Patents by Inventor Amanda Elisa Ennis Mikhail
Amanda Elisa Ennis Mikhail has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8007291Abstract: A method, and structures are provided for implementing differential signal circuit board electrical contact. A removable member including a pair of independent electrical contacts is removably received within an associated contact-receiving cavity on the circuit board. The contact-receiving cavity includes a mating pair of circuit board pads. A respective dielectric is provided between each of the pair of independent electrical contacts and the mating pair of circuit board pads.Type: GrantFiled: October 15, 2010Date of Patent: August 30, 2011Assignee: International Business Machines CorporationInventors: Don Alan Gilliland, Joseph Kuczynski, Amanda Elisa Ennis Mikhail
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Patent number: 7944698Abstract: A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.Type: GrantFiled: June 30, 2008Date of Patent: May 17, 2011Assignee: International Business Machines CorporationInventors: John Lee Colbert, Eric Alan Eckberg, Roger Duane Hamilton, Mark Kenneth Hoffmeyer, Amanda Elisa Ennis Mikhail, Arvind Kumar Sinha
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Patent number: 7765693Abstract: A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).Type: GrantFiled: July 31, 2008Date of Patent: August 3, 2010Assignee: International Business Machines CorporationInventors: William Louis Brodsky, John Lee Colbert, Roger Duane Hamilton, Amanda Elisa Ennis Mikhail, Mark David Plucinski
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Publication number: 20100184305Abstract: The present invention relates to a method of providing end and center locating connectors in interconnects between surface mount technology (SMT) connectors and printed circuit boards (PCBs). The connectors are adapted to maintain their connection even when the printed circuit board and/or the SMT connector expands or contracts.Type: ApplicationFiled: January 22, 2009Publication date: July 22, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: WILLIAM LOUIS BRODSKY, AMANDA ELISA ENNIS MIKHAIL
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Patent number: 7632127Abstract: The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for differing coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises at least two members that are coupled together and disposed to form an aperture in between the at least two members, wherein the surface mounted contacts extend from the aperture, and wherein at least one dimension of the at least two members is selected to compensate for a difference between the coefficients of thermal expansion between the socket and a printed circuit board.Type: GrantFiled: April 10, 2008Date of Patent: December 15, 2009Assignee: International Business Machines CorporationInventors: Brian Samuel Beaman, Joseph Kuczynski, Theron Lee Lewis, Amanda Elisa Ennis Mikhail, Arvind Kumar Sinha
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Patent number: 7606033Abstract: A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.Type: GrantFiled: June 30, 2008Date of Patent: October 20, 2009Assignee: International Business Machines CorporationInventors: John Lee Colbert, Eric Alan Eckberg, Roger Duane Hamilton, Mark Kenneth Hoffmeyer, Amanda Elisa Ennis Mikhail, Arvind Kumar Sinha
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Patent number: 7530853Abstract: The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises an aperture, wherein the surface mounted contacts extend from the aperture. At least one plate connects to the elongated housing, wherein the at least one plate has a coefficient of thermal expansion selected to compensate for a difference in coefficients of thermal expansion between the socket and a printed circuit board.Type: GrantFiled: October 1, 2007Date of Patent: May 12, 2009Assignee: International Business Machines CorporationInventors: Brian Samuel Beaman, Joseph Kuczynski, Theron Lee Lewis, Amanda Elisa Ennis Mikhail, Arvind Kumar Sinha
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Patent number: 7489224Abstract: Ferrite cores are provided with rounded, convex head ends and complimentary rounded, concave tail ends. The configuration of the head and tail ends permits a reduction in gap width between adjacent cores when they are joined together into a core assembly that suppresses electromagnetic interference emitted from a cable.Type: GrantFiled: September 19, 2006Date of Patent: February 10, 2009Assignee: International Business Machines CorporationInventors: Jessica Rose Berens, Don Allan Gilliland, Amanda Elisa Ennis Mikhail
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Patent number: 7486516Abstract: A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.Type: GrantFiled: August 11, 2005Date of Patent: February 3, 2009Assignee: International Business Machines CorporationInventors: John Lee Colbert, Eric Alan Eckberg, Roger Duane Hamilton, Mark Kenneth Hoffmeyer, Amanda Elisa Ennis Mikhail, Arvind Kumar Sinha
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Patent number: 7472477Abstract: The illustrative embodiments provide a method for manufacturing a socket and attaching the socket to a printed circuit board. Surface mounted contacts for a bottom surface of a socket are provided. The surface mounted contacts are a plurality of conductive metal pads that directly attach to surface connections on a printed circuit board. An elongated housing is formed comprising at least two members that are coupled together and disposed to form an aperture in between the at least two members. At least one dimension of the at least two members is selected to compensate for a difference between coefficients of thermal expansion between the socket and the printed circuit board. The at least two members and the surface mounted contacts are aligned with the printed circuit board using a clip. In response to completing a solder reflow process, the clip is removed and a module is inserted into the aperture.Type: GrantFiled: October 12, 2006Date of Patent: January 6, 2009Assignee: International Business Machines CorporationInventors: Brian Samuel Beaman, Joseph Kuczynski, Theron Lee Lewis, Amanda Elisa Ennis Mikhail, Arvind Kumar Sinha
