Patents by Inventor Alok K. Lohia
Alok K. Lohia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240138051Abstract: A system includes a point of load (POL) module. The POL module includes a point of load printed circuit board. At least one inductor is mounted to the point of load printed circuit board. The POL module includes a power network. The POL module is configured to be surface mounted. The system further includes a heat sink including a first leg configured to be surface mounted adjacent the point of load printed circuit board, a second leg configured to be surface mounted adjacent the point of load printed circuit board opposite the first leg, and a cap portion connecting the first leg to the second leg. The heat sink is sized and shaped to encompass the POL module and configured to connect to the power network. The power network may be a PGND network.Type: ApplicationFiled: January 2, 2024Publication date: April 25, 2024Inventors: John Andrew Trelford, Alok K. Lohia, Arturo Silva
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Patent number: 11910517Abstract: A system including a point of load converter module (POL). The POL module includes a point of load printed circuit board. At least one inductor is mounted to the point of load printed circuit board. The POL module includes a power network. The point of load converter module is configured to be surface mounted. The system includes a heat sink including a first leg configured to be surface mounted adjacent the point of load printed circuit board, a second leg configured to be surface mounted adjacent the point of load printed circuit board opposite the first leg, and a cap portion connecting the first leg to the second leg. The heat sink is sized and shaped to encompass the POL and configured to connect to the power network. The power network may be a PGND network.Type: GrantFiled: December 14, 2021Date of Patent: February 20, 2024Assignee: AcLeap Power Inc.Inventors: John Andrew Trelford, Alok K. Lohia, Arturo Silva
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Patent number: 11770900Abstract: A printed circuit board (PCB) assembly is provided. The PCB assembly comprises a printed wiring board (PWB) and one or more electrical components mounted thereon. The PWB comprises a plurality of layers including conductive layers and insulative layers, where one or more of the insulative layers is a prepreg layer that is halogen-free; one or more slotted portions on a surface of the PWB, which are indented into the PWB; and one or more pads disposed on the surface of the PWB, which are paired with the one or more slotted portions. Each of the one or more electrical components is mounted on the surface of the PWB through a pair of a slotted portion and a pad.Type: GrantFiled: December 9, 2021Date of Patent: September 26, 2023Assignee: ABB Schweiz AGInventors: Alok K. Lohia, Arturo Silva, Robert J. Catalano, Robert J. Roessler
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Publication number: 20230260690Abstract: An inductor is disposed above and mounted on a printed wire board. The inductor includes a winding and a core. The winding includes first and second terminations that are electrically connected to the printed wire board at different locations. The core includes: a first section including magnetic material with a channel along an inner surface, to receive the winding, and ending at or above first and second bottom corners of the inner surface; a second section that is a mirror image of the first section including an inner surface that faces the inner surface of the first section; and a distributed gap that uniformly separates the first section from the second section except where the winding passes along the mirror-image channels. The winding lies along the distributed gap in the mirror-image channels, and the winding spatially divides the core into an upper and lower portions of equal volume.Type: ApplicationFiled: February 16, 2022Publication date: August 17, 2023Applicant: ABB Schweiz AGInventors: Arturo Silva, Alok K. Lohia, Robert J. Catalano
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Publication number: 20230189427Abstract: A system including a point of load converter module (POL). The POL module includes a point of load printed circuit board. At least one inductor is mounted to the point of load printed circuit board. The POL module includes a power network. The point of load converter module is configured to be surface mounted. The system includes a heat sink including a first leg configured to be surface mounted adjacent the point of load printed circuit board, a second leg configured to be surface mounted adjacent the point of load printed circuit board opposite the first leg, and a cap portion connecting the first leg to the second leg. The heat sink is sized and shaped to encompass the POL and configured to connect to the power network. The power network may be a PGND network.Type: ApplicationFiled: December 14, 2021Publication date: June 15, 2023Applicant: ABB Schweiz AGInventors: John Andrew Trelford, Alok K. Lohia, Arturo Silva
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Publication number: 20230189443Abstract: A printed circuit board (PCB) assembly is provided. The PCB assembly comprises a printed wiring board (PWB) and one or more electrical components mounted thereon. The PWB comprises a plurality of layers including conductive layers and insulative layers, where one or more of the insulative layers is a prepreg layer that is halogen-free; one or more slotted portions on a surface of the PWB, which are indented into the PWB; and one or more pads disposed on the surface of the PWB, which are paired with the one or more slotted portions. Each of the one or more electrical components is mounted on the surface of the PWB through a pair of a slotted portion and a pad.Type: ApplicationFiled: December 9, 2021Publication date: June 15, 2023Applicant: ABB Schweiz AGInventors: Alok K. Lohia, Arturo Silva, Robert J. Catalano, Robert J. Roessler
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Publication number: 20090072373Abstract: Packaged integrated circuits and methods to form a thermal stacked integrated circuit package are disclosed. A disclosed method comprises attaching a first integrated circuit to at least one of a plurality of pads of a substrate, mounting a second integrated circuit above the first integrated circuit, placing a heat conductor in thermal contact with a top surface of the second integrated circuit, and encapsulating the first and second integrated circuits while leaving a surface of the heat conductor exposed to dissipate heat.Type: ApplicationFiled: September 14, 2007Publication date: March 19, 2009Inventors: Reynaldo Corpuz Javier, Jayprakash V. Chipalkatti, Alok K. Lohia
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Patent number: 7477517Abstract: Disclosed is an integrated active heat spreader and exchanger. The heat spreader cum exchanger includes a housing with a conductive heat spreader therein. A spreader plate of the heat spreader is in thermal contact with a microprocessor chip to be cooled and a plurality of spreader fins extending from the spreader plate. A membrane connects the heat spreader and the housing, sealing an interface between the heat spreader and the housing. A top plate, including a plurality of top plate fins, is disposed in the housing. A pump is located between the top plate fins and the spreader fins and urges fluid across the spreader fins and conducts heat from the spreader fins. The top plate fins conduct heat from the fluid and into a heat sink in thermal contact with the top plate. A heat sink plate conducts heat into heat sink fins where the heat is dissipated.Type: GrantFiled: January 29, 2007Date of Patent: January 13, 2009Assignee: International Business Machines CorporationInventors: Vijayeshwar D. Khanna, Alok K. Lohia, Gerard McVicker, Sri M. Sri-Jayantha
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Publication number: 20080180914Abstract: Disclosed is an integrated active heat spreader and exchanger. The heat spreader cum exchanger includes a housing with a conductive heat spreader therein. A spreader plate of the heat spreader is in thermal contact with a microprocessor chip to be cooled and a plurality of spreader fins extending from the spreader plate. A membrane connects the heat spreader and the housing, sealing an interface between the heat spreader and the housing. A top plate, including a plurality of top plate fins, is disposed in the housing. A pump is located between the top plate fins and the spreader fins and urges fluid across the spreader fins and conducts heat from the spreader fins. The top plate fins conduct heat from the fluid and into a heat sink in thermal contact with the top plate. A heat sink plate conducts heat into heat sink fins where the heat is dissipated.Type: ApplicationFiled: January 29, 2007Publication date: July 31, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Vijayeshwar D. Khanna, Alok K. Lohia, Gerard McVicker, Sri M. Sri-Jayantha