Abstract: The present invention encompasses immediate release tablets of dofetilide, methods of treatment with them, as well as a process for manufacturing the same.

Abstract: The present invention encompasses immediate release tablets of dofetilide, methods of treatment with them, as well as a process for manufacturing the same.

Abstract: Disclosed are methods and systems for by identifying or generating an electrical schematic, generating a thermal schematic by associating thermal RC circuits of the electronic design with the electrical schematic, performing at least two analyses of an electrical analysis, a thermal analysis, and an electromagnetic interference compliance (EMC) analysis with the electrical schematic and the thermal schematic of the electronic design. The electrical, thermal, and EMC analyses may be performed concurrently by forwarding intermediate or final analysis results to each other, and the analysis results may be presented simultaneously in one or more user interface windows. The thermal schematic may be obtained by extracting the thermal RC circuits, identifying corresponding electrical circuit components that correspond to the extracted thermal RC circuits, and importing the thermal RC circuits into the electrical schematic so that the electrical and thermal schematics have the same nodes.

Abstract: Disclosed are methods and systems for by identifying or generating an electrical schematic, generating a thermal schematic by associating thermal RC circuits of the electronic design with the electrical schematic, performing at least two analyses of an electrical analysis, a thermal analysis, and an electromagnetic interference compliance (EMC) analysis with the electrical schematic and the thermal schematic of the electronic design. The electrical, thermal, and EMC analyses may be performed concurrently by forwarding intermediate or final analysis results to each other, and the analysis results may be presented simultaneously in one or more user interface windows. The thermal schematic may be obtained by extracting the thermal RC circuits, identifying corresponding electrical circuit components that correspond to the extracted thermal RC circuits, and importing the thermal RC circuits into the electrical schematic so that the electrical and thermal schematics have the same nodes.

Abstract: An improved approach for automatically generating physical layout constraints and topology that are visually in-sync with the logic schematic created for simulation is described. The present approach is also directed to an automatic method for transferring topology from logic design to layout.

Abstract: An improved approach for automatically generating physical layout constraints and topology that are visually in-sync with the logic schematic created for simulation is described. The present approach is also directed to an automatic method for transferring topology from logic design to layout.

Abstract: A method and system are provided for optimizing physical implementation of an electronic circuit responsive to simulation analysis thereof. The method and system include schematically defining the electronic circuit to include a plurality of circuit elements interconnected at respective nodes by a plurality of nets, and acquiring parametric values for a plurality of predetermined operational parameters from simulated operation of the electronic circuit. The parametric values are automatically processed to generate a plurality of parametric constraints corresponding thereto for optimizing physical implementation of the electronic circuit. A circuit layout at least partially representing a physical implementation of the schematic definition is then generated. The circuit layout, which includes a plurality of devices interconnected by a plurality of tracks, is adaptively configured in accordance with the parametric constraints.

Abstract: An apparatus includes a printed circuit board (PCB) and a first flexible conductive cable (“flex cable”) secured to the PCB. The apparatus also includes a daughter card having an end adjacent to the PCB and a second flex cable secured to the daughter card. The apparatus further includes a connector which provides an electrically conductive connection between the first flex cable and the second flex cable. The connector is positioned to sandwich a portion of the first flex cable between the connector and the PCB.

Abstract: In some embodiments, a frequency dependent gain circuit is coupled to an output of an amplifier. The gain circuit provides at least two ranges of frequency dependent gain characteristics in response to the output of the amplifier. A control circuit provides one of the at feast two gain values as an output. Other embodiments are described and claimed.

Abstract: An apparatus that includes a first conducting strip having a narrowed width where the first conducting strip also acts as a first electrode for a first tapping capacitance. The first tapping capacitance has a second electrode that is: 1) parallel to the first conducting strip; and 2) closer to the first conducting strip than a second conducting strip. The second conducting strip is parallel to the first conducting strip and has a narrowed width where the second conducting strip also acts as a first electrode for a second tapping capacitance. The second tapping capacitance has a second electrode that is: 1) parallel to the second conducting strip; and 2) closer to the second conducting strip than the first conducting strip.

