Patents by Inventor Allen Norman Boldt
Allen Norman Boldt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11771296Abstract: A cleaning device includes a porous body and a dispensing reservoir disposed within the porous body. The dispensing reservoir has at least one opening being disposed at a predetermined location along a length of the dispensing reservoir such that a rate at which the solution flows into the porous body varies based specific orientations of the porous body. A perforated fluid supply conduit is also disposed within the porous body and extends alongside the dispensing reservoir, the perforated fluid conduit having a plurality of perforations. The dispensing reservoir and the perforated fluid supply conduit are not directly fluidly coupled.Type: GrantFiled: July 11, 2022Date of Patent: October 3, 2023Inventor: Allen Norman Boldt
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Patent number: 10734256Abstract: A heater system is provided that includes a base functional layer having at least one functional zone. A substrate is secured to the functional member, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer provides lower power than the base functional layer. A component is secured to the tuning layer opposite the substrate, and the substrate defines a thermal conductivity to absorb and dissipate a requisite amount of power from the base functional layer. A control system is also provided that has a plurality of addressable control elements in electrical communication with power lines and with the tuning layer, the control elements providing selective control of the tuning layer zones.Type: GrantFiled: January 7, 2016Date of Patent: August 4, 2020Assignee: Watlow Electric Manufacturing CompanyInventors: Kevin Ptasienski, Kevin Robert Smith, Cal Thomas Swanson, Philip Steven Schmidt, Mohammad Nosrati, Jacob Lindley, Allen Norman Boldt, Sanhong Zhang, Louis P. Steinhauser, Dennis Stanley Grimard
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Patent number: 10049903Abstract: Methods of manufacturing a heater are provided that generally include forming a laminate having a dielectric layer, a first double-sided adhesive dielectric layer, and a conductive layer. Next, a circuit pattern is created into the conductive layer, and then the circuit pattern is covered with a second double-sided adhesive dielectric layer. The second double-sided adhesive dielectric layer is covered with a sacrificial layer, and then the heater is formed, the heater comprising the dielectric layer, the first double-sided adhesive dielectric layer, the conductive layer, and the second double-sided adhesive dielectric layer. Subsequently, the sacrificial layer is removed.Type: GrantFiled: August 30, 2012Date of Patent: August 14, 2018Assignee: Watlow Electric Manufacturing CompanyInventors: Kevin Ptasienski, Allen Norman Boldt, Janet Lea Smith, Cal Thomas Swanson, Mohammad Nosrati, Kevin Robert Smith
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Patent number: 10043685Abstract: An apparatus is provided, by way of example, a heater for use in semiconductor processing equipment, that includes a base functional layer having at least one functional zone. A substrate is secured to the base functional layer, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer has lower power than the base functional layer. Further, a component, such as a chuck by way of example, is secured to the tuning layer opposite the substrate. The substrate defines a thermal conductivity to dissipate a requisite amount of power from the base functional layer.Type: GrantFiled: January 7, 2016Date of Patent: August 7, 2018Assignee: Watlow Electric Manufacturing CompanyInventors: Kevin Ptasienski, Kevin Robert Smith, Cal Thomas Swanson, Philip Steven Schmidt, Mohammad Nosrati, Jacob Lindley, Allen Norman Boldt, Sanhong Zhang, Louis P. Steinhauser, Dennis Stanley Grimard
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Publication number: 20180197757Abstract: A method of manufacturing a heater includes forming a first laminate having a first double-sided adhesive dielectric layer, a sacrificial layer, and a conductive layer. The first double sided adhesive layer is disposed between the sacrificial layer and the conductive layer. Next, a circuit pattern is created into the conductive layer, followed by covering the circuit pattern with a second double-sided adhesive dielectric layer. Thereafter, the second double-sided adhesive dielectric layer is covered with a dielectric layer to form a second laminate. Finally, the sacrificial layer is completely removed to form the heater comprising the first double-sided adhesive dielectric layer, the circuit pattern, the second double-sided adhesive layer, and the dielectric layer.Type: ApplicationFiled: March 2, 2018Publication date: July 12, 2018Applicant: Watlow Electric Manufacturing CompanyInventors: Kevin PTASIENSKI, Allen Norman BOLDT, Janet Lea SMITH, Cal Thomas SWANSON, Mohammad NOSRATI, Kevin Robert SMITH
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Patent number: 9553006Abstract: An apparatus, such as a heater, is provided that includes a base member having at least one fluid passageway. A two-phase fluid is disposed within the fluid passageway, a pressure of the two-phase fluid being controlled such that the two-phase fluid provides at least one of heating and cooling to the base member. A tuning layer is secured to the base member, and the tuning layer includes a plurality of zones. Furthermore, a component, such as a chuck by way of example, is secured to the tuning layer.Type: GrantFiled: August 30, 2012Date of Patent: January 24, 2017Assignee: WATLOW ELECTRIC MANUFACTURING COMPANYInventors: Kevin Ptasienski, Kevin Robert Smith, Cal Thomas Swanson, Philip Steven Schmidt, Mohammad Nosrati, Jacob Robert Lindley, Allen Norman Boldt, Sanhong Zhang, Louis P. Steinhauser, Dennis Stanley Grimard
