Patents by Inventor Altug Koker

Altug Koker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11675597
    Abstract: An apparatus to facilitate thread scheduling is disclosed. In one embodiment the apparatus includes a processor comprising a plurality of multiprocessors comprising single-instruction multiple thread (SIMT) execution circuitry to simultaneously execute multiple threads, a shared local memory to be shared by the multiple threads, and scheduling hardware logic to schedule the multiple threads in a thread group for execution across the plurality of multiprocessors in accordance with barrier data. The instructions of the multiple threads are to produce shared data to be stored in the shared local memory when executed by the plurality of multiprocessors, wherein additional instructions of at least a first thread of the multiple threads are to use the shared data, and wherein, in accordance with the barrier data, the first thread is to wait for other threads of the multiple threads to finish producing the shared data before executing the additional instructions.
    Type: Grant
    Filed: August 31, 2022
    Date of Patent: June 13, 2023
    Assignee: Intel Corporation
    Inventors: Balaji Vembu, Abhishek R. Appu, Joydeep Ray, Altug Koker
  • Publication number: 20230177817
    Abstract: A mechanism is described for facilitating recognition, reidentification, and security in machine learning at autonomous machines. A method of embodiments, as described herein, includes facilitating a camera to detect one or more objects within a physical vicinity, the one or more objects including a person, and the physical vicinity including a house, where detecting includes capturing one or more images of one or more portions of a body of the person. The method may further include extracting body features based on the one or more portions of the body, comparing the extracted body features with feature vectors stored at a database, and building a classification model based on the extracted body features over a period of time to facilitate recognition or reidentification of the person independent of facial recognition of the person.
    Type: Application
    Filed: October 14, 2022
    Publication date: June 8, 2023
    Applicant: Intel Corporation
    Inventors: BARNAN DAS, MAYURESH M. VARERKAR, NARAYAN BISWAL, STANLEY J. BARAN, GOKCEN CILINGIR, NILESH V. SHAH, ARCHIE SHARMA, SHERINE ABDELHAK, PRANEETHA KOTHA, NEELAY PANDIT, JOHN C. WEAST, MIKE B. MACPHERSON, DUKHWAN KIM, LINDA L. HURD, ABHISHEK R. APPU, ALTUG KOKER, JOYDEEP RAY
  • Patent number: 11669932
    Abstract: A mechanism is described for facilitating sharing of data and compression expansion of models at autonomous machines. A method of embodiments, as described herein, includes detecting a first processor processing information relating to a neural network at a first computing device, where the first processor comprises a first graphics processor and the first computing device comprises a first autonomous machine. The method further includes facilitating the first processor to store one or more portions of the information in a library at a database, where the one or more portions are accessible to a second processor of a computing device.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: June 6, 2023
    Assignee: INTEL CORPORATION
    Inventors: Abhishek R. Appu, Altug Koker, John C. Weast, Mike B. Macpherson, Dukhwan Kim, Linda L. Hurd, Sara S. Baghsorkhi, Justin E. Gottschlich, Prasoonkumar Surti, Chandrasekaran Sakthivel, Joydeep Ray
  • Patent number: 11663746
    Abstract: Embodiments described herein provided for an instruction and associated logic to enable a processing resource including a tensor accelerator to perform optimized computation of sparse submatrix operations. One embodiment provides hardware logic to apply a numerical transform to matrix data to increase the sparsity of the data. Increasing the sparsity may result in a higher compression ratio when the matrix data is compressed.
    Type: Grant
    Filed: November 11, 2020
    Date of Patent: May 30, 2023
    Assignee: Intel Corporation
    Inventors: Abhishek R. Appu, Prasoonkumar Surti, Jill Boyce, Subramaniam Maiyuran, Michael Apodaca, Adam T. Lake, James Holland, Vasanth Ranganathan, Altug Koker, Lidong Xu, Nikos Kaburlasos
  • Patent number: 11650928
    Abstract: A mechanism is described for facilitating optimization of cache associated with graphics processors at computing devices. A method of embodiments, as described herein, includes introducing coloring bits to contents of a cache associated with a processor including a graphics processor, wherein the coloring bits to represent a signal identifying one or more caches available for use, while avoiding explicit invalidations and flushes.
