Abstract: Disclosed is a sealing composition for treating a metal substrate comprising: a polyolefin component; and a colloidal layered silicate. Also disclosed is a system for treating a metal substrate comprising: a cleaner composition; and/or a pretreatment composition for treating at least a portion of the substrate, the pretreatment composition comprising a Group IVB metal; and a sealing composition for treating at least a portion of the substrate treated with the cleaner composition and/or the pretreated composition, the sealing composition comprising a polyolefin component. Also disclosed is a method of treating a substrate comprising contacting at least a portion of a surface of the substrate with any of the compositions disclosed herein or any of the systems disclosed herein.

Abstract: An electrical plug having an extraction component that may be collapsed to decrease the profile of the plug and may be retracted to increase the profile of the plug. Increasing the profile of the plug increases the graspable area of the plug, making it easier to extract the plug from an outlet socket. The extraction component may be a slidable cover substantially surrounding a housing holding the pins and wiring of the plug within an overmold. The extraction component may also be a slidable cap connected to a pin bridge surrounded by an overmold. Openings formed within the pin bridge include a stopper that limits the retraction of the extraction component. The extraction components include a number of snap-fit pins that are each inserted into the openings beyond the stoppers, at which point the snap-fit ends of the pins expand and hold pins within the openings.

Abstract: Embodiments of the invention are related to a keypad and an electronic device having a keypad. In one embodiment a keypad comprises a plurality of keys. Each of the plurality of keys comprises one main electrode and at least one signal electrode is being adapted to connect electrically the main electrode and the at least one signal electrode when said key is pressed. The main electrode is connected to a reference potential connection of the keypad and surrounds the at least one signal electrode of said key.

Abstract: Embodiments of the invention are related to a keypad and an electronic device having a keypad. In one embodiment a keypad comprises a plurality of keys. Each of the plurality of keys comprises one main electrode and at least one signal electrode is being adapted to connect electrically the main electrode and the at least one signal electrode when said key is pressed. The main electrode is connected to a reference potential connection of the keypad and surrounds the at least one signal electrode of said key.

Abstract: A routing pattern for high speed signals for a package substrate. Electrically conductive bond fingers are disposed on a first surface of the package substrate. The first surface is adapted to receive an integrated circuit in an attachment zone, and the bond fingers are disposed in at least two substantially concentric rings around the attachment zone. The bond fingers of the innermost ring of bond fingers are all routed to electrically conductive first traces disposed on a first layer of the package substrate. The bond fingers other that those on the innermost ring of bond fingers are all routed to electrically conductive second traces disposed on a separate second layer of the package substrate. The package substrate has electrically conductive traces on only the first layer and the second layer. Electrically conductive contacts are disposed on a substantially opposing second surface.

Abstract: An apparatus and method for detecting the closure of one of several switches using a single input line of a detector is disclosed. The input line is also used to carry an audio-frequency signal when a recording switch is closed. The switches are connected to a network of resistors that cooperate with a pull-up resistor to form a voltage divider. The pull-up resistor is connected to the input line. The switches are closed to selectively switch resistors in the network out of the voltage divider to change the voltage on the input line. A detector reads the voltage on the input line and compares it with a set of predetermined values to determine which switch is closed. If a recording switch is closed, a microphone connected to the network of resistors converts sound to an audio-frequency signal onto the input line.

Abstract: A clock synchronization circuit for generating an output clock signal that is in synchronization with a reference clock signal and a method embodying the principle of operation of the circuit are disclosed. The circuit has a programmable delay element and a phase detector. Synchronization is reached when the phase difference between the two clock signals is less than a predetermined value. The programmable delay element is coupled to the reference clock signal for introducing an adjustable delay in the reference clock signal to produce the output clock signal. By increasing the adjustable delay, the output clock signal becomes increasingly closer to being in synchronization with the reference clock signal. The phase detector is coupled to the reference clock signal and the output clock signal for detecting the phase difference between the two clock signals. The adjustable delay is increased until synchronization is obtained.

Abstract: An integrated circuit package includes a connector board and plural levels of individual conductors and conductive vias disposed through the connector board to form electrical connections between external connection pads on an undersurface of the connector board and finger connections on the upper surface of the connector board. An integrated circuit die is mounted in a central region of the connector board within confines of the individual conductors that are arranged about the die, and wire bond connections are formed between selected ones of the finger connections, the individual conductors, and the connection pads on the integrated circuit die to provide distributed connections for ground and power at one or more operating voltage levels on the individual conductors.

Abstract: A package for an integrated circuit is disclosed. The package comprises two layers (a top layer and a bottom layer) of flexible tape, each of which has a top surface and a bottom surface, with metal traces on the top surface. A die is mounted on top of the two layers and wire bonds connect bond pads on the die to metal traces on each of the two flexible tapes. The metal traces are routed along the top surfaces of the flexible tapes and are coupled to solder balls through holes in the tapes. These solder balls are mounted along the bottom of the package and serve as the electrical interface to a printed circuit board. Additional holes in the bottom layer tape allow solder balls to extend through the bottom layer tape so that they may be electrically coupled to traces on the top layer tape.