Abstract: An arrangement includes a solar energy receiving device and at least one component in thermal communication with the solar energy receiving device, the at least one component formed from a composite material, the composite material may comprise a matrix of carbon-based fibers, the carbon-based fibers comprising one or more of: mesophase carbon, carbon nanotubes, graphite, graphene and pan carbon. According to a further optional aspect, there is provided a solar energy receiving device comprising a first surface for receiving solar energy incident thereon, and a second opposing surface, the second surface being electrically conductive; at least one heat transport device in direct contact with at least a portion of the second surface, the at least one heat transport device may comprise at least one internal passage and at least one duct; and a heat transport media flowing within the at least one internal passage and at least one duct. Related methods and additional arrangements are also described.

Abstract: Arrangements may include a concentrator constructed and arranged to receive incident electromagnetic energy and to concentrate the incident electromagnetic energy to a greater intensity level; an electromagnetic receiving device comprising a first surface constructed and arranged to receive the concentrated electromagnetic energy, and a second surface opposite the first surface; a heat transport device comprising at least one duct and a first surface; and a thermal interface layer physically connected to at least a portion of the second surface of the electromagnetic energy receiving device and the first surface of the heat transport device, the thermal interface material being both electrically and thermally conductive. Related methods and additional arrangements are also described.

Abstract: Arrangements may include a concentrator constructed and arranged to receive incident electromagnetic energy and to concentrate the incident electromagnetic energy to a greater intensity level; an electromagnetic receiving device comprising a first surface constructed and arranged to receive the concentrated electromagnetic energy, and a second surface opposite the first surface; a heat transport device comprising at least one duct and a first surface; and a thermal interface layer physically connected to at least a portion of the second surface of the electromagnetic energy receiving device and the first surface of the heat transport device, the thermal interface material being both electrically and thermally conductive. Related methods and additional arrangements are also described.

Abstract: An arrangement includes a solar energy receiving device and at least one component in thermal communication with the solar energy receiving device, the at least one component formed from a composite material, the composite material may comprise a matrix of carbon-based fibers, the carbon-based fibers comprising one or more of: mesophase carbon, carbon nanotubes, graphite, graphene and pan carbon. According to a further optional aspect, there is provided a solar energy receiving device comprising a first surface for receiving solar energy incident thereon, and a second opposing surface, the second surface being electrically conductive; at least one heat transport device in direct contact with at least a portion of the second surface, the at least one heat transport device may comprise at least one internal passage and at least one duct; and a heat transport media flowing within the at least one internal passage and at least one duct. Related methods and additional arrangements are also described.

Abstract: A system for removing heat from an encased electronic device. The system includes a thermal ground, conduction pathways thermally coupling heat-producing elements of the device to the thermal ground so that the thermal ground receives heat produced by the heat-producing elements, and a heat dissipation element thermally coupled to the thermal ground and configured to transfer heat from the thermal ground to an environment outside the device. The conduction pathways and heat dissipation element provide a capacity to remove heat from the encased electronic device such that heat removal by convection from the heat-producing elements is not required.