Abstract: A semiconductor product includes a die and leadframe included in a package made of plastic or other insulating material. The die and leadframe are dimensioned so that they overlap in at least one location. One or more pillar bumps, formed from as a cylindrical conductive base topped with a solder bump are used to interconnect the leadframe and die in the region of overlap. The pillar bumps perform several purposes including: electrical connection between the leadframe and die, support for the die during packaging and conduction of heat away from the die.

Abstract: Efficient utilization of space in a laterally-conducting semiconductor device package is enhanced by creating at least one supplemental downbond pad portion of the diepad for receiving the downbond wire from the ground contact of the device. The supplemental diepad portion may occupy area at the end or side of the package formerly occupied by non-integral leads. By receiving the substrate downbond wire, the supplemental diepad portion allows a greater area of the main diepad to be occupied by a die having a larger area, thereby enhancing space efficiency of the package.