Patents by Inventor Altug Koker

Altug Koker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11398006
    Abstract: Systems, apparatuses and methods may provide for technology that determines a position associated with one or more polygons in unresolved surface data and select an anti-aliasing sample rate based on a state of the one or more polygons with respect to the position. Additionally, the unresolved surface data may be resolved at the position in accordance with the selected anti-aliasing sample rate, wherein the selected anti-aliasing sample rate varies across a plurality of pixels. The position may be a bounding box, a display screen coordinate, and so forth.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: July 26, 2022
    Assignee: Intel Corporation
    Inventors: Abhishek R. Appu, Joydeep Ray, Peter L. Doyle, Subramaniam Maiyuran, Devan Burke, Philip R. Laws, ElMoustapha Ould-Ahmed-Vall, Altug Koker
  • Patent number: 11397585
    Abstract: An apparatus to facilitate thread scheduling is disclosed. The apparatus includes logic to store barrier usage data based on a magnitude of barrier messages in an application kernel and a scheduler to schedule execution of threads across a plurality of multiprocessors based on the barrier usage data.
    Type: Grant
    Filed: February 11, 2021
    Date of Patent: July 26, 2022
    Assignee: Intel Corporation
    Inventors: Balaji Vembu, Abhishek R. Appu, Joydeep Ray, Altug Koker
  • Publication number: 20220230269
    Abstract: One embodiment provides an apparatus comprising an interconnect fabric comprising one or more fabric switches, a plurality of memory interfaces coupled to the interconnect fabric to provide access to a plurality of memory devices, an input/output (IO) interface coupled to the interconnect fabric to provide access to IO devices, an array of multiprocessors coupled to the interconnect fabric, scheduling circuitry to distribute a plurality of thread groups across the array of multiprocessors, each thread group comprising a plurality of threads and each thread comprising a plurality of instructions to be executed by at least one of the multiprocessors, and a first multiprocessor of the array of multiprocessors to be assigned to process a first thread group comprising a first plurality of threads, the first multiprocessor comprising a plurality of parallel execution circuits.
    Type: Application
    Filed: February 2, 2022
    Publication date: July 21, 2022
    Applicant: Intel Corporation
    Inventors: Balaji Vembu, Altug Koker, Joydeep Ray
  • Patent number: 11393065
    Abstract: A mechanism is described for facilitating dynamic cache allocation in computing devices in computing devices. A method of embodiments, as described herein, includes facilitating monitoring one or more bandwidth consumptions of one or more clients accessing a cache associated with a processor; computing one or more bandwidth requirements of the one or more clients based on the one or more bandwidth consumptions; and allocating one or more portions of the cache to the one or more clients in accordance with the one or more bandwidth requirements.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: July 19, 2022
    Assignee: Intel Corporation
    Inventors: Kiran C. Veernapu, Mohammed Tameem, Altug Koker, Abhishek R. Appu
  • Patent number: 11393211
    Abstract: A mechanism is described for facilitating person tracking and data security in machine learning at autonomous machines. A method of embodiments, as described herein, includes detecting, by a camera associated with one or more trackers, a person within a physical vicinity, where detecting includes capturing one or more images the person. The method may further include tracking, by the one or more trackers, the person based on the one or more images of the person, where tracking includes collect tracking data relating to the person. The method may further include selecting a tracker of the one or more trackers as a preferred tracker based on the tracking data.
    Type: Grant
    Filed: February 11, 2021
    Date of Patent: July 19, 2022
    Assignee: Intel Corporation
    Inventors: Mayuresh M. Varerkar, Barnan Das, Narayan Biswal, Stanley J. Baran, Gokcen Cilingir, Nilesh V. Shah, Archie Sharma, Sherine Abdelhak, Sachin Godse, Farshad Akhbari, Narayan Srinivasa, Altug Koker, Nadathur Rajagopalan Satish, Dukhwan Kim, Feng Chen, Abhishek R. Appu, Joydeep Ray, Ping T. Tang, Michael S. Strickland, Xiaoming Chen, Anbang Yao, Tatiana Shpeisman, Vasanth Ranganathan, Sanjeev Jahagirdar
  • Patent number: 11393131
    Abstract: A mechanism is described for facilitating smart compression/decompression schemes at computing devices. A method of embodiments, as described herein, includes unifying a first compression scheme relating to three-dimensional (3D) content and a second compression scheme relating to media content into a unified compression scheme to perform compression of one or more of the 3D content and the media content relating to a processor including a graphics processor.
