Patents by Inventor Alwin S. Daus

Alwin S. Daus has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-layered semiconductive device and methodology with polymer and transition metal dichalcogenide material
    Patent number: 11908690
    Abstract: In certain examples, methods and semiconductor structures are directed to multilayered structures including TMD (transition metal dichalcogenide material or TMD-like material and a polymer-based layer which is characterized as exhibiting flexibility. A first layer including a TMD-based material (e.g., an atomic-thick layer including TMD) or TMD-like material is provided or grown on a surface which in certain instances may be a rigid platform or substrate. A plurality of electrodes are provided on or as part of the first layer, and another layer or film including polymer is applied to cover the first layer and the electrodes. The other layer is integrated with the TMD material or TMD-like material and the first layer, and the other layer provides a flexible substrate such as when released from the exemplary rigid platform or substrate.
    Type: Grant
    Filed: June 19, 2020
    Date of Patent: February 20, 2024
    Assignee: The Board of Trustees of the Leland Stanford Junior University
    Inventors: Alwin S. Daus, Sam Vaziri, Eric Pop
  • MULTI-LAYERED SEMICONDUCTIVE DEVICE AND METHODOLOGY WITH POLYMER AND TRANSITION METAL DICHALCOGENIDE MATERIAL
    Publication number: 20220246430
    Abstract: In certain examples, methods and semiconductor structures are directed to multilayered structures including TMD (transition metal dichalcogenide material or TMD-like material and a polymer-based layer which is characterized as exhibiting flexibility. A first layer including a TMD-based material (e.g., an atomic-thick layer including TMD) or TMD-like material is provided or grown on a surface which in certain instances may be a rigid platform or substrate. A plurality of electrodes are provided on or as part of the first layer, and another layer or film including polymer is applied to cover the first layer and the electrodes. The other layer is integrated with the TMD material or TMD-like material and the first layer, and the other layer provides a flexible substrate such as when released from the exemplary rigid platform or substrate.
    Type: Application
    Filed: June 19, 2020
    Publication date: August 4, 2022
    Inventors: Alwin S. Daus, Sam Vaziri, Eric Pop