Abstract: A filter structure having a plurality of pores through the structure each of the pores having a cross section with a length (L) and a width (W) wherein the dimension of L is greater than the dimension of W. The filter can be used with an improved ink jet printhead having an ink inlet in one of its surfaces, a plurality of nozzles, individual channels connecting the nozzles to an internal ink supplying manifold, the manifold being supplied ink through the ink inlet, and selectively addressable heating elements for expelling ink droplets, the improved ink jet printhead comprising a substantially flat filter having predetermined dimensions and being bonded to the printhead containing the ink inlet, the filter having a plurality of pores, therethrough, each of the pores having a cross section with a length=L and a width=W, wherein the dimension of L is greater than the dimension of W.

Abstract: A method of forming a semiconductor structure from a first wafer and a second wafer. A pit or groove is formed in a lower surface of the first wafer. The lower surface of the first wafer is bonded to an upper surface of the second wafer. A groove is then formed on an upper surface of the first wafer, such that an opening is formed in the first wafer that exposes at least one alignment reference target on the upper surface of the second wafer. The bonded first wafer and second wafer is then diced using the exposed at least one alignment reference target to form a semiconductor structure.

Abstract: A method of forming a semiconductor structure from a first wafer and a second wafer. A pit or groove is formed in a lower surface of the first wafer. The lower surface of the first wafer is bonded to an upper surface of the second wafer. A groove is then formed on an upper surface of the first wafer, such that an opening is formed in the first wafer that exposes at least one alignment reference target on the upper surface of the second wafer. The bonded first wafer and second wafer is then diced using the exposed at least one alignment reference target to form a semiconductor structure.

Abstract: A filter structure having a plurality of pores through the structure each of the pores having a cross section with a length (L) and a width (W) wherein the dimension of L is greater than the dimension of W. The filter can be used with an improved ink jet printhead having an ink inlet in one of its surfaces, a plurality of nozzles, individual channels connecting the nozzles to an internal ink supplying manifold, the manifold being supplied ink through the ink inlet, and selectively addressable heating elements for expelling ink droplets, the improved ink jet printhead comprising a substantially flat filter having predetermined dimensions and being bonded to the printhead containing the ink inlet, the filter having a plurality of pores, therethrough, each of the pores having a cross section with a length=L and a width=W, wherein the dimension of L is greater than the dimension of W.

Abstract: A method of fabricating a printhead for use in an ink jet printing device which includes providing a substrate having at least one substantially planar surface. An array of heating elements are formed on the surface of the substrate and addressed with a current pulse from an electrode. Depositing an insulating layer over the surface. Next, the insulating layer is mechanically or chemically treated to expose the heating elements. An ink channel plate is formed and includes at least one ink reservoir and one ink channel. A key or keyway is formed on channel plate and a corresponding key or keyway is formed on the insulating layer. The said channel plate is then adhesively secured to the substrate using the key and keyway as an alignment aid to achieve proper positioning of the ink channels and the heating elements.

Abstract: Disclosed is an ink jet printhead which comprises (i) an upper substrate with a set of parallel grooves for subsequent use as ink channels and a recess for subsequent use as a manifold, the grooves being open at one end for serving as droplet emitting nozzles, and (ii) a lower substrate in which one surface thereof has an array of heating elements and addressing electrodes formed thereon, said lower substrate having an insulative layer deposited on the surface thereof and over the heating elements and addressing electrodes and patterned to form recesses therethrough to expose the heating elements and terminal ends of the addressing electrodes, the upper and lower substrates being aligned, mated, and bonded together to form the printhead with the grooves in the upper substrate being aligned with the heating elements in the lower substrate to form droplet emitting nozzles, said upper substrate comprising a material formed by crosslinking or chain extending a polymer of formula I or II.

