Patents by Inventor Alvin H. Heimbuch

Alvin H. Heimbuch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structural panels
    Patent number: 4647615
    Abstract: Vinyl pyridines including vinyl stilbazole materials and vinyl styrylpyridine oligomer materials are disclosed. These vinylpyridines form copolymers with bismaleimides which copolymers have good fire retardancy and decreased brittleness. The cure temperatures of the copolymers and substantially below the cure temperatures of the bismaleimides alone. Reinforced composites made from the cured copolymers are disclosed as well.
    Type: Grant
    Filed: April 22, 1985
    Date of Patent: March 3, 1987
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: John A. Parker, Alvin H. Heimbuch, Ming-Ta S. Hsu, Timothy S. Chen
  • Vinyl stilbazoles
    Patent number: 4626593
    Abstract: Vinyl pyridines including vinyl stilbazole materials and vinyl styrylpyridine oligomer materials are disclosed. These vinylpyridines form copolymers with bismaleimides which copolymers have good fire retardancy and decreased brittleness. The cure temperatures of the copolymers are substantially below the cure temperatures of the bismaleimides alone. Reinforced composites made from the cured copolymers are disclosed as well.
    Type: Grant
    Filed: April 22, 1985
    Date of Patent: December 2, 1986
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: John A. Parker, Alvin H. Heimbuch, Ming-Ta S. Hsu, Timothy S. Chen
  • Process for curing bismaleimide resins
    Patent number: 4618652
    Abstract: When vinyl pyridines including vinyl stilbazole materials and vinyl styrylpyridine oligomer materials are admixed with bismaleimides and cured to form copolymers the cure temperatures of the copolymers are substantially below the cure temperatures of the bismaleimides alone.
    Type: Grant
    Filed: April 22, 1985
    Date of Patent: October 21, 1986
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: John A. Parker, Alvin H. Heimbuch, Ming-ta S. Hsu, Timothy S. Chen
  • High performance mixed bisimide resins and composites based thereon
    Patent number: 4568733
    Abstract: The present invention relates to mixed bismaleimide/biscitraconimide resins. Mixtures of the two resins produces materials which have better handling, processing or mechanical and thermal properties, particularly in graphite composites, than materials made with the individual resins. The mechanical strength of cured graphite composites prepared from a 1:1 copolymer of such bisimide resins is excellent at both ambient and elevated temperatures. The copolymer mixture provides improved composites which are lighter than metals and replace metals in many aerospace applications.
    Type: Grant
    Filed: April 4, 1985
    Date of Patent: February 4, 1986
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: John A. Parker, Alvin H. Heimbuch, Ming-ta S. Hsu, Timothy S. Chen
  • Copolymers of vinyl styrlpyridines or vinyl stilbazoles with bismaleimide
    Patent number: 4526925
    Abstract: Vinyl pyridines including vinyl stilbazole materials and vinyl styrylpyridine oligomer materials are disclosed. These vinylpyridines form copolymers with bismaleimides which copolymers have good fire retardancy and decreased brittleness. The cure temperatures of the copolymers are substantially below the cure temperatures of the bismaleimides alone. Reinforced composites made from the cured copolymers are disclosed as well.
    Type: Grant
    Filed: November 18, 1983
    Date of Patent: July 2, 1985
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: John A. Parker, Alvin H. Heimbuch, Ming-Ta S. Hsu, Timothy S. Chen