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Publication number: 20160118276Abstract: An apparatus is provided, by way of example, a heater for use in semiconductor processing equipment, that includes a base functional layer having at least one functional zone. A substrate is secured to the base functional layer, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer has lower power than the base functional layer. Further, a component, such as a chuck by way of example, is secured to the tuning layer opposite the substrate. The substrate defines a thermal conductivity to dissipate a requisite amount of power from the base functional layer.Type: ApplicationFiled: January 7, 2016Publication date: April 28, 2016Applicant: Watlow Electric Manufacturing CompanyInventors: Kevin Ptasienski, Kevin Robert Smith, Cal Thomas Swanson, Philip Steven Schmidt, Mohammad Nosrati, Jacob Lindley, Allen Norman Boldt, Sanhong Zhang, Louis P. Steinhauser, Dennis Stanley Grimard
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Publication number: 20160118277Abstract: A heater system is provided that includes a base functional layer having at least one functional zone. A substrate is secured to the functional member, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer provides lower power than the base functional layer. A component is secured to the tuning layer opposite the substrate, and the substrate defines a thermal conductivity to absorb and dissipate a requisite amount of power from the base functional layer. A control system is also provided that has a plurality of addressable control elements in electrical communication with power lines and with the tuning layer, the control elements providing selective control of the tuning layer zones.Type: ApplicationFiled: January 7, 2016Publication date: April 28, 2016Applicant: Watlow Electric Manufacturing CompanyInventors: Kevin Ptasienski, Kevin Robert Smith, Cal Thomas Swanson, Philip Steven Schmidt, Mohammad Nosrati, Jacob Lindley, Allen Norman Boldt, Sanhong Zhang, Louis P. Steinhauser, Dennis Stanley Grimard
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Patent number: 9263305Abstract: An apparatus is provided, by way of example, a heater for use in semiconductor processing equipment that includes a base functional layer having at least one functional zone. A substrate is secured to the base functional layer, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer has lower power than the base functional layer. Further, a component, such as a chuck by way of example, is secured to the tuning layer opposite the substrate. The substrate defines a thermal conductivity to dissipate a requisite amount of power from the base functional layer.Type: GrantFiled: August 30, 2012Date of Patent: February 16, 2016Assignee: Watlow Electric Manufacturing CompanyInventors: Kevin Ptasienski, Kevin Robert Smith, Cal Thomas Swanson, Philip Steven Schmidt, Mohammad Nosrati, Jacob Robert Lindley, Allen Norman Boldt, Sanhong Zhang, Louis P. Steinhauser, Dennis Stanley Grimard
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Publication number: 20130228548Abstract: Methods of manufacturing a heater are provided that generally include forming a laminate having a dielectric layer, a first double-sided adhesive dielectric layer, and a conductive layer. Next, a circuit pattern is created into the conductive layer, and then the circuit pattern is covered with a second double-sided adhesive dielectric layer. The second double-sided adhesive dielectric layer is covered with a sacrificial layer, and then the heater is formed, the heater comprising the dielectric layer, the first double-sided adhesive dielectric layer, the conductive layer, and the second double-sided adhesive dielectric layer. Subsequently, the sacrificial layer is removed.Type: ApplicationFiled: August 30, 2012Publication date: September 5, 2013Applicant: WATLOW ELECTRIC MANUFACTURING COMPANYInventors: Kevin Ptasienski, Allen Norman Boldt, Janet Lea Smith, Cal Thomas Swanson, Mohammad Nosrati, Kevin Robert Smith
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Publication number: 20130220575Abstract: An apparatus, such as a heater, is provided that includes a base member having at least one fluid passageway. A two-phase fluid is disposed within the fluid passageway, a pressure of the two-phase fluid being controlled such that the two-phase fluid provides at least one of heating and cooling to the base member. A tuning layer is secured to the base member, and the tuning layer includes a plurality of zones. Furthermore, a component, such as a chuck by way of example, is secured to the tuning layer.Type: ApplicationFiled: August 30, 2012Publication date: August 29, 2013Applicant: WALTOW ELECTRIC MANUFACTURING COMPANYInventors: Kevin Ptasienski, Kevin Robert SMITH, Cal Thomas Swanson, Philip Steven Schmidt, Mohammad Nosrati, Jacob Robert Lindley, Allen Norman Boldt, Sanhong Zhang, Louis P. Steinhauser, Dennis Stanley Grimard
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Publication number: 20130161305Abstract: An apparatus is provided, by way of example, a heater for use in semiconductor processing equipment that includes a base functional layer having at least one functional zone. A substrate is secured to the base functional layer, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer has lower power than the base functional layer. Further, a component, such as a chuck by way of example, is secured to the tuning layer opposite the substrate. The substrate defines a thermal conductivity to dissipate a requisite amount of power from the base functional layer.Type: ApplicationFiled: August 30, 2012Publication date: June 27, 2013Applicant: WATLOW ELECTRIC MANUFACTURING COMPANYInventors: Kevin PTASIENSKI, Kevin Robert Smith, Cal Thomas Swanson, Philip Steven Schmidt, Mohammad Nosrati, Jacob Lindley, Allen Norman Boldt, Sanhong Zhang, Louis P. Steinhauser, Dennis Stanley Grimard