Abstract: In an aspect, a Co2Y-type ferrite includes oxides of at least Ba, La, Co, Me, Fe, and optionally Ca; wherein Me is at least Ni and optionally one or more of Zn, Cu, Mn, or Mg. A composite can include the Co2Y-type ferrite and a polymer. An article can include the Co2Y-type ferrite.

Abstract: A method of making a dielectric, Dk, electromagnetic, EM, structure, includes: providing a first mold portion comprising substantially identical ones of a first plurality of recesses arranged in an array; filling the first plurality of recesses with a curable first Dk composition having a first average dielectric constant greater than that of air after full cure; placing a substrate on top of and across multiple ones of the first plurality of recesses filled with the first Dk composition, and at least partially curing the curable first Dk composition; and, removing the substrate with the at least partially cured first Dk composition from the first mold portion, resulting in an assembly having the substrate and a plurality of Dk forms including the at least partially cured first Dk composition, each of the plurality of Dk forms having a three dimensional, 3D, shape defined by corresponding ones of the first plurality of recesses.

Abstract: A method of making a dielectric, Dk, electromagnetic, EM, structure, includes: providing a first mold portion comprising substantially identical ones of a first plurality of recesses arranged in an array; filling the first plurality of recesses with a curable first Dk composition having a first average dielectric constant greater than that of air after full cure; placing a substrate on top of and across multiple ones of the first plurality of recesses filled with the first Dk composition, and at least partially curing the curable first Dk composition; and, removing the substrate with the at least partially cured first Dk composition from the first mold portion, resulting in an assembly having the substrate and a plurality of Dk forms including the at least partially cured first Dk composition, each of the plurality of Dk forms having a three dimensional, 3D, shape defined by corresponding ones of the first plurality of recesses.

Abstract: Disclosed herein is a hexaferrite composite comprising polytetrafluoroethylene; and greater than or equal to 40 vol %, or 40 to 90 vol % a plurality of Co2Z hexaferrite particles based on the total volume of the polytetrafluoroethylene and the plurality of Co2Z hexaferrite particles on a void-free basis; wherein the hexaferrite composite has a porosity of greater than or equal to 10 vol % based on the total volume of the hexaferrite composite; wherein the hexaferrite composite has a permeability of greater than or equal to 2.5 and a ratio of the permeability to the permittivity of greater than or equal to 0.4, both determined at 500 MHz.

Abstract: In an embodiment, a dielectric substrate comprises an unsintered polytetrafluoroethylene; and a high dielectric constant filler, wherein the dielectric constant of the high dielectric constant filler is greater than or equal to 35; wherein the dielectric substrate has a specific gravity of greater than or equal to 90% of a calculated theoretical density of the dielectric substrate, wherein the theoretical specific gravity is calculated based on a measured specific gravity of the high dielectric constant filler, the specific gravity of the unsintered polytetrafluoroethylene, and the relative weight fractions of the unsintered polytetrafluoroethylene and the high dielectric constant filler; and wherein the dielectric substrate has a dielectric constant of greater than or equal to 11.5 as determined at a frequency of 10 GHz.

Abstract: Disclosed herein is a hexaferrite composite comprising polytetrafluoroethylene; and greater than or equal to 40 vol %, or 40 to 90 vol % a plurality of Co2Z hexaferrite particles based on the total volume of the polytetrafluoroethylene and the plurality of Co2Z hexaferrite particles on a void-free basis; wherein the hexaferrite composite has a porosity of greater than or equal to 10 vol % based on the total volume of the hexaferrite composite; wherein the hexaferrite composite has a permeability of greater than or equal to 2.5 and a ratio of the permeability to the permittivity of greater than or equal to 0.4, both determined at 500 MHz.

Abstract: In an embodiment, a dielectric substrate comprises an unsintered polytetrafluoroethylene; and a high dielectric constant filler, wherein the dielectric constant of the high dielectric constant filler is greater than or equal to 35; wherein the dielectric substrate has a specific gravity of greater than or equal to 90% of a calculated theoretical density of the dielectric substrate, wherein the theoretical specific gravity is calculated based on a measured specific gravity of the high dielectric constant filler, the specific gravity of the unsintered polytetrafluoroethylene, and the relative weight fractions of the unsintered polytetrafluoroethylene and the high dielectric constant filler; and wherein the dielectric substrate has a dielectric constant of greater than or equal to 11.5 as determined at a frequency of 10 GHz.

Abstract: In an embodiment, a magneto-dielectric substrate comprises a dielectric polymer matrix; and a plurality of hexaferrite particles dispersed in the polymer matrix in an amount and of a type effective to provide a magneto-dielectric substrate having a magnetic constant of greater than or equal to 2.5 from 0 to 500 MHz, or 3 to 8 from 0 to 500 MHz; a magnetic loss of less than or equal to 0.1 from 0 to 500 MHz, or 0.001 to 0.05 over 0 to 500 MHz; and a dielectric constant of 1.5 to 8 or 2.5 to 8 from 0 to 500 MHz.

