Abstract: Structures for an electrostatic discharge control device and methods of forming same. The structure comprises a shallow trench isolation region positioned in a semiconductor substrate, and a heterojunction bipolar transistor structure. The heterojunction bipolar transistor structure includes a collector in the semiconductor substrate, an emitter, and a base positioned between a first portion of the collector and the emitter. The collector has a first conductivity type, the collector extends to a top surface of the semiconductor substrate, and the collector wraps about the shallow trench isolation region. The structure further comprises a doped region positioned in the collector adjacent to the shallow trench isolation region. The doped region has a second conductivity type opposite to the first conductivity type, and a second portion of the collector is positioned between the doped region and the top surface of the semiconductor substrate.

Abstract: In one embodiment, a capacitor-like structure is constructed that includes an RF co-sputtered TMO layer. The capacitor-like structure includes a first electrode (e.g., a bottom electrode) constructed of a first metal (e.g., Pt), a RF co-sputtered TMO layer on the first electrode including a first oxide and a second oxide (e.g., a RF co-sputtered Al2O3—NiO layer), and a second electrode constructed of a second metal (e.g., Pt) in contact with the co-sputtered TMO layer. The capacitor-like structure is resistively switchable due to formation and rupture of CFs through the RF co-sputtered TMO layer in response to application of a voltage between the first electrode and the second electrode. The RF co-sputtered TMO layer may be grown using at least one direct oxide target (e.g., a NiO target) in a noble gas (e.g., Ar) atmosphere.

Abstract: A device and a method of forming a device. The method comprises forming an oxide material film; forming two metal electrodes on the oxide material film, the two metal electrodes laterally spaced from each other such that an electric path between the two electrodes comprises at least a portion of the oxide material film; configuring the oxide material film such that a current-voltage characteristic of the device as measured via the two metal electrodes exhibits nonlinearity and rectification.

Abstract: In one embodiment, a capacitor-like structure is constructed that includes an RF co-sputtered TMO layer. The capacitor-like structure includes a first electrode (e.g., a bottom electrode) constructed of a first metal (e.g., Pt), a RF co-sputtered TMO layer on the first electrode including a first oxide and a second oxide (e.g., a RF co-sputtered Al2O3—NiO layer), and a second electrode constructed of a second metal (e.g., Pt) in contact with the co-sputtered TMO layer. The capacitor-like structure is resistively switchable due to formation and rupture of CFs through the RF co-sputtered TMO layer in response to application of a voltage between the first electrode and the second electrode. The RF co-sputtered TMO layer may be grown using at least one direct oxide target (e.g., a NiO target) in a noble gas (e.g., Ar) atmosphere.

Abstract: A device and a method of forming a device. The method comprises forming an oxide material film; forming two metal electrodes on the oxide material film, the two metal electrodes laterally spaced from each other such that an electric path between the two electrodes comprises at least a portion of the oxide material film; configuring the oxide material film such that a current-voltage characteristic of the device as measured via the two metal electrodes exhibits nonlinearity and rectification.