Patents by Inventor Allison Yao

Allison Yao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular capacitor subassembly for backup power
    Patent number: 12207409
    Abstract: An embodiment of an electronic system comprises a main board, and a modular capacitor subassembly mechanically and electrically coupled to the main board, wherein the modular capacitor subassembly provides backup power for the main board, and wherein the main board is adapted for use in at least two housing form factors. Other embodiments are disclosed and claimed.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: January 21, 2025
    Assignee: Intel Corporation
    Inventors: John Hung, Andrew Morning-Smith, Kai-Uwe Schmidt, Nan Allison Yao
  • SUBSTRATE STRESS UNIFORMITY MANAGEMENT BASED ON OVERLAY ERROR MEASUREMENTS
    Publication number: 20240427979
    Abstract: A method includes obtaining, by a processing device, first data indicative of overlay error of a substrate. The method further includes generating second data indicative of first stress uniformity of the substrate based on the first data. The method further includes performing a corrective action based on the second data.
    Type: Application
    Filed: June 24, 2024
    Publication date: December 26, 2024
    Inventors: Zhiling Dun, Allison Yao, Jingmin Leng, Xinhai Han, Deenesh Padhi
  • TRIANGULAR BOARD ASSEMBLY FOR SOLID STATE DRIVE
    Publication number: 20210120672
    Abstract: An embodiment of an electronic apparatus comprises a main board, a wing board electrically coupled to the main board by a flexible connector along an edge of the main board, wherein the wing board is arranged at an angle that is non-parallel with respect to the main board. Other embodiments are disclosed and claimed.
    Type: Application
    Filed: December 24, 2020
    Publication date: April 22, 2021
    Applicant: Intel Corporation
    Inventors: John Hung, Andrew Morning-Smith, Kai-Uwe Schmidt, Paul Gwin, Nan Allison Yao
  • MODULAR CAPACITOR SUBASSEMBLY FOR BACKUP POWER
    Publication number: 20210045247
    Abstract: An embodiment of an electronic system comprises a main board, and a modular capacitor subassembly mechanically and electrically coupled to the main board, wherein the modular capacitor subassembly provides backup power for the main board, and wherein the main board is adapted for use in at least two housing form factors. Other embodiments are disclosed and claimed.
    Type: Application
    Filed: October 27, 2020
    Publication date: February 11, 2021
    Applicant: Intel Corporation
    Inventors: John Hung, Andrew Morning-Smith, Kai-Uwe Schmidt, Nan Allison Yao