Patents by Inventor Alois Ulrich

Alois Ulrich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for aligning the bonding head of a bonder, in particular a die bonder
    Patent number: 6179938
    Abstract: A method of aligning the bonding head of a bonder, in particular a die bonder, or of a pick and place machine comprising the steps of a) placing an alignment plate provided with two plane parallel surfaces on a supporting surface which is set plane parallel to the bonding surface upon which the semiconductor chip will be bonded to the carrier material; b) calibration of a measuring device, the signal of which is dependent upon the position of the alignment plate; c) grasping the alignment plate with the bonding head of the bonder and holding the alignment plate free at a slight distance above the measuring device; and d) alignment of the bonding head until the signal from the measuring device is equal to the signal following step b).
    Type: Grant
    Filed: October 19, 1998
    Date of Patent: January 30, 2001
    Assignee: Esec SA
    Inventors: Eugen Mannhart, Alois Ulrich, Thomas Guenther, Matthias Krieger