Patents by Inventor Aly Tootoochi

Aly Tootoochi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070117274
    Abstract: An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.
    Type: Application
    Filed: January 16, 2007
    Publication date: May 24, 2007
    Inventors: Susan Swindlehurst, Mark Hadley, Paul Drzaic, Gordon Craig, Glenn Gengel, Scott Herrmann, Aly Tootoochi, Randolph Eisenhardt
  • Patent number: 7214569
    Abstract: An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.
    Type: Grant
    Filed: January 30, 2004
    Date of Patent: May 8, 2007
    Assignee: Alien Technology Corporation
    Inventors: Susan Swindlehurst, Mark A. Hadley, Paul S. Drzaic, Gordon S. W. Craig, Glenn Gengel, Scott Hermann, Aly Tootoochi, Randolph W. Eisenhardt
  • Publication number: 20040183182
    Abstract: An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.
    Type: Application
    Filed: January 30, 2004
    Publication date: September 23, 2004
    Inventors: Susan Swindlehurst, Mark A. Hadley, Paul S. Drzaic, Gordon S.W. Craig, Glenn Gengel, Scott Herrmann, Aly Tootoochi, Randolph W. Eisenhardt