Abstract: An efficient fluid filtering device is provided for filtering unwanted contaminants from flowing fluid, such as ink flowing into an ink jet printhead. The efficient fluid filtering device includes a generally flat member having a first side and a second side, and a series of fluid flow holes formed through the flat member from the first side to the second side. Importantly, the efficient fluid filtering device also has a series of pillar members, including pillar members defining a trough portion around each fluid flow hole. The pillar members and the trough portions are arranged around each hole so as to efficiently prevent bubbles and contaminants in flowing fluid from impeding fluid flow from the first side through to the second side.

Abstract: An ink jet printhead is disclosed which has a heater plate containing the heating elements and driving circuitry means monolithographically formed on one surface thereof and the ink flow directing channel structure is formed on the heater plate using a layer of patternable material, so that all critical alignments are done directly on the heater plate. In one embodiment, the patternable material is a photosensitive polymer which is exposed using a mask to define the channel and reservoir pattern, which is then developed and cured. After curing, the patterned channel structure is polished to provide a smooth coplanar surface and a cover plate with an aperture therein is aligned with a loose tolerance to the channel structure and bonded thereto to complete the printhead. The aperture serves as both ink inlet and a portion of the ink reservoir. The channels are open at one end and serve as the droplet ejecting nozzles, while the other ends are connected to the reservoir.

Abstract: A nozzle plate for ink jet cartridges which are manufactured from a relatively thin film of material, such as, for example, polyimide, polyarylene ether, or composite of a number of materials deposited on a rigid substrate, such as a silicon wafer, and photolithographically processed from the rigid substrate to produce a large quantity of interconnected nozzle plates which may be removed as a sheet of interconnected nozzle plates for ease of handling. The nozzle plates are aligned and bonded to the nozzle bearing front faces of the cartridges.

Abstract: An ink jet printhead has improved resistance to the corrosive effects of ink by coating ink sensitive areas with a photo-imageable benzocyclobutene (BCB) polymer. The BCB can be patterned so as to provide a protective coating over selected areas while leaving other areas uncoated. In one described embodiment, a thermal ink jet printer is formed by bonding together a channel plate and a heater plate. Resistors and electrical connections are formed in the surface of the heater plate. A BCB layer is formed so as to overlie the heater plate to protect the electrical elements while providing pit structure for the heater and for ink flow bypass.

Abstract: An improved microelectromechanical device, such as a thermal ink jet die or printhead, is formed by the alignment of two planar substrates bonded together by an intermediate thick film layer of patterned polymeric material, such as polyimide. The improved device has a fully cured, patterned thick film layer which is planarized by chemical-mechanical polishing-to improve the bonding strength between the substrates. The planarization removes topographical formations generated during the deposition of the thick film layer and/or during the patterning of the recesses therein.

Abstract: A method of fabricating a pagewidth array of buttable printheads reduces end channel damage. The wafer containing a plurality of arrays of channels is provided with V-grooves. A V-groove is positioned between each array. When the wafer is secured to a wafer containing heater plates, wafers are diced along the V-shaped grooves to reduce damage to the end channels of the array to improve print quality.

Abstract: A method of dicing a printhead wafer containing a plurality of individual print elements into discreet elements. A back side relief feature is formed on the bottom front edge of a thermal ink jet print element from a heater side during a first dicing cut, followed by a second dicing cut from a channel side of the wafer to form a front face nozzle. The back cut feature enables front face maintenance by a wiper blade or other maintenance operation, provides a pocket for excess die bonding adhesive during manufacture, and reduces front face chipping during dicing caused by the saw blade contacting the die wafer mounting media and becoming contaminated. The relief feature may be a square step feature or a beveled back cut feature and may additionally be located on a top front edge of the print element.

Abstract: A method of dicing a printhead wafer containing a plurality of individual print elements into discreet elements. A back side relief feature is formed on the bottom front edge of a thermal ink jet print element from a heater side during a first dicing cut, followed by a second dicing cut from a channel side of the wafer to form a front face nozzle. The back cut feature enables front face maintenance by a wiper blade or other maintenance operation, provides a pocket for excess die bonding adhesive during manufacture, and reduces front face chipping during dicing caused by the saw blade contacting the die wafer mounting media and becoming contaminated. The relief feature may be a square step feature or a beveled back cut feature and may additionally be located on a top front edge of the print element.

