Patents by Inventor Alvin Wen Jie CHIA

Alvin Wen Jie CHIA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Placing and solving constraints on a 3D environment
    Patent number: 10748346
    Abstract: Systems and methods are disclosed for permitting the use of a natural language expression to specify object (or asset) locations in a virtual three-dimensional (3D) environment. By rapidly identifying and solving constraints for 3D object placement and orientation, consumers of synthetics services may more efficiently generate experiments for use in development of artificial intelligence (AI) algorithms and sensor platforms. Parsing descriptive location specifications, sampling the volumetric space, and solving pose constraints for location and orientation, can produce large numbers of designated coordinates for object locations in virtual environments with reduced demands on user involvement.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: August 18, 2020
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Alvin Wen Jie Chia, Michael J. Ebstyne, Larry Marvin Wall, Trebor L. Connell
  • PLACING AND SOLVING CONSTRAINTS ON A 3D ENVIRONMENT
    Publication number: 20190378340
    Abstract: Systems and methods are disclosed for permitting the use of a natural language expression to specify object (or asset) locations in a virtual three-dimensional (3D) environment. By rapidly identifying and solving constraints for 3D object placement and orientation, consumers of synthetics services may more efficiently generate experiments for use in development of artificial intelligence (AI) algorithms and sensor platforms. Parsing descriptive location specifications, sampling the volumetric space, and solving pose constraints for location and orientation, can produce large numbers of designated coordinates for object locations in virtual environments with reduced demands on user involvement.
    Type: Application
    Filed: June 8, 2018
    Publication date: December 12, 2019
    Inventors: Alvin Wen Jie CHIA, Michael J. EBSTYNE, Larry Marvin WALL, Trebor L. CONNELL