Patents by Inventor Almanzo T. ORTIZ

Almanzo T. ORTIZ has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MULTI-CHIP SELF ADJUSTING COOLING SOLUTION
    Publication number: 20190067158
    Abstract: An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.
    Type: Application
    Filed: October 30, 2018
    Publication date: February 28, 2019
    Inventors: Jeffory L. SMALLEY, Susan F. SMITH, Mani PRAKASH, Tao LIU, Henry C. BOSAK, Harvey R. KOFSTAD, Almanzo T. ORTIZ
  • Multi-chip self adjusting cooling solution
    Patent number: 10141241
    Abstract: An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.
    Type: Grant
    Filed: September 27, 2014
    Date of Patent: November 27, 2018
    Assignee: Intel Corporation
    Inventors: Jeffory L. Smalley, Susan F. Smith, Mani Prakash, Tao Liu, Henry C. Bosak, Harvey R. Kofstad, Almanzo T. Ortiz
  • MULTI-CHIP SELF ADJUSTING COOLING SOLUTION
    Publication number: 20160276243
    Abstract: An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.
    Type: Application
    Filed: September 27, 2014
    Publication date: September 22, 2016
    Inventors: Jeffory L. SMALLEY, Susan F. SMITH, Mani PRAKASH, Tao LIU, Henry C. BOSAK, Almanzo T. ORTIZ