Abstract: A soldering flux includes a resin in an aqueous composition. The flux can also include an activating agent and a surface-active agent that promotes surface wetting. The flux can be used to coat circuits and a printed circuit board. The resin can be non-acidic and/or in an emulsified form.

Abstract: A soldering flux includes a non-acidic resin in an aqueous composition. The flux can also include an activating agent and a surface-active agent that promotes surface wetting.

Abstract: A rosin-free, low VOC, no-clean soldering flux consists essentially of one or more halide-free carboxylic acid activators in an aggregate amount not exceeding about 8% by weight of the flux; one or more alkyl amines capable of forming amine salt of the one or more activators and in an aggregate amount not exceeding about 10% by weight of the flux; and water, with or without a surfactant. The flux is particularly useful in a method of producing soldered printed wiring assemblies with minimal residual ionic contamination, so that post-soldering cleaning of the assemblies is unnecessary.

Abstract: A no-clean soldering flux consists essentially of one or more halide-free, water soluble activators in an aggregate amount not exceeding about 5% by weight of the flux, a water soluble fluorinated surfactant in an amount not exceeding about 1% by weight of the flux, and water. The flux is substantially VOC-free and is particularly useful in a method of producing soldered printed wiring assemblies with minimal residual ionic contamination, so that post-soldering cleaning of the assemblies is unnecessary. The absence of significant amounts of VOC's and the elimination of post-soldering cleaning result in substantial environmental and production-related benefits.

Abstract: Improved cleaning compositions for the removal of various forms of contamination from printed circuit boards and other related electronic equipment in vapor cleaning processes are disclosed, including major amounts of 1,1,1-trichloroethane and an amount of normal propanol less than that in the true azeotropic mixture of these components, generally from about 1.0 to less than 4.75 weight percent of the normal propanol. In addition, vapor cleaning processes utilizing such solvent compositions are also disclosed, and in a preferred embodiment, the composition includes about 96.0 weight percent of the 1,1,1-trichloroethane and about 4.0 weight percent of the normal propanol.