Abstract: In an embodiment, a magneto-dielectric substrate comprises a dielectric polymer matrix; and a plurality of hexaferrite particles dispersed in the dielectric polymer matrix in amount and of a type effective to provide the magneto-dielectric substrate with a magnetic constant of less than or equal to 3.5 from 500 MHz to 1 GHz, or 3 to 8 from 500 MHz to 1 GHz, and a magnetic loss of less than or equal to 0.1 from 0 to 1 GHz, or 0.001 to 0.07 over 0 to 1 GHz.

Abstract: In an embodiment, a magneto-dielectric substrate comprises a dielectric polymer matrix; and a plurality of hexaferrite particles dispersed in the polymer matrix in an amount and of a type effective to provide a magneto-dielectric substrate having a magnetic constant of greater than or equal to 2.5 from 0 to 500 MHz, or 3 to 8 from 0 to 500 MHz; a magnetic loss of less than or equal to 0.1 from 0 to 500 MHz, or 0.001 to 0.05 over 0 to 500 MHz; and a dielectric constant of 1.5 to 8 or 2.5 to 8 from 0 to 500 MHz.

Abstract: A circuit substrate laminate, comprising a conductive metal layer; and a dielectric composite material having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006, wherein the dielectric composite material comprises: a polymer resin; and about 10 to about 70 volume percent of cenospheres having a ferric oxide content of less than or equal to 3 weight percent.

Abstract: A circuit substrate laminate, comprising a conductive metal layer; and a dielectric composite material having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006, wherein the dielectric composite material comprises: a polymer resin; and about 10 to about 70 volume percent of cenospheres having a ferric oxide content of less than or equal to 3 weight percent.

Abstract: A method for the manufacture of a multilayer circuit comprising a liquid crystalline polymer layer, the method comprising treating the multilayer circuit with an amount of heat effective to raise the crystalline to nematic melting point, as defined by the peak endotherm above the glass transition temperature in a differential scanning calorimeter measurement, of the liquid crystalline polymer layer by at least about 10° C.

Abstract: A liquid crystalline composite comprising a liquid crystalline polymer, particulate filler, and fibrous web. Further disclosed is a method for forming the liquid crystalline polymer composite. The liquid crystalline polymer composite is useful in circuit materials, circuits, and multi-layer circuits, economical to make, and has excellent flame retardant properties.

Abstract: An electrical circuit board fluoropolymer substrate and method of manufacture thereof, comprising a fluoropolymer matrix that includes a mixture of a granular first fluoropolymer resin and a dispersion second fluoropolymer resin. Preferably, the first and second fluoropolymer is polytetrafluoroethylene (PTFE). This mixture is suitable for forming unfilled or filled casting compositions to form thick films, or for dip-coating glass webs.

Abstract: An electrical circuit board fluoropolymer substrate and method of manufacture thereof, comprising a fluoropolymer matrix that includes a mixture of a granular first fluoropolymer resin and a dispersion second fluoropolymer resin. Preferably, the first and second fluoropolymer is polytetrafluoroethylene (PTFE). This mixture is suitable for forming unfilled or filled casting compositions to form thick films, or for dip-coating glass webs.

Abstract: An electroluminescent lamp is presented, wherein at least one of the phosphor layer or the dielectric layer comprises a polyureasilazane polymer. The polyureasilazane may be added to the fluoropolymer resin of the phosphor layer or the dielectric layer, and/or may be used to coat the phosphor particles within the phosphor layer or the inorganic filler particles within the dielectric layer. Use of polyureasilazanes confers enhanced adhesion and environmental resistance.

Abstract: A ceramic-filled fluoropolymer composite is presented, suitable for use as an electrical substrate material. In accordance with the present invention, a ceramic-filled fluoropolymer composite further comprises high temperature, high modulus, finely powdered polymeric material. The median particle size of the finely powdered polymeric material is less than about 200 .mu.m. The finely powdered polymeric material is further stable at temperatures greater than about 350.degree. C. Substitution of the finely powdered polymeric material for fluoropolymer matrix material within a fairly narrow concentration range results in a composite with enhanced flexural modulus, but no deleterious effect on dielectric loss. The composite material is plated or clad with conductive material.

Abstract: A high dielectric (K'.gtoreq.5), comparatively low thermal coefficient (absolute value of TCK'.ltoreq.200 ppm/.degree.C.) polymeric composite matrix is presented comprising commonly available and low cost fillers such as titania, alumina and magnesium oxide.

Abstract: A composite material is presented comprised of a ceramic filled fluoropolymer wherein the ceramic is coated with a silane and the ceramic has a volume % fraction of between about 26-45. The composite of this invention exhibits excellent chemical resistance, particularly to alkaline environments. Preferably, the silane comprises a blend of at least one phenyl silane and at least one fluorosilane. The silane is preferably coated to a level of 10% of the total weight of ceramic filler.