Abstract: A process for the forming of Al-Cu conductive thin films with reduced electromigration failures is useful, for example, in the metallization of integrated circuits. An improved formation process includes the heat treatment or annealing of the thin film conductor at a temperature within the range of from 200.degree. C. to 300.degree. C. for a time period between 10 minutes and 24 hours under a reducing atmosphere such as 15% H.sub.2 in N.sub.2 by volume. Al-Cu thin films annealed in the single phase region of a phase diagram, to temperatures between 200.degree. C. and 300.degree. C. have .theta.-phase Al.sub.2 Cu precipitates at the grain boundaries continuously become enriched in copper, due, it is theorized, to the formation of a thin coating of .theta.-phase precipitate at the grain boundary. Electromigration behavior of the aluminum is, thus, improved because the .theta.-phase precipitates with copper hinder aluminum diffusion along the grain boundaries.

Abstract: A non-planar, focusing mirror, to be utilized in both electron column instruments and micro-x-ray fluorescence instruments for performing chemical microanalysis on a sample, comprises a concave, generally spherical base substrate and a predetermined number of alternating layers of high atomic number material and low atomic number material contiguously formed on the base substrate. The thickness of each layer is an integral multiple of the wavelength being reflected and may vary non-uniformly according to a predetermined design. The chemical analytical instruments in which the mirror is used also include a predetermined energy source for directing energy onto the sample and a detector for receiving and detecting the x-rays emitted from the sample; the non-planar mirror is located between the sample and detector and collects the x-rays emitted from the sample at a large solid angle and focuses the collected x-rays to the sample.For electron column instruments, the wavelengths of interest lie above 1.