Patents by Inventor Allen Henry Meitzler

Allen Henry Meitzler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hermetically sealed microelectronic device and method of forming same
    Patent number: 6127629
    Abstract: A microelectronic device is hermetically sealed at the wafer level. A substrate is provided having associated electronics and at least one metal bonding pad. A dielectric layer, such as pyrex glass film, is sputter deposited atop the substrate to form a glass/metal seal. A glass film is thereafter planarized, preferably by chemical-mechanical polishing, to remove surface variations. A cover wafer is thereafter anodically bonded to the dielectric layer/glass film so as to define a sealed cavity for housing and protecting the substrate electronics. The resultant microelectronic device is packaged in its own hermetically sealed container at the wafer level.
    Type: Grant
    Filed: October 3, 1994
    Date of Patent: October 3, 2000
    Assignee: Ford Global Technologies, Inc.
    Inventors: Kathirgamasundaram Sooriakumar, Allen Henry Meitzler, Shaun Leaf McCarthy, Russell J. Haeberle
  • Hermetically sealed microelectronic device and method of forming same
    Patent number: 5801068
    Abstract: A microelectronic device is hermetically sealed at the wafer level. A substrate is provided having associated electronics and at least one metal bonding pad. A dielectric layer, such as pyrex glass film, is sputter deposited atop the substrate to form a glass/metal seal. A glass film is thereafter planarized, preferably by chemical-mechanical polishing, to remove surface variations. A cover wafer is thereafter anodically bonded to the dielectric layer/glass film so as to define a sealed cavity for housing and protecting the substrate electronics. The resultant microelectronic device is packaged in its own hermetically sealed container at the wafer level.
    Type: Grant
    Filed: November 7, 1996
    Date of Patent: September 1, 1998
    Assignee: Ford Global Technologies, Inc.
    Inventors: Kathirgamasundaram Sooriakumar, Allen Henry Meitzler, Shaun Leaf McCarthy, Russell J. Haeberle