Abstract: An improved encapsulant and method of application for rework of a modular electronic assembly. A housing is provided with a structure that permits deformation with thermal expansion of the encapsulant and reduces stresses applied to the electronic components therewithin. The selected encapsulant provides mechanical stability from shock and vibration, thermal conductivity to the surroundings, and freedom from deterioration of electrical performance. Critically, the encapsulant is readily excised for repair and replacement of defective components, thus allowing rework and salvage of the assembly. A potting tool is adapted for selectively refilling the housing to replace the excised portions.