Abstract: A chip-on-film (COF) package and method for image sensor has been disclosed. According to the method a COF film with opening is provided. The COF film has an upper surface, a lower surface and at least an opening. An image sensing chip is flip-chip mounted on the upper surface of the COF film. A transparent glass is bonded to the lower surface of the COF film. The opening is clipped by the transparent glass and the image sensing chip to form a hermetic space. The active surface of the image sensing chip includes an image sensing region toward the transparent glass through the opening and is sealed in the hermetic space by a limited filling material in order to prevent the image sensing region of the image sensing chip from contamination by means of COF tape packaging method.

Abstract: A thin type camera module includes a fixing board, an imaging-sensing semiconductor assembly, and a lens holder. The image-sensing semiconductor assembly is manufacture by a chip-on-film (COF) packaging method. The image-sensing semiconductor assembly comprises an image sensing chip and a COF wiring film, wherein the image sensing chip is flip-chip mounted on the COF wiring film. A photosensitive surface of the image sensing chip is corresponding to a window of the COF wiring film and disposed toward a light-pervious channel of the lens holder. The lens holder is connected with the fixing board to form an airtight space for sealing the image sensing chip. The COF wiring film has a module circuit for mounting an electrical device.