Abstract: An apparatus includes a printed circuit board (PCB) and a first flexible conductive cable (“flex cable”) secured to the PCB. The apparatus also includes a daughtercard having an end adjacent to the PCB and a second flex cable secured to the daughter card. The apparatus further includes a connector which provides an electrically conductive connection between the first flex cable and the second flex cable. The connector is positioned to sandwich a portion of the first flex cable between the connector and the PCB.

Abstract: In some embodiments, a circuit is provided that comprises a decision feedback equalizer to receive a bit stream signal. The equalizer comprises a summing circuit having a first input to receive a cursor bit sample from the bit stream, a second input to receive a first cursor bit signal, and an output to provide a cursor bit output signal corresponding to the cursor bit sample with at least some postcursor distortion removed therefrom. Other embodiments are disclosed and/or claimed herein.

Abstract: A method to calibrate an equalizer for communicating signals over a data link between a transmitter and receiver includes measuring loss in the link and automatically determining a multi-tap equalization setting for the transmitter based on the measured loss. The multi-tap equalization setting may be determined using a look-up table, which stores a plurality of equalization settings for a respective number of link loss values. Once the equalization setting matching the measured link loss is found in the table, the equalizer can be optimally set to reduce or eliminate intersymbol and other types of interference.

Abstract: In some embodiments, a frequency dependent gain circuit is coupled to an output of an amplifier. The gain circuit provides at least two ranges of frequency dependent gain characteristics in response to the output of the amplifier. A control circuit provides one of the at feast two gain values as an output. Other embodiments are described and claimed.

Abstract: According to some embodiments, time domain reflectometry based transmitter equalization is provided. For example, a reflection detector in a transmitter may detect a reflection signal associated with a calibration signal that was transmitted via an interconnect. The reflection detector may then provide filter information to a transmitting unit to facilitate a transmission of data to a remote receiver via the interconnect. According to some embodiments, the receiver adjusts a termination impedance before the calibration signal is transmitted.

Abstract: According to some embodiments, time domain reflectometry based transmitter equalization is provided.

Abstract: An apparatus that includes a first conducting strip having a narrowed width where the first conducting strip also acts as a first electrode for a first tapping capacitance. The first tapping capacitance has a second electrode that is: 1) parallel to the first conducting strip; and 2) closer to the first conducting strip than a second conducting strip. The second conducting strip is parallel to the first conducting strip and has a narrowed width where the second conducting strip also acts as a first electrode for a second tapping capacitance. The second tapping capacitance has a second electrode that is: 1) parallel to the second conducting strip; and 2) closer to the second conducting strip than the first conducting strip.

Abstract: A technique to simultaneously reduce high-frequency insertion loss and cross-talk for a multi-layered add-in card is disclosed. The technique is based on selective removal of ground and power planes beneath the edge fingers. This selective removal of power and ground planes removes excess capacitance at the edge fingers, lowering the insertion loss at high frequencies, while maintaining an impedance match with an associated connector. Simultaneously, the leftover metallic ground/power plane provides electromagnetic shielding and thus reduces the cross-talk between the differential pairs. Optimum performance of the connector with minimized insertion loss and cross-talk can be obtained for high-speed analog and digital applications.

Abstract: A method and apparatus for reducing electromagnetic emissions from a high-speed differential data connector is disclosed. The method and apparatus are as effective as a 360° enclosure, while being easier and less expensive to manufacture and does not require a direct electrical connection between the Transistor-to-Transistor logic (TTL) or logic ground and the system chassis ground.

Abstract: A technique to simultaneously reduce high-frequency insertion loss and cross-talk for a multi-layered add-in card is disclosed. The technique is based on selective removal of ground and power planes beneath the edge fingers. This selective removal of power and ground planes removes excess capacitance at the edge fingers, lowering the insertion loss at high frequencies, while maintaining an impedance match with an associated connector. Simultaneously, the leftover metallic ground/power plane provides electromagnetic shielding and thus reduces the cross-talk between the differential pairs. Optimum performance of the connector with minimized insertion loss and cross-talk can be obtained for high-speed analog and digital applications.