Patents by Inventor Alvin Diep

Alvin Diep has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Secure circuit assembly
    Patent number: 7549064
    Abstract: A secure circuit assembly includes a printed circuit board including first and second surfaces and a secure boundary area in the first surface. A circuit to be protected is located in the secure boundary area. A first inner enclosure is attached to the first surface of the printed circuit board and covers the secure boundary area in the first surface. A first sensor film is attached to the first inner enclosure and is electrically coupled to the printed circuit board. The secure circuit assembly also includes first and second outer enclosures, the first outer enclosure covering the first inner enclosure and the second outer enclosure covering the second inner enclosure. A method for providing security to a circuit assembly is also disclosed.
    Type: Grant
    Filed: May 10, 2005
    Date of Patent: June 16, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Arcadi Elbert, Alvin Diep
  • Secure circuit assembly
    Publication number: 20060259788
    Abstract: A secure circuit assembly includes a printed circuit board including first and second surfaces and a secure boundary area in the first surface. A circuit to be protected is located in the secure boundary area. A first inner enclosure is attached to the first surface of the printed circuit board and covers the secure boundary area in the first surface. A first sensor film is attached to the first inner enclosure and is electrically coupled to the printed circuit board. The secure circuit assembly also includes first and second outer enclosures, the first outer enclosure covering the first inner enclosure and the second outer enclosure covering the second inner enclosure. A method for providing security to a circuit assembly is also disclosed.
    Type: Application
    Filed: May 10, 2005
    Publication date: November 16, 2006
    Inventors: Arcadi Elbert, Alvin Diep