Patents by Inventor Alvin Yong Shee Meng

Alvin Yong Shee Meng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for a ground wire bonding attachment in MMIC devices
    Patent number: 11784146
    Abstract: An apparatus and method for co-axial wire bonding to improve impedance and electrical package connection performance of a substrate attached to the interior of an electrical device package. One or more wire bonds making ground connections between a package and an internal electrical circuit substrate make a non-contact geometrical crossing over an active electrical signal wire.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: October 10, 2023
    Assignee: Scientific Components Corporation
    Inventors: Fuad Haji Mokhtar, Goh Chee Kheng, Khor Gang Quan, Alvin Yong Shee Meng