Abstract: The present invention is a process for converting a phosphonate to a hydroxyalkyl phosphonic acid comprising the step of contacting together water, the phosphonate, and a sulfonated or phosphonated heterogeneous catalyst under conditions sufficient to convert at least 50% of the phosphonate to the hydroxyalkyl phosphonic acid. The process of the present invention provides a way of preparing hydroxyalkyl phosphonic acids safely and economically, without corrosive effects.

Abstract: A method of polishing a sapphire substrate is provided, comprising: providing a substrate having an exposed sapphire surface; providing a chemical mechanical polishing slurry, wherein the chemical mechanical polishing slurry comprises, as initial components: colloidal silica abrasive, wherein the colloidal silica abrasive has a negative surface charge; and, wherein the colloidal silica abrasive exhibits a multimodal particle size distribution with a first particle size maximum between 2 and 25 nm; and, a second particle size maximum between 75 and 200 nm; optionally, a biocide; optionally, a nonionic defoaming agent; and, optionally, a pH adjuster. A chemical mechanical polishing composition for polishing an exposed sapphire surface is also provided.

Abstract: A cyclic carbonate monomer including the reaction product of (a) a divinylarene dioxide, and (b) carbon dioxide; a process for making the cyclic carbonate monomer; and a polymer such as a poly(hydroxyurethane) composition made therefrom. The poly(hydroxyurethane) composition made from the above cyclic carbonate monomer forms a reactive intermediate that can be used for making, for example, a poly(hydroxyurethane) foam product.

Abstract: The present invention is a process for converting a phosphonate to a hydroxyalkyl phosphonic acid comprising the step of contacting together water, the phosphonate, and a sulfonated or phosphonated heterogeneous catalyst under conditions sufficient to convert at least 50% of the phosphonate to the hydroxyalkyl phosphonic acid. The process of the present invention provides a way of preparing hydroxyalkyl phosphonic acids safely and economically, without corrosive effects.

Abstract: A method of polishing a sapphire substrate is provided, comprising: providing a substrate having an exposed sapphire surface; providing a chemical mechanical polishing slurry, wherein the chemical mechanical polishing slurry comprises, as initial components: colloidal silica abrasive, wherein the colloidal silica abrasive has a negative surface charge; and, wherein the colloidal silica abrasive exhibits a multimodal particle size distribution with a first particle size maximum between 2 and 25 nm; and, a second particle size maximum between 75 and 200 nm; optionally, a biocide; optionally, a nonionic defoaming agent; and, optionally, a pH adjuster. A chemical mechanical polishing composition for polishing an exposed sapphire surface is also provided.

Abstract: A cyclic carbonate monomer including the reaction product of (a) a divinylarene dioxide, and (b) carbon dioxide; a process for making the cyclic carbonate monomer; and a polymer such as a poly(hydroxyurethane) composition made therefrom. The poly(hydroxyurethane) composition made from the above cyclic carbonate monomer forms a reactive intermediate that can be used for making, for example, a poly(hydroxyurethane) foam product.

Abstract: A curable liquid polysiloxane/TiO2 composite for use as a light emitting diode encapsulant is provided, comprising: a polysiloxane with TiO2 domains having an average domain size of less than 5 nm, wherein the curable liquid polysiloxane/TiO2 composite contains 20 to 60 mol % TiO2 (based on total solids); wherein the curable liquid polysiloxane/TiO2 composite exhibits a refractive index of >1.61 to 1.7 and wherein the curable liquid polysiloxane/TiO2 composite is a liquid at room temperature and atmospheric pressure. Also provided is a light emitting diode manufacturing assembly.

Abstract: A method of making a light emitting diode (LED) having an optical element is provided, comprising: providing a curable liquid polysiloxane/TiO2 composite, which exhibits a refractive index of >1.61 to 1.7 and which is a liquid at room temperature and atmospheric pressure; providing a semiconductor light emitting diode die having a face, wherein the semiconductor light emitting diode die emits light through the face; contacting the semiconductor light emitting diode die with the curable liquid polysiloxane/TiO2 composite; and, curing the curable liquid polysiloxane/TiO2 composite to form an optical element; wherein at least a portion of the optical element is adjacent to the face.

Abstract: A curable liquid polysiloxane/TiO2 composite for use as a light emitting diode encapsulant is provided, comprising: a polysiloxane with TiO2 domains having an average domain size of less than 5 nm, wherein the curable liquid polysiloxane/TiO2 composite contains 20 to 60 mol % TiO2 (based on total solids); wherein the curable liquid polysiloxane/TiO2 composite exhibits a refractive index of >1.61 to 1.7 and wherein the curable liquid polysiloxane/TiO2 composite is a liquid at room temperature and atmospheric pressure. Also provided is a light emitting diode manufacturing assembly.

Abstract: A method of making a light emitting diode (LED) having an optical element is provided, comprising: providing a curable liquid polysiloxane/TiO2 composite, which exhibits a refractive index of >1.61 to 1.7 and which is a liquid at room temperature and atmospheric pressure; providing a semiconductor light emitting diode die having a face, wherein the semiconductor light emitting diode die emits light through the face; contacting the semiconductor light emitting diode die with the curable liquid polysiloxane/TiO2 composite; and, curing the curable liquid polysiloxane/TiO2 composite to form an optical element; wherein at least a portion of the optical element is adjacent to the face.