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: July 19, 2022
    Assignee: Intel Corporation
    Inventors: Abhishek R. Appu, Kiran C. Veernapu, Prasoonkumar Surti, Joydeep Ray, Altug Koker, Eric G. Liskay
  • Patent number: 11392502
    Abstract: An embodiment of an electronic processing system may include an application processor, system memory communicatively coupled to the application processor, a graphics processor communicatively coupled to the application processor, graphics memory communicatively coupled to the graphics processor, and persistent storage media communicatively coupled to the application processor and the graphics processor to store one or more graphics assets, wherein the graphics processor is to access the one or more graphics asset mapped from the persistent storage media. The persistent storage media may include a low latency, high capacity, and byte-addressable nonvolatile memory. The one or more graphics assets may include one or more of a mega-texture and terrain data. Other embodiments are disclosed and claimed.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: July 19, 2022
    Assignee: Intel Corporation
    Inventors: Jianfang Zhu, Cristiano J. Ferreira, Bo Qiu, Ajit Krisshna Nandyal Lakshman, Nikhil Talpallikar, Deepak Gandiga Shivakumar, Brandt M. Guttridge, Kim Pallister, Frank J. Soqui, Anand Srivatsa, Travis T. Schluessler, Abhishek R. Appu, Ankur N. Shah, Joydeep Ray, Altug Koker, Jonathan Kennedy
  • Publication number: 20220222767
    Abstract: Embodiments are generally directed to memory prefetching in multiple GPU environment. An embodiment of an apparatus includes multiple processors including a host processor and multiple graphics processing units (GPUs) to process data, each of the GPUs including a prefetcher and a cache; and a memory for storage of data, the memory including a plurality of memory elements, wherein the prefetcher of each of the GPUs is to prefetch data from the memory to the cache of the GPU; and wherein the prefetcher of a GPU is prohibited from prefetching from a page that is not owned by the GPU or by the host processor.
    Type: Application
    Filed: January 20, 2022
    Publication date: July 14, 2022
    Applicant: Intel Corporation
    Inventors: Joydeep Ray, Aravindh Anantaraman, Valentin Andrei, Abhishek R. Appu, Nicolas Galoppo von Borries, Varghese George, Altug Koker, Elmoustapha Ould-Ahmed-Vall, Mike Macpherson, Subramaniam Maiyuran
  • Patent number: 11386521
    Abstract: A disaggregated processor package can be configured to accept interchangeable chiplets. Interchangeability is enabled by specifying a standard physical interconnect for chiplets that can enable the chiplet to interface with a fabric or bridge interconnect. Chiplets from different IP designers can conform to the common interconnect, enabling such chiplets to be interchangeable during assembly. The fabric and bridge interconnects logic on the chiplet can then be configured to confirm with the actual interconnect layout of the on-board logic of the chiplet. Additionally, data from chiplets can be transmitted across an inter-chiplet fabric using encapsulation, such that the actual data being transferred is opaque to the fabric, further enable interchangeability of the individual chiplets. With such an interchangeable design, higher or lower density memory can be inserted into memory chiplet slots, while compute or graphics chiplets with a higher or lower core count can be inserted into logic chiplet slots.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: July 12, 2022
    Assignee: Intel Corporation
    Inventors: Altug Koker, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Josh Mastronarde, Naveen Matam, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
  • Patent number: 11385952
    Abstract: Apparatus and method for scalable error reporting. For example, one embodiment of an apparatus comprises error detection circuitry to detect an error in a component of a first tile within a tile-based hierarchy of a processing device; error classification circuitry to classify the error and record first error data based on the classification; a first tile interface to combine the first error data with second error data received from one or more other components associated with the first tile to generate first accumulated error data; and a master tile interface to combine the first accumulated error data with second accumulated error data received from at least one other tile interface to generate second accumulated error data and to provide the second accumulated error data to a host executing an application to process the second accumulated error data.