    Type: Grant
    Filed: April 7, 2022
    Date of Patent: May 16, 2023
    Assignee: INTEL CORPORATION
    Inventors: Altug Koker, Balaji Vembu, Joydeep Ray, Abhishek R. Appu
  • Patent number: 11652060
    Abstract: A method is disclosed. The method includes a plurality of semiconductor sections and an interconnection structure connecting the plurality of semiconductor sections to provide a functionally monolithic base die. The interconnection structure includes one or more bridge die to connect one or more of the plurality of semiconductor sections to one or more other semiconductor sections or a top layer interconnect structure that connects the plurality of semiconductor sections or both the one or more bridge die and the top layer interconnect structure.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: May 16, 2023
    Assignee: Intel Corporation
    Inventors: Wilfred Gomes, Mark Bohr, Rajabali Koduri, Leonard Neiberg, Altug Koker, Swaminathan Sivakumar
  • Publication number: 20230142472
    Abstract: In accordance with some embodiments, the render rate is varied across and/or up and down the display screen. This may be done based on where the user is looking in order to reduce power consumption and/or increase performance. Specifically the screen display is separated into regions, such as quadrants. Each of these regions is rendered at a rate determined by at least one of what the user is currently looking at, what the user has looked at in the past and/or what it is predicted that the user will look at next. Areas of less focus may be rendered at a lower rate, reducing power consumption in some embodiments.
    Type: Application
    Filed: October 4, 2022
    Publication date: May 11, 2023
    Inventors: Eric J. Asperheim, Subramaniam Maiyuran, Kiran C. Veernapu, Sanjeev S. Jahagirdar, Balaji Vembu, Devan Burke, Philip R. Laws, Kamal Sinha, Abhishek R. Appu, Elmoustapha Ould-Ahmed-Vall, Peter L. Doyle, Joydeep Ray, Travis T. Schluessler, John H. Feit, Nikos Kaburlasos, Jacek Kwiatkowski, Altug Koker
  • Patent number: 11636831
    Abstract: Methods and apparatus relating to an adaptive multibit bus for energy optimization are described. In an embodiment, a 1-bit interconnect of a processor is caused to select between a plurality of operational modes. The plurality of operational modes comprises a first mode and a second mode. The first mode causes transmission of a single bit over the 1-bit interconnect at a first frequency and the second mode causes transmission of a plurality of bits over the 1-bit interconnect at a second frequency based at least in part on a determination that an operating voltage of the 1-bit interconnect is at a high voltage level and that the second frequency is lower than the first frequency. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: April 25, 2023
    Assignee: Intel Corporation
    Inventors: Sanjeev S. Jahagirdar, Tapan A. Ganpule, Anupama A. Thaploo, Abhishek R. Appu, Joydeep Ray, Altug Koker
  • Patent number: 11631198
    Abstract: An apparatus to facilitate compute compression is disclosed. The apparatus includes a graphics processing unit including mapping logic to map a first block of integer pixel data to a compression block and compression logic to compress the compression block.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: April 18, 2023
    Assignee: Intel Corporation
    Inventors: Abhishek Appu, Altug Koker, Joydeep Ray, Balaji Vembu, Prasoonkumar Surti, Kamal Sinha, Nadathur Rajagopalan Satish, Narayan Srinivasa, Feng Chen, Dukhwan Kim, Farshad Akhbari
  • Publication number: 20230109990
    Abstract: One embodiment provides a graphics processor including an active base die including a fabric interconnect and a chiplet including a switched fabric, wherein the chiplet couples with the active base die via an array of interconnect structures, the array of interconnect structures couple the fabric interconnect with the switched fabric, and the chiplet includes a first modular interconnect configured to couple a block of graphics processing resources to the switched fabric and a second modular interconnect configured to couple a memory subsystem with the switched fabric and the block of graphics processing resources, the memory interconnect including a set of memory controllers and a set of physical interfaces.
    Type: Application
    Filed: October 7, 2021
    Publication date: April 13, 2023
    Applicant: Intel Corporation
    Inventors: Lakshminarayana Pappu, Altug Koker, Aditya Navale, Prasoonkumar Surti, Ankur Shah, Joydeep Ray, Naveen Matam
  • Publication number: 20230114271
    Abstract: An apparatus to facilitate a system-on-a-chip (SoC) architecture for low power state communication is disclosed. The apparatus includes a low power state fabric to provide a low power state path that avoids compute processing resources of the apparatus, and a low power state agent circuitry communicably coupled to the low power state fabric to update, in response to initiation of a low power state in the apparatus, a configuration of routers of the low power state fabric to utilize the low power state path provided by the low power state fabric, and to route memory transactions to the low power state path while the apparatus is in the low power state.
