Patents by Inventor Alyson M. Tuttle

Alyson M. Tuttle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire bonded air heat sink
    Patent number: 12278159
    Abstract: An electronic device includes a semiconductor substrate and a heat sink arranged on a surface of the semiconductor substrate. The heat sink includes a plurality of metal filaments that each includes a first end joined to the surface, a second end, and a body over the surface such that the body is surrounded by a coolant medium to dissipate heat. The heat sink is not part of an electrical network.
    Type: Grant
    Filed: October 24, 2023
    Date of Patent: April 15, 2025
    Assignee: RAYTHEON TECHNOLOGIES CORPORATION
    Inventors: James S. Wilson, Alyson M. Tuttle, Karl L. Worthen
  • WIRE BONDED AIR HEAT SINK
    Publication number: 20240055318
    Abstract: An electronic device includes a semiconductor substrate and a heat sink arranged on a surface of the semiconductor substrate. The heat sink includes a plurality of metal filaments that each includes a first end joined to the surface, a second end, and a body over the surface such that the body is surrounded by a coolant medium to dissipate heat. The heat sink is not part of an electrical network.
    Type: Application
    Filed: October 24, 2023
    Publication date: February 15, 2024
    Inventors: James S. Wilson, Alyson M. Tuttle, Karl L. Worthen
  • Wire bonded air heat sink
    Patent number: 11837521
    Abstract: An electronic device includes a semiconductor substrate and a heat sink arranged on a surface of the semiconductor substrate. The heat sink includes a plurality of metal filaments that each includes a first end joined to the surface, a second end, and a body over the surface such that the body is surrounded by a coolant medium to dissipate heat. The heat sink is not part of an electrical network.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: December 5, 2023
    Assignee: RAYTHEON COMPANY
    Inventors: James S. Wilson, Alyson M. Tuttle, Karl L. Worthen
  • WIRE BONDED AIR HEAT SINK
    Publication number: 20220336319
    Abstract: An electronic device includes a semiconductor substrate and a heat sink arranged on a surface of the semiconductor substrate. The heat sink includes a plurality of metal filaments that each includes a first end joined to the surface, a second end, and a body over the surface such that the body is surrounded by a coolant medium to dissipate heat. The heat sink is not part of an electrical network.
    Type: Application
    Filed: April 19, 2021
    Publication date: October 20, 2022
    Inventors: James S. Wilson, Alyson M. Tuttle, Karl L. Worthen