    Type: Grant
    Filed: February 9, 2021
    Date of Patent: July 12, 2022
    Assignee: INTEL CORPORATION
    Inventors: Balaji Vembu, Bryan White, Ankur Shah, Murali Ramadoss, David Puffer, Altug Koker, Aditya Navale, Mahesh Natu
  • Patent number: 11379235
    Abstract: A mechanism is described for facilitating intelligent dispatching and vectorizing at autonomous machines. A method of embodiments, as described herein, includes detecting a plurality of threads corresponding to a plurality of workloads associated with tasks relating to a graphics processor. The method may further include determining a first set of threads of the plurality of threads that are similar to each other or have adjacent surfaces, and physically clustering the first set of threads close together using a first set of adjacent compute blocks.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: July 5, 2022
    Assignee: Intel Corporation
    Inventors: Feng Chen, Narayan Srinivasa, Abhishek R. Appu, Altug Koker, Kamal Sinha, Balaji Vembu, Joydeep Ray, Nicolas C. Galoppo Von Borries, Prasoonkumar Surti, Ben J. Ashbaugh, Sanjeev Jahagirdar, Vasanth Ranganathan
  • Publication number: 20220206853
    Abstract: In an example, an apparatus comprises a plurality of execution units comprising at least a first type of execution unit and a second type of execution unit and logic, at least partially including hardware logic, to analyze a workload and assign the workload to one of the first type of execution unit or the second type of execution unit. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: November 5, 2021
    Publication date: June 30, 2022
    Applicant: Intel Corporation
    Inventors: Abhishek R Appu, Altug Koker, Balaji Vembu, Joydeep Ray, Kamal Sinha, Prasoonkumar Surti, Kiran C. Veernapu, Subramaniam Maiyuran, Sanjeev S. Jahagirdar, Eric J. Asperheim, Guei-Yuan Lueh, David Puffer, Wenyin Fu, Nikos Kaburlasos, Bhushan M. Borole, Josh B. Mastronarde, Linda L. Hurd, Travis T. Schluessler, Tomasz Janczak, Abhishek Venkatesh, Kai Xiao, Slawomir Grajewski
  • Publication number: 20220206990
    Abstract: In an example, an apparatus comprises a plurality of execution units, and a first memory communicatively couple to the plurality of execution units, wherein the first shared memory is shared by the plurality of execution units and a copy engine to copy context state data from at least a first of the plurality of execution units to the first shared memory. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: December 23, 2021
    Publication date: June 30, 2022
    Applicant: Intel Corporation
    Inventors: Altug Koker, Prasoonkumar Surti, David Puffer, Subramaniam Maiyuran, Guei-Yuan Lueh, Abhishek R. Appu, Joydeep Ray, Balaji Vembu, Tomer Bar-On, Andrew T. Lauritzen, Hugues Labbe, John G. Gierach, Gabor Liktor
  • Patent number: 11373269
    Abstract: An apparatus to facilitate cache replacement is disclosed. The apparatus includes a cache memory and cache replacement logic to manage data in the cache memory. The cache replacement logic includes tracking logic to track addresses accessed at the cache memory and replacement control logic to monitor the tracking logic and apply a replacement policy based on information received from the tracking logic.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: June 28, 2022
    Assignee: Intel Corporation
    Inventors: Altug Koker, Joydeep Ray, Abhishek R. Appu, Vasanth Ranganathan
  • Publication number: 20220197800
    Abstract: Graphics processors of the present design provide hierarchical open sectors and variable cache sizes for cache operations. In one embodiment, a graphics processor comprises a cache memory having a hierarchical open sector design including a first hierarchy of upper and lower regions with each region including a second hierarchy of sectors. A cache controller is configured to initially open a first sector of the lower region, to receive a memory request that does not match an address in the first sector, and to open a second sector of the lower region.
    Type: Application
    Filed: March 14, 2020
    Publication date: June 23, 2022
    Applicant: Intel Corporation
    Inventors: Abhishek Appu, Lakshminarayanan Striramassarma, Altug Koker, Sean Coleman, Varghese George, Arthur Hunter, Jr., Brent Insko, Scott Janus, Elmoustapha Ould-Ahmed-Vall, Vasanth Ranganathan, Joydeep Ray, Kamal Sinha, Prasoonkumar Surti, Karthik Vaidyanathan
  • Publication number: 20220197806
    Abstract: Embodiments disclosed herein include memory architectures with stacked memory dies. In an embodiment, an electronic device comprises a base die and an array of memory dies over and electrically coupled to the base die. In an embodiment, the array of memory dies comprise caches. In an embodiment, a compute die is over and electrically coupled to the array of memory dies. In an embodiment, the compute die comprises a plurality of execution units.