    Type: Application
    Filed: October 7, 2021
    Publication date: April 13, 2023
    Applicant: Intel Corporation
    Inventors: Lakshminarayana Pappu, Altug Koker, Naveen Kanumuri
  • Publication number: 20230114164
    Abstract: In a further embodiment, a system on a chip integrated circuit (SoC) is provided that includes an active base die including a first cache memory, a first die mounted on and coupled with the active base die, and a second die mounted on the active base die and coupled with the active base die and the first die. The first die includes an interconnect fabric, an input/output interface, and an atomic operation handler. The second die includes an array of graphics processing elements and an interface to the first cache memory of the active base die. At least one of the graphics processing elements are configured to perform, via the atomic operation handler, an atomic operation to a memory device.
    Type: Application
    Filed: December 15, 2021
    Publication date: April 13, 2023
    Applicant: Intel Corporation
    Inventors: Rahul Pal, Aravindh Anantaraman, Lakshminarayana Pappu, Dongsheng Bi, Guadalupe J. Garcia, Altug Koker, Joydeep Ray, Rahul Joshi, Shrikul Atulkumar Joshi, Mahak Gupta
  • Publication number: 20230104845
    Abstract: One embodiment provides a graphics processor including a processing resource including a register file, memory, a cache, and load/store/cache circuitry to process load, store, and prefetch messages from the processing resource. The circuitry will sort received memory access messages into address sorted lists of reads and writes. The circuitry schedules a first set of address sorted requests from a first request buffer for a first period of time, then schedules a second set of address sorted requests from a second request buffer for a second period of time.
    Type: Application
    Filed: September 24, 2021
    Publication date: April 6, 2023
    Applicant: Intel Corporation
    Inventors: Joydeep Ray, Abhishek R. Appu, Altug Koker, Aditya Navale, Varghese George, Vasanth Ranganathan, Fangwen Fu, Ben J. Ashbaugh, Vidhya Krishnan, Sabareesh Ganapathy, Prathamesh Raghunath Shinde
  • Patent number: 11620256
    Abstract: Systems and methods for improving cache efficiency and utilization are disclosed. In one embodiment, a graphics processor includes processing resources to perform graphics operations and a cache controller of a cache coupled to the processing resources. The cache controller is configured to control cache priority by determining whether default settings or an instruction will control cache operations for the cache.
    Type: Grant
    Filed: April 28, 2022
    Date of Patent: April 4, 2023
    Assignee: Intel Corporation
    Inventors: Altug Koker, Joydeep Ray, Ben Ashbaugh, Jonathan Pearce, Abhishek Appu, Vasanth Ranganathan, Lakshminarayanan Striramassarma, Elmoustapha Ould-Ahmed-Vall, Aravindh Anantaraman, Valentin Andrei, Nicolas Galoppo Von Borries, Varghese George, Yoav Harel, Arthur Hunter, Jr., Brent Insko, Scott Janus, Pattabhiraman K, Mike Macpherson, Subramaniam Maiyuran, Marian Alin Petre, Murali Ramadoss, Shailesh Shah, Kamal Sinha, Prasoonkumar Surti, Vikranth Vemulapalli
  • Patent number: 11620723
    Abstract: One embodiment provides a graphics processor including a plurality of processing clusters, each processing cluster including a plurality of multiprocessors and a data interconnect coupled to the plurality of multiprocessors. At least one multiprocessor of the plurality of multiprocessors is configured to share data with another multiprocessor over the data interconnect.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: April 4, 2023
    Assignee: Intel Corporation
    Inventors: Balaji Vembu, Altug Koker, Joydeep Ray
  • Patent number: 11615584
    Abstract: Briefly, in accordance with one or more embodiments, a processor performs a coarse depth test on pixel data, and performs a final depth test on the pixel data. Coarse depth data is stored in a coarse depth cache, and per pixel depth data is stored in a per pixel depth cache. If a result of the coarse depth test is ambiguous, the processor is to read the per pixel depth data from the per pixel depth cache, and to update the coarse depth data with the per pixel depth data if the per pixel depth data has a smaller depth range than the coarse depth data.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: March 28, 2023
    Assignee: Intel Corporation
    Inventors: Vasanth Ranganathan, Saikat Mandal, Saurabh Sharma, Vamsee Vardhan Chivukula, Karol A. Szerszen, Aleksander Olek Neyman, Altug Koker, Prasoonkumar Surti, Abhishek Appu, Joydeep Ray, Art Hunter, Luis F. Cruz Camacho, Akshay R. Chada
  • Patent number: 11610564
    Abstract: A mechanism is described for facilitating consolidated compression/de-compression of graphics data streams of varying types at computing devices. A method of embodiments, as described herein, includes generating a common sector cache relating to a graphics processor. The method may further include performing a consolidated compression of multiple types of graphics data streams associated with the graphics processor using the common sector cache.
