Abstract: A low-profile crystal package wherein the wire bonding operation from the electrode pattern of the crystal plate to the terminal posts may be accomplished without fear of fracture of the crystal plate itself. The crystal blank is positioned on a support member which in turn initially sits on a ring of indium. In this position, the crystal blank is not in contact with the split center support post whose top surface is covered with indium paste, and is supported around its periphery during wire bonding. When all the wire bonding operations are effectuated, the assembly is subjected to sufficient heat wherein the indium material will melt, which will cause the support member to be drawn downward, thereby resulting in the crystal plate being supported and fastened only by the center supports, with the periphery of the crystal plate being free to vibrate with no extraneous dampened support.

Abstract: A low-profile crystal package wherein the wire bonding operation from the electrode pattern of the crystal plate to the terminal posts may be accomplished without fear of fracture of the crystal plate itself. The crystal blank is positioned on a support member which in turn initially sits on a ring of indium. In this position, the crystal blank is not in contact with the split center support post whose top surface is covered with indium paste, and is supported around its periphery during wire bonding. When all the wire bonding operations are effectuated, the assembly is subjected to sufficient heat wherein the indium material will melt, which will cause the support member to be drawn downward, thereby resulting in the crystal plate being supported and fastened only by the center supports, with the periphery of the crystal plate being free to vibrate with no extraneous dampened support.

Abstract: An adjustable transducer apparatus includes a transducer fixedly mounted on a metal plate, a saucer-shaped housing with a pair of concentric inner ridges, a planar annular cover plate, the rim of which rests of the outer ridge, a transducer element fixedly mounted on a metal plate, the rim of the metal plate resting on the inner edge, an "O" ring disposed in the housing between the cover plate and the metal plate for cushioning the metal plate against the housing, and a plurality of screws for adjustably fastening the cover plate against the housing so that the cover plate is pivoted about the outer ridge to produce a compression on the "O" ring, and that said "O" ring in turn holds the metal plate in place in the housing. The maximum alertness of the transducer is obtained by adjusting the screws and thereby adjusting the chamber formed by the housing and the planar annular cover plate.

Abstract: A crystal plate is mounted on a pedestal area of an inverted bridge structure positioned within a depressed area of a crystal carrier. The plate is supported on the upper surface of the carrier until the wire bonding process is complete, then the ends of the bridge are forced down against support pins on the carrier and are welded into place. As the ends of the bridge are forced down, the center portion of the bridge is raised, elevating the crystal plate above the carrier surface for free vibration.

Abstract: A three position switch which selectively interconnects isolated conductors on a printed circuit board is disclosed. In one embodiment, pressure sensitive conductive elastomer pads, disposed in the switch, are brought into contact with isolated conductors on a substrate. A sliding switch actuator, having a cam surface with indentations, is then used to selectively apply pressure to the conductive elastomer pads and thereby selectively connect the isolated printed circuit board conductors. In another embodiment, a three position switch is shown including a plurality of conductive pads, flexibly attached to a switch casing, which are positioned above printed circuit board isolated conductors and then selectively flexed downward into contact with the printed circuit board conductors by moving a sliding actuator arm having a cam surface.

Abstract: An improved data terminal utilizing tactile switch assemblies with specialized sound apertures provide reduced panel space requirements and indirect sound paths for miniature electronic apparatus. A maximum number of switches can be accommodated on the instrument panel with no separate speaker/microphone grille required. Non-aligned sound apertures provide maximal weather protection for speaker and microphone mounted behind the switch assembly panel. The switch assembly design seals off the remainder of the unit from weather or dust damage.