Abstract: A method of forming a slotted substrate that includes patterning a thin film over a substrate so that at least a portion of the substrate within a slot region is not covered by the thin film. In addition, a slot is formed in the substrate through the slot region that extends through the substrate and the thin film, wherein a chip count in a shelf surrounding the slot is minimized when the slot is formed in the substrate through the thin film in the slot region.

Abstract: A coated substrate for a center feed printhead has a substrate, a thin film applied over the substrate, and a slot region extending through the substrate and the thin film. A slot is formed through the slot region of the coated substrate. The thin film layer coating minimizes crack formation and/or a chip count in a shelf surrounding the slot through the substrate. In one embodiment, the slot is formed mechanically. In one embodiment, a plurality of thin films is used. The slot region extends through the plurality of thin films. Any combination of thin films may be applied over the substrate. In one embodiment, the thin film is at least one of a metal film, a polymer film, and a dielectric film. In another embodiment, the thin film material is ductile and/or deposited under compression. In one embodiment, the substrate is silicon, and the thin film is an insulating layer grown from the substrate, such as field oxide. In one embodiment, the thin film is PSG.

Abstract: A coated substrate for a center feed printhead has a substrate, a thin film applied over the substrate, and a slot region extending through the substrate and the thin film. A slot is formed through the slot region of the coated substrate. The thin film layer coating minimizes crack formation and/or a chip count in a shelf surrounding the slot through the substrate. In one embodiment, the slot is formed mechanically. In one embodiment, a plurality of thin films is used. The slot region extends through the plurality of thin films. Any combination of thin films may be applied over the substrate.

Abstract: A coated substrate for a center feed printhead has a substrate, a thin film applied over the substrate, and a slot region extending through the substrate and the thin film. A slot is formed through the slot region of the coated substrate. The thin film layer coating minimizes crack formation and/or a chip count in a shelf surrounding the slot through the substrate. In one embodiment, the slot is formed mechanically. In one embodiment, a plurality of thin films is used. The slot region extends through the plurality of thin films. Any combination of thin films may be applied over the substrate. In one embodiment, the thin film is at least one of a metal film, a polymer film, and a dielectric film. In another embodiment, the thin film material is ductile and/or deposited under compression. In one embodiment, the substrate is silicon, and the thin film is an insulating layer grown from the substrate, such as field oxide. In one embodiment, the thin film is PSG.

Abstract: A fluid drop ejecting apparatus including a thin film stack including a plurality of heater resistors formed on a substrate having a feed edge, a patterned fluid barrier layer disposed on the thin film stack, respective fluid chambers formed in the barrier layer over respective heater resistors, fluid feed features formed in the barrier layer between the fluid feed edge and the ink chambers, and a thin film metal structure in a metal layer of the thin film stack and located between the ink feed edge and the fluid chambers.

Abstract: A coated substrate for a center feed printhead has a substrate, a thin film applied over the substrate, and a slot region extending through the substrate and the thin film. A slot is formed through the slot region of the coated substrate. The thin film layer coating minimizes crack formation and/or a chip count in a shelf surrounding the slot through the substrate. In one embodiment, the slot is formed mechanically. In one embodiment, a plurality of thin films is used. The slot region extends through the plurality of thin films. Any combination of thin films may be applied over the substrate.

Abstract: A clean room system includes a processing room containing production equipment, a technical room adjacent the processing room and containing machinery for actuating the production equipment, and a wall separating the production equipment from the actuating machinery. The wall also serves to isolate the atmosphere of the processing room from the atmosphere of the technical room and to prevent contaminants emitted by the machinery from entering the processing room and, ultimately, contaminating the goods being manufactured or processed. The clean room system also is provided with a ventilation system for recirculating and filtering the atmosphere of the processing room. The ventilation system maintains the atmosphere of the processing room at a higher pressure than that of the atmosphere of the technical room to prevent air from passing from the technical room into the processing room.