Abstract: A printhead with a printhead die, an ink manifold and heat sink substrate has a continuous sealing surface surrounding the printhead die which is formed by the ink manifold, heat sink substrate and filler material disposed therebetween. The filler material acts as caulking to eliminate gaps around the printhead die, particularly between the ink manifold and heat sink substrate, and to provide a smooth surface for abutment with a capping member. A fluid-tight seal is obtained between the capping member and the continuous sealing surface on the printhead, thus preventing the drying out of ink in the nozzles through evaporation of volatile ink components. In some priming nozzle configurations, the leaktight seal also facilitates priming of the printhead.

Abstract: A movable priming station, for use with an ink jet printer having a printhead with a linear extended array of nozzles located on a planar surface thereof, is capable of priming a portion of the extended array of nozzles at one time by applying a vacuum to at least one nozzle located on the portion of the extended array. The movable priming station includes a support capable of moving along a length of the extended array of nozzles, a vacuum tube attached to the support for movement with the support and having a vacuum port adjacent to one end thereof. The support is controlled so that the vacuum port does not contact a nozzle-containing surface of the printhead when the support is moved laterally along the linear array of nozzles.

Abstract: A fixture for fabricating a full width scanning or imaging array from a plurality of relatively short subunits which provides immunity from vertical misalignment of the subunits caused by particle contamination. This is accomplished by providing a clearance slot in the fixture horizontal reference edge to minimize the reference edge and subunit contact area and to provide a space for the contaminating particles to accumulate so that they will not interfere with the precision placement and vertical alignment of the subunits on the fixture.

Abstract: A maintenance station for an ink jet printer of the type having a printhead movable between an operating position and a maintenance position provides the capability of priming the printhead as well as maintaining a humid environment to prevent ink from drying out in the printhead orifices. The maintenance station is located adjacent the printhead maintenance position periodically occupied by the printhead and is positionable towards and away from the printhead. The maintenance station comprises a movable chamber having a rigid wall confronting the printhead and the chamber wall has an aperture. A seal means comprises a resilient floating bed base with a opening similar in size to the chamber wall aperture and resilient lips extending from the periphery of the base opening, the outer edge of which is larger than the base opening, so that the lips of the seal means have a predetermined slope.

Abstract: A method of fabricating a semiconductor device having a buttable edge from a first wafer having first and second opposite planar surfaces and a second wafer having first and second opposite planar surfaces is disclosed. A first component is formed on the first planar surface of the first wafer. A precision dice cut is placed in the first planar surface of the first wafer closely adjacent to the first component. The precision dice cut extends partially through the first surface of the first wafer and defines the buttable edge. The first surface of the first wafer is bonded to the first surface of the second wafer, the first surface of the second wafer containing a second component and being aligned with and bonded to the first wafer so that the first and second components cooperate to form the semiconductor device. Portions of the first and second wafers surrounding the first and second components, respectively, are then removed to define the semiconductor device.

Abstract: A cleaning device for removal of ink and other debris from the nozzle face of an ink jet printhead is disclosed. The cleaning device is located at a cleaning and priming station within the printer, and comprises a rotatable drum having at least one slot in which an absorbent material covered with a polymeric mesh material is manually inserted. When the printhead is located in the cleaning and priming station, the drum is rotated and the covered absorbent material wipes the nozzle face. In one embodiment, the printer is a carriage type with the cleaning station on one side of the printing region. The drum is surrounded by a housing with an opening so that the covered absorbent material is rotated therepast and into contact with the nozzle face of the printhead. The absorbent material is moistened to assist in cleaning the nozzle face in preventing ink removed from the nozzle face from drying on the mesh material.