Abstract: To fabricate high aspect ratio metal structures, a two-layer structure is provided on a conductive layer. The two-layer structure includes a first layer adjacent the conductive layer and a second layer adjacent the first layer where the second layer is etchable by a Deep Reactive Ion Etching (DRIE) process. Using the DRIE process, at least one selected region of the second layer is completely etched away with the selected region being at least partially aligned with a region of the conductive layer such that the first layer is then exposed thereover. The first layer so-exposed is then removed to expose the region of the conductive layer thereunder. Metal is electroplated onto the exposed conductive layer and any remaining portions of the two-layer structure are then removed.

Abstract: A thin, flexible microelectronic assembly using thinned die (5-10 microns and lower) produced by growing a 1 ?m-10 ?m silicon epitaxial (Epi) layer on an oxidized silicon carrier. The integrated circuit process takes place in the standard manner in the Epi layer. The oxide layer and the silicon carrier serve as the backside handle. Once processed, the wafer can be bumped and singulated just like a normal chip without the need for the extra handle attachment processes or the backside thinning operation. Once the integrated circuits are flipped and solder reflowed to a substrate, the handle can be removed by etching the oxide. In one assembly embodiment, wells are etched in the flexible circuit board material to allow the interconnect to be recessed below the circuit board surface. An adhesive can then be placed on the board surface, locking the die to the flexible substrate. Alternatively, a nanowire interposer can be sandwiched between a bumped multilayer substrate and a bumped thin die.

Abstract: Inductor topologies for filters used in broadband applications are described. In one implementation, an apparatus, such as an interface module includes a printed circuit board and a filter. The filter includes a generally circular high Quality factor (Q) value spiral planar inductor etched directly into the printed circuit board. The generally circular high Q value spiral planar inductor is configured to operate in a broadband application. Other implementations involve the use of decoupling structures with respect to the planar inductors as well as a design methodology for the filters.

Abstract: Increasing performance of planar inductors used in broadband applications is described. In one implementation, an apparatus includes a high Quality factor (Q) value spiral planar inductor etched directly into a printed circuit board. A ferrite structure is attached to the printed circuit board and located in proximity to the high Q value spiral planar inductor. The ferrite structure increases the Q of spiral planar inductors, but without the inconvenience and expense of a wire wound terroidal inductors. Various shaped ferrite structures may be used in conjuction with the spiral planar inductors. Additionally, in certain implementations, the ferrite structures are configured to rotate about axis permitting the inductors to be tuned, even after components have been installed on a printed circuit board.

Abstract: A cable television diplexer and telephony module that can be employed in CATV data transmission systems to enhance performance levels and reduce manufacturing costs. The cable television diplexer and telephony module includes a printed circuit board substrate, and a diplexer having a low pass filter section and a high pass filter section, each of which has components mounted on the substrate. The respective low pass and high pass filter sections of the diplexer include one or more high Q value planar spiral inductors. Each spiral inductor includes a narrow track of metal disposed on the substrate and wound around a center to form a circular spiral curve having a plurality of turns. The spiral inductor may be fabricated on the substrate of the cable television diplexer and telephony module, or on a separate substrate, using a standard PCB fabrication process.

Abstract: Increasing performance of planar inductors used in broadband applications is described. In one implementation, an apparatus includes a high Quality factor (Q) value spiral planar inductor etched directly into a printed circuit board. A ferrite structure is attached to the printed circuit board and located in proximity to the high Q value spiral planar inductor. The ferrite structure increases the Q of spiral planar inductors, but without the inconvenience and expense of a wire wound terroidal inductors. Various shaped ferrite structures may be used in conjuction with the spiral planar inductors. Additionally, in certain implementations, the ferrite structures are configured to rotate about axis permitting the inductors to be tuned, even after components have been installed on a printed circuit board.

Abstract: Inductor topologies for filters used in broadband applications are described. In one implementation, an apparatus, such as an interface module includes a printed circuit board and a filter. The filter includes a generally circular high Quality factor (Q) value spiral planar inductor etched directly into the printed circuit board. The generally circular high Q value spiral planar inductor is configured to operate in a broadband application. Other implementations involve the use of decoupling structures with respect to the planar inductors as well as a design methodology for the filters.

Abstract: A cable television diplexer and telephony module that can be employed in CATV data transmission systems to enhance performance levels and reduce manufacturing costs. The cable television diplexer and telephony module includes a printed circuit board substrate, and a diplexer having a low pass filter section and a high pass filter section, each of which has components mounted on the substrate. The respective low pass and high pass filter sections of the diplexer include one or more high Q value planar spiral inductors. Each spiral inductor includes a narrow track of metal disposed on the substrate and wound around a center to form a circular spiral curve having a plurality of turns. The spiral inductor may be fabricated on the substrate of the cable television diplexer and telephony module, or on a separate substrate, using a standard PCB fabrication process.