    Type: Application
    Filed: December 23, 2020
    Publication date: June 23, 2022
    Inventors: Shigeki TOMISHIMA, Satish DAMARAJU, Altug KOKER
  • Publication number: 20220197362
    Abstract: In one embodiment, a processor includes: a graphics processor to execute a workload; and a power controller coupled to the graphics processor. The power controller may include a voltage ramp circuit to receive a request for the graphics processor to operate at a first performance state having a first operating voltage and a first operating frequency and cause an output voltage of a voltage regulator to increase to the first operating voltage. The voltage ramp circuit may be configured to enable the graphics processor to execute the workload at an interim performance state having an interim operating voltage and an interim operating frequency when the output voltage reaches a minimum operating voltage. Other embodiments are described and claimed.
    Type: Application
    Filed: November 2, 2021
    Publication date: June 23, 2022
    Inventors: Altug Koker, Abhishek R. Appu, Bhushan M. Borole, Wenyin Fu, Kamal Sinha, Joydeep Ray
  • Publication number: 20220188967
    Abstract: A disaggregated processor package can be configured to accept interchangeable chiplets. Interchangeability is enabled by specifying a standard physical interconnect for chiplets that can enable the chiplet to interface with a fabric or bridge interconnect. Chiplets from different IP designers can conform to the common interconnect, enabling such chiplets to be interchangeable during assembly. The fabric and bridge interconnects logic on the chiplet can then be configured to confirm with the actual interconnect layout of the on-board logic of the chiplet. Additionally, data from chiplets can be transmitted across an inter-chiplet fabric using encapsulation, such that the actual data being transferred is opaque to the fabric, further enable interchangeability of the individual chiplets, With such an interchangeable design, cache or DRAM memory can be inserted into memory chiplet slots, while compute or graphics chiplets with a higher or lower core count can be inserted into logic chiplet slots.
    Type: Application
    Filed: March 2, 2022
    Publication date: June 16, 2022
    Applicant: Intel Corporation
    Inventors: Altug Koker, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Josh Mastronarde, Naveen Matam, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
  • Publication number: 20220187897
    Abstract: Described herein are various embodiments of reducing dynamic power consumption within a processor device. One embodiment provides a technique for dynamic link width reduction based on throughput demand for client of an interconnect fabric. One embodiment provides for a parallel processor comprising an interconnect fabric including a dynamically configurable bus widths and frequencies.
    Type: Application
    Filed: December 27, 2021
    Publication date: June 16, 2022
    Applicant: Intel Corporation
    Inventors: Mohammed Tameem, Altug Koker, Kiran C. Veernapu, Abhishek R. Appu, Ankur N. Shah, Joydeep Ray, Travis T. Schluessler, Jonathan Kennedy
  • Patent number: 11360914
    Abstract: An apparatus and method are described for implementing memory management in a graphics processing system. For example, one embodiment of an apparatus comprises: a first plurality of graphics processing resources to execute graphics commands and process graphics data; a first memory management unit (MMU) to communicatively couple the first plurality of graphics processing resources to a system-level MMU to access a system memory; a second plurality of graphics processing resources to execute graphics commands and process graphics data; a second MMU to communicatively couple the second plurality of graphics processing resources to the first MMU; wherein the first MMU is configured as a master MMU having a direct connection to the system-level MMU and the second MMU comprises a slave MMU configured to send memory transactions to the first MMU, the first MMU either servicing a memory transaction or sending the memory transaction to the system-level MMU on behalf of the second MMU.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: June 14, 2022
    Assignee: Intel Corporation
    Inventors: Niranjan L. Cooray, Abhishek R. Appu, Altug Koker, Joydeep Ray, Balaji Vembu, Pattabhiraman K, David Puffer, David J. Cowperthwaite, Rajesh M. Sankaran, Satyeshwar Singh, Sameer Kp, Ankur N. Shah, Kun Tian