Patents by Inventor Altaf Hasan

Altaf Hasan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGE WARPAGE CONTROL
    Publication number: 20070205501
    Abstract: A method of packaging includes placing a restrainer on a package during processing. The method includes clipping the restrainer in place and then exposing the package to high temperatures. After processing the restrainer is removed. An alternative process attaches a component die to a substrate having a cavity in a first surface. The process may then include dispensing and curing an underfill material in the cavity, and attaching a lid to the first surface of the substrate.
    Type: Application
    Filed: March 19, 2007
    Publication date: September 6, 2007
    Applicant: Intel Corporation
    Inventors: Michael Lee, Mun Leong Loke, Soon Chuan Ong, Hooi Jin Teng, Lisa Lee, Altaf Hasan
  • PACKAGE WARPAGE CONTROL
    Publication number: 20070155059
    Abstract: A method of packaging includes placing a restrainer on a package during processing. The method includes clipping the restrainer in place and then exposing the package to high temperatures. After processing the restrainer is removed. An alternative process attaches a component die to a substrate having a cavity in a first surface. The process may then include dispensing and curing an underfill material in the cavity, and attaching a lid to the first surface of the substrate.
    Type: Application
    Filed: March 16, 2007
    Publication date: July 5, 2007
    Applicant: Intel Corporation
    Inventors: Michael Lee, Mun Loke, Soon Ong, Hooi Teng, Lisa Lee, Altaf Hasan
  • Package warpage control
    Patent number: 7208342
    Abstract: A method of packaging includes placing a restrainer on a package during processing. The method includes clipping the restrainer in place and then exposing the package to high temperatures. After processing the restrainer is removed. An alternative process attaches a component die to a substrate having a cavity in a first surface. The process may then include dispensing and curing an underfill material in the cavity, and attaching a lid to the first surface of the substrate.
    Type: Grant
    Filed: May 27, 2004
    Date of Patent: April 24, 2007
    Assignee: Intel Corporation
    Inventors: Michael Keat Lye Lee, Mun Leong Loke, Soon Chuan Ong, Hooi Jin Teng, Lisa Yung Hui Lee, Altaf Hasan
  • Package warpage control
    Publication number: 20050266607
    Abstract: A method of packaging includes placing a restrainer on a package during processing. The method includes clipping the restrainer in place and then exposing the package to high temperatures. After processing the restrainer is removed. An alternative process attaches a component die to a substrate having a cavity in a first surface. The process may then include dispensing and curing an underfill material in the cavity, and attaching a lid to the first surface of the substrate.
    Type: Application
    Filed: May 27, 2004
    Publication date: December 1, 2005
    Applicant: Intel Corporation
    Inventors: Michael Lee, Mun Loke, Soon Ong, Hooi Teng, Lisa Hui Lee, Altaf Hasan
  • TCP TAB design with radial outer leads
    Patent number: 5646441
    Abstract: An integrated circuit package which has a plurality of inner surface pads located on a substrate and arranged in an angular pattern about an integrated circuit. The inner surface pads of the package are coupled to the outer surface pads of the integrated circuit with a TAB tape. The TAB tape has a plurality of conductors which each have a first end attached to the outer pads of the integrated circuit and a land portion attached to the inner surface pads of the substrate. The land portions of the tape are also arranged in an angular pattern about the integrated circuit.
    Type: Grant
    Filed: April 18, 1996
    Date of Patent: July 8, 1997
    Assignee: Intel Corporation
    Inventors: Altaf Hasan, J. D. Wilson, Tor Kalleberg
  • Staggered land pad pattern on substrate for tab interconnection
    Patent number: 5604330
    Abstract: A package for a semiconductor device. The device is packaged using tape-automated bonding (TAB) to bond an integrated circuit chip to a package substrate of any type. The land pads on the substrate are staggered such that they are arranged in two rows with adjacent pads alternating. In this way, the effective overall pitch of the land pads is smaller than that of each row.
    Type: Grant
    Filed: December 29, 1994
    Date of Patent: February 18, 1997
    Assignee: Intel Corporation
    Inventors: Altaf Hasan, J. D. Wilson, Siva Natarajan