Patents by Inventor Alphonso Philip Lanzetta

Alphonso Philip Lanzetta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6403892
    Abstract: A flex or TAB product suitable for chip carrier applications wherein the flex reliability problems caused by copper dendrite growth and lead bending during power and thermal cycling are reduced by application of special coatings to lead areas of the flex tape.
    Type: Grant
    Filed: June 24, 1996
    Date of Patent: June 11, 2002
    Assignee: International Business Machines Corporation
    Inventors: Claudius Feger, Teresita Ordonez Graham, Kurt Rudolph Grebe, Alphonso Philip Lanzetta, John Joseph Liutkus, Linda Carolyn Matthew, Michael Jon Palmer, Nelson Russell Tanner, Ho-Ming Tong, Charles Haile Wilson, Helen Li Yeh
  • Patent number: 6326696
    Abstract: An electronic package which includes a circuitized substrate with a cavity and a first semiconductor chip positioned therein. The first chip is electrically coupled to conductive members located on the circuitized substrate. A second semiconductor chip is positioned on and electrically coupled to the first chip.
    Type: Grant
    Filed: February 4, 1998
    Date of Patent: December 4, 2001
    Assignee: International Business Machines Corporation
    Inventors: Raymond Robert Horton, Alphonso Philip Lanzetta, Joseph Maryan Milewski, Lawrence S. Mok, Robert Kevin Montoye, Hussain Shaukatulla
  • Patent number: 6306686
    Abstract: An electronic package which includes a circuitized substrate with a cavity and a first semiconductor chip positioned therein. The first chip is electrically coupled to conductive members located on the circuitized substrate. A second semiconductor chip is positioned on and electrically coupled to the first chip.
    Type: Grant
    Filed: January 19, 2000
    Date of Patent: October 23, 2001
    Assignee: International Business Machines Corporation
    Inventors: Raymond Robert Horton, Alphonso Philip Lanzetta, Joseph Maryan Milewski, Lawrence S. Mok, Robert Kevin Montoye, Hussain Shaukatulla
  • Patent number: 6019530
    Abstract: The invention is directed to a keyboard where the keys are raised up from a retracted position upon the initialization of usage of the keyboard. An embedded airbag mechanism is self-inflatable to raise keys to the normal operating heights. The keys will be retracted when the airbag is deflated. The rising and retracting of the keys can also be controlled by hinge-like structure. The close and open of the cover of a laptop computer will activate the mechanism to raise and retract the keys on the keyboard.
    Type: Grant
    Filed: August 5, 1998
    Date of Patent: February 1, 2000
    Assignee: International Business Machines Corporation
    Inventors: Alphonso Philip Lanzetta, David Andrew Lewis, Lawrence Shungwei Mok, Stanley Joseph Whitehair
  • Patent number: 6009247
    Abstract: A portable or notebook type computer communication interface that permits portable computers to be reliably used in a data processing network. The interface involves communication circuitry, special device inputs and power monitoring and charging. A flexible portable computer wireless time and frequency division network is formed using a time and frequency division multiplexed communication channel assignment feature that together with a wireless link establishes a unique direct communication channel between data processing devices on different levels with data packet type transmission security. The principle permits each portable computer in the network to communicate with any other and any and all can transmit and receive at the same time.
    Type: Grant
    Filed: October 29, 1996
    Date of Patent: December 28, 1999
    Assignee: International Business Machines Corporation
    Inventors: Frank J. Canora, Michael Frank Cina, Brian Paul Gaucher, Paul Francis Greier, Richard Ian Kaufman, Alphonso Philip Lanzetta, Lawrence Shungwei Mok, Robert Stephen Olyha, Saila Ponnapalli, John LeRoy Staples
  • Patent number: 5768770
    Abstract: Process for shaping conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different distance from the carrier. Each conductor remains in the plane of the support of the carrier to the vicinity of its respective contact location where it is shaped to extend nearly vertically toward the substrate then horizontally across the contact location exerting pressure on the contact location.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: June 23, 1998
    Inventors: Raymond Robert Horton, Alphonso Philip Lanzetta, Ismail Cevdet Noyan, Michael Jon Palmer
  • Patent number: 5734196
    Abstract: An electronic packaging interface between conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different distance from the carrier. Each conductor remains in the plane of the support of the carrier to the vicinity of its respective contact location where it is shaped to extend nearly vertically toward the substrate then horizontally across the contact location exerting pressure on the contact location.
    Type: Grant
    Filed: October 13, 1995
    Date of Patent: March 31, 1998
    Assignee: International Business Machines Corporation
    Inventors: Raymond Robert Horton, Alphonso Philip Lanzetta, Ismail Gevdet Noyan, Michael Jon Palmer
  • Patent number: 5675884
    Abstract: Apparatus for shaping conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different distance from the carrier. Each conductor remains in the plane of the support of the carrier to the vicinity of its respective contact location where it is shaped to extend nearly vertically toward the substrate then horizontally across the contact location exerting pressure on the contact location.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: October 14, 1997
    Assignee: International Business Machines Corporation
    Inventors: Raymond Robert Horton, Alphonso Philip Lanzetta, Ismail Cevdet Noyan, Michael Jon Palmer