Abstract: A system is provided for selectively attaching or detaching a land grid array component to a surface of circuit board where the attachment is a grid array of solid conductive solder beads or balls. A chamber contains an inert liquid, and a heater heats the inert liquid to a temperature above the melting temperature of the solder beads. A fluid level adjustment means adjusts the level of the inert liquid in the chamber between a first level below the component and a second level above the component. A first mounting means supports the circuit board above the component, and a second mounting means is positioned at least partially in the container to support the component below the circuit board and to bias the component against the circuit board. An component/board assembly is positioned in the system. The beads are uniformly melted by raising the level of the inert liquid in the chamber to above the component to permit removal of the board.