Abstract: The present invention relates to thermoset polymer solution, such as a polyurethanes and/or polyureas that include sufficient polyamide to give polyamide strength, adhesion, and durability, wherein the polymer solutions can be prepared as a one-component or two component solvent-borne coating composition. The polyamides give a harder, more chemical resistant, and often tougher thermoset, than similar water-borne polyurethanes rich in polyamide. The compositions of this disclosure differ from other polyamides as they have been formulated to be appropriate viscosity to use as coatings and then have crosslinking technology to form hard thermoset films.