Abstract: The invention relates to a thermal contact apparatus, comprising: a first plate, suitable to be connected to a heat source, absorb heat from said heat source, and transfer the heat to other components of the apparatus; a first set of fibers, suitable to absorb heat from said first plate and transfer the heat to other components of the apparatus, wherein said first set of fibers is connected to said first plate; a second set of fibers, suitable to absorb heat from said first set of fibers and thansfer the heat to other components of the apparatus, wherein said first and second sets of fibers are in contact; and a second plate, suitable to absorb heat from said second set of fibers and transfer the heat out of the apparatus, wherein said second set of fibers is connected to said second plate.

Abstract: A diode-pumped solid state laser, e.g., in a side-pumped or end-pumped configuration, including a lasing medium (30, 40, 62) comprising at least one surface (41) through which the laser is pumped, and at least one diamond plate (32, 42, 64) in thermal contact with the at least one surface (41). In an embodiment a plurality of segments of said lasing medium (62) are disposed in proximity to each other, and said at least one diamond plate (64) is disposed between two adjacent segments, and in thermal contact with said elements.

Abstract: A diode-pumped solid state laser, e.g., in a side-pumped or end-pumped configuration, including a lasing medium (30, 40, 62) comprising at least one surface (41) through which the laser is pumped, and at least one diamond plate (32, 42, 64) in thermal contact with the at least one surface (41). In an embodiment a plurality of segments of said lasing medium (62) are disposed in proximity to each other, and said at least one diamond plate (64) is disposed between two adjacent segments, and in thermal contact with said elements.