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Publication number: 20080282539Abstract: A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).Type: ApplicationFiled: July 31, 2008Publication date: November 20, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: William Louis Brodsky, John Lee Colbert, Roger Duane Hamilton, Amanda Elisa Ennis Mikhail, Mark David Plucinski
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Publication number: 20080264603Abstract: A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.Type: ApplicationFiled: June 30, 2008Publication date: October 30, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: John Lee Colbert, Eric Alan Eckberg, Roger Duane Hamilton, Mark Kenneth Hoffmeyer, Amanda Elisa Ennis Mikhail, Arvind Kumar Sinha
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Publication number: 20080259572Abstract: A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.Type: ApplicationFiled: June 30, 2008Publication date: October 23, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: John Lee Colbert, Eric Alan Eckberg, Roger Duane Hamilton, Mark Kenneth Hoffmeyer, Amanda Elisa Ennis Mikhail, Arvind Kumar Sinha
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Publication number: 20080182443Abstract: The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for differing coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises at least two members that are coupled together and disposed to form an aperture in between the at least two members, wherein the surface mounted contacts extend from the aperture, and wherein at least one dimension of the at least two members is selected to compensate for a difference between the coefficients of thermal expansion between the socket and a printed circuit board.Type: ApplicationFiled: April 10, 2008Publication date: July 31, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Samuel Beaman, Joseph Kuczynski, Theron Lee Lewis, Amanda Elisa Ennis Mikhail, Arvind Kumar Sinha
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Publication number: 20080090439Abstract: The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for differing coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises at least two members that are coupled together and disposed to form an aperture in between the at least two members, wherein the surface mounted contacts extend from the aperture, and wherein at least one dimension of the at least two members is selected to compensate for a difference between the coefficients of thermal expansion between the socket and a printed circuit board.Type: ApplicationFiled: October 12, 2006Publication date: April 17, 2008Inventors: Brian Samuel Beaman, Joseph Kuczynski, Theron Lee Lewis, Amanda Elisa Ennis Mikhail, Arvind Kumar Sinha
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Patent number: 7303443Abstract: The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises an aperture, wherein the surface mounted contacts extend from the aperture. At least one plate connects to the elongated housing, wherein the at least one plate has a coefficient of thermal expansion selected to compensate for a difference in coefficients of thermal expansion between the socket and a printed circuit board.Type: GrantFiled: October 12, 2006Date of Patent: December 4, 2007Assignee: International Business Machines CorporationInventors: Brian Samuel Beaman, Joseph Kuczynski, Theron Lee Lewis, Amanda Elisa Ennis Mikhail, Arvind Kumar Sinha
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Patent number: 7293994Abstract: A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).Type: GrantFiled: December 8, 2005Date of Patent: November 13, 2007Assignee: International Business Machines CorporationInventors: William Louis Brodsky, John Lee Colbert, Roger Duane Hamilton, Amanda Elisa Ennis Mikhail, Mark David Plucinski
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Patent number: 7138896Abstract: Ferrite cores are provided with rounded, convex head ends and complimentary rounded, concave tail ends. The configuration of the head and tail ends permits a reduction in gap width between adjacent cores when they are joined together into a core assembly that suppresses electromagnetic interference emitted from a cable.Type: GrantFiled: June 29, 2004Date of Patent: November 21, 2006Assignee: International Business Machines CorporationInventors: Jessica Rose Berens, Don Alan Gilliland, Amanda Elisa Ennis Mikhail
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Patent number: 7084344Abstract: A V-seal EMC gasket assembly is provided for implementing precise placement, conduction and retention, while eliminating the need for adhesives. A V-seal EMC gasket and a supporting member include cooperating notch and protrusion features for positioning and retaining the V-seal EMC gasket on the supporting member. A distal end of the V-seal EMC gasket is received and retained within angled stops formed in the supporting member. A retaining clip member holds the V-seal EMC gasket in contact engagement with the supporting member. The protrusion features of the supporting member are received through corresponding mating slots formed near a first end of the retaining clip member, for example, in press-fit engagement. The angle stops formed in the supporting member hold a second end of the retaining clip member with the V-seal EMC gasket clamped and retained in position between the supporting member and the retaining clip member.Type: GrantFiled: January 5, 2006Date of Patent: August 1, 2006Assignee: International Business Machines CorporationInventors: Don Alan Gilliland, Amanda Elisa Ennis Mikhail, Scott Alan Shurson