-sealable resin layer having the interlaced and continuous-arranged micro-protrusions is formed. The in-mold label can be sealed to the article surface excellently since the micro-protrusions form the multiple paths for exhausting the blisters effectively.
    Type: Grant
    Filed: October 13, 2010
    Date of Patent: January 14, 2014
    Assignee: Nan Ya Plastics Corporation
    Inventors: Allen F.C. Lin, Hong Kuo Cheng
  • IN-MOLD LABEL AND METHOD FOR PRODUCING THE SAME
    Publication number: 20120094069
    Abstract: Provided is an in-mold label and a method for producing the in-mold label which has a heat-sealable resin layer with a plurality of interlaced and continuous-arranged micro-protrusions. While the in-mold label is combined on a surface of a specific article, the micro-protrusions may provide multiple blister-exhausting paths. As a result, it is effective to drive out the blisters as combining the label and the article. The in-mold label particularly includes a substrate made of a thermoplastic resin material, a printed layer on the substrate's one surface, and the other surface made of heat-sealable resin. With an embossing process, the heat-sealable resin layer having the interlaced and continuous-arranged micro-protrusions is formed. The in-mold label can be sealed to the article surface excellently since the micro-protrusions form the multiple paths for exhausting the blisters effectively.
    Type: Application
    Filed: October 13, 2010
    Publication date: April 19, 2012
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: ALLEN F.C. LIN, HONG KUO CHENG