Abstract: For the manufacture of a power semiconductor module, one proceeds from a ceramic base board on which copper plates and copper conductor paths are fastened by a suitable method. The ceramic base plate is then scratched and broken. As a result, ceramic side boards are produced which are connected to the base board via conductive paths. The side boards are then swung up, as a result of which the conductive paths fastened on the side boards come into a plane above the base plane. By means of suitable, possibly multiple, breaking and folding of the side boards and suitable development of the ends of the conductive paths, the connecting poles of the power semiconductor chips can be directly contacted. Electronic circuits can be arranged on the side boards.

Abstract: Aluminum nitride powder (28), possibly powdered glass (29) and aluminum oxide powder (23) are introduced into the molding cavity of a pressure matrix (26) for fabrication of a carrier body from aluminum nitride, whose surface is at least partially covered with aluminum oxide. Subsequently a pressure stamp (22) of the pressure tool (20) is introduced into the molded cavity of the pressure matrix (26). The powdered layers (28, 29, 30) are compressed and subsequently sintered, for instance for two hours at 1600.degree. C. in a neutral atmosphere.

Abstract: Rectifier module, including a frame forming a housing wall and having an open top and bottom, a ceramic plate cemented to the frame forming a housing bottom and having a side facing the interior of the housing and a side facing away from the interior of the housing, metallizations disposed on the side of the ceramic plate facing the interior of the housing forming conductor strips for soldering on semiconductor components, internal connecting straps, external connecting elements in the form of flat plugs having a broadened base part being soldered to one of the metallizations, an actual plug connector part being freely accessible from the top of the housing and an extension curve being disposed between the base part and the actual plug connector, the extension curve having a cross-sectional area being smaller than the cross-sectional area of the base and actual plug connector parts, a sealing compound filling substantially half of the housing, and a copper foil being disposed on the side of the ceramic plate

Abstract: An apparatus for aligning and soldering electrode pedestals to the solderable ohmic contacts of individual semiconductor components formed by an undivided silicon wafer. The apparatus includes a soldering assembly for receiving the undivided silicon wafer and for temporarily retaining the electrode pedestals in alignment on the silicon wafer during the soldering of the pedestals to the ohmic contacts; a pedestal mask which is placed over the undivided silicon wafer and which aligns individual pedestals over the ohmic contacts of the silicon wafer; and a shaker apparatus coupled to said soldering base plate for distributing the electrode pedestals to each of the ohmic contacts.