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: March 21, 2023
    Assignee: Intel Corporation
    Inventors: Abhishek R. Appu, Joydeep Ray, Prasoonkumar Surti, Altug Koker, Kiran C. Veernapu, Erik G. Liskay
  • Patent number: 11609856
    Abstract: In an example, an apparatus comprises a plurality of processing unit cores, a plurality of cache memory modules associated with the plurality of processing unit cores, and a machine learning model communicatively coupled to the plurality of processing unit cores, wherein the plurality of cache memory modules share cache coherency data with the machine learning model. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: March 21, 2023
    Assignee: INTEL CORPORATION
    Inventors: Chandrasekaran Sakthivel, Prasoonkumar Surti, John C. Weast, Sara S. Baghsorkhi, Justin E. Gottschlich, Abhishek R. Appu, Nicolas C. Galoppo Von Borries, Joydeep Ray, Narayan Srinivasa, Feng Chen, Ben J. Ashbaugh, Rajkishore Barik, Tsung-Han Lin, Kamal Sinha, Eriko Nurvitadhi, Balaji Vembu, Altug Koker
  • Publication number: 20230061670
    Abstract: One embodiment provides an apparatus comprising a memory stack including multiple memory dies and a parallel processor including a plurality of multiprocessors. Each multiprocessor has a single instruction, multiple thread (SIMT) architecture, the parallel processor coupled to the memory stack via one or more memory interfaces. At least one multiprocessor comprises a multiply-accumulate circuit to perform multiply-accumulate operations on matrix data in a stage of a neural network implementation to produce a result matrix comprising a plurality of matrix data elements at a first precision, precision tracking logic to evaluate metrics associated with the matrix data elements and indicate if an optimization is to be performed for representing data at a second stage of the neural network implementation, and a numerical transform unit to dynamically perform a numerical transform operation on the matrix data elements based on the indication to produce transformed matrix data elements at a second precision.
    Type: Application
    Filed: November 1, 2022
    Publication date: March 2, 2023
    Applicant: Intel Corporation
    Inventors: Elmoustapha Ould-Ahmed-Vall, Sara S. Baghsorkhi, Anbang Yao, Kevin Nealis, Xiaoming Chen, Altug Koker, Abhishek R. Appu, John C. Weast, Mike B. Macpherson, Dukhwan Kim, Linda L. Hurd, Ben J. Ashbaugh, Barath Lakshmanan, Liwei Ma, Joydeep Ray, Ping T. Tang, Michael S. Strickland
  • Publication number: 20230061331
    Abstract: One embodiment provides a multi-chip module accelerator usable to execute tensor data processing operations a multi-chip module. The multi-chip module may include a memory stack including multiple memory dies and parallel processor circuitry communicatively coupled to the memory stack. The parallel processor circuitry may include multiprocessor cores to execute matrix multiplication and accumulate operations. The matrix multiplication and accumulate operations may include floating-point operations that are configurable to include two-dimensional matrix multiply and accumulate operations involving inputs that have differing floating-point precisions. The floating-point operations may include a first operation at a first precision and a second operation at a second precision. The first operation may include a multiply having at least one 16-bit floating-point input and the second operation may include an accumulate having a 32-bit floating-point input.
    Type: Application
    Filed: October 5, 2022
    Publication date: March 2, 2023
    Applicant: Intel Corporation
    Inventors: Elmoustapha Ould-Ahmed-Vall, Sara S. Baghsorkhi, Anbang Yao, Kevin Nealis, Xiaoming Chen, Altug Koker, Abhishek R. Appu, John C. Weast, Mike B. Macpherson, Dukhwan Kim, Linda L. Hurd, Ben J. Ashbaugh, Barath Lakshmanan, Liwei Ma, Joydeep Ray, Ping T. Tang, Michael S. Strickland