Patent number: 12093100
Abstract: Hierarchical Power Management (HPM) architecture considers the limits of scaling on a power management controller, the autonomy at each die, and provides a unified view of the package to a platform. At a simplest level, HPM architecture has a supervisor and one or more supervisee power management units (PMUs) that communicate via at least two different communication fabrics. Each PMU can behave as a supervisor for a number of supervisee PMUs in a particular domain. HPM addresses these needs for products that comprise a collection of dice with varying levels of power and thermal management capabilities and needs. HPM serves as a unified mechanism than can span collection of dice of varying capability and function, which together form a traditional system-on-chip (SoC). HPM provides a basis for managing power and thermals across a diverse set of dice.
Type:
Grant
Filed:
September 26, 2020
Date of Patent:
September 17, 2024
Assignee:
Intel Corporation
Inventors:
Vivek Garg, Ankush Varma, Krishnakanth Sistla, Nikhil Gupta, Nikethan Shivanand Baligar, Stephen Wang, Nilanjan Palit, Timothy Yee-Kwong Kam, Adwait Purandare, Ujjwal Gupta, Stanley Chen, Dorit Shapira, Shruthi Venugopal, Suresh Chemudupati, Rupal Parikh, Eric Dehaemer, Pavithra Sampath, Phani Kumar Kandula, Yogesh Bansal, Dean Mulla, Michael Tulanowski, Stephen Paul Haake, Andrew Herdrich, Ripan Das, Nazar Syed Haider, Aman Sewani