Patents by Inventor Alline Myers

Alline Myers has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of using an adhesion precursor layer for chemical vapor deposition (CVD) copper deposition
    Publication number: 20050085073
    Abstract: An exemplary embodiment is related to a method of using an adhesion precursor in an integrated circuit fabrication process. The method includes providing a gas of material over a dielectric material and providing a copper layer over an adhesion precursor layer. The adhesion precursor layer is formed by the gas, and the dielectric material includes an aperture.
    Type: Application
    Filed: October 16, 2003
    Publication date: April 21, 2005
    Inventors: Sergey Lopatin, Paul Besser, Alline Myers, Jeremias Romero, Minh Tran, Lu You, Connie Wang