Abstract: The present invention relates to a method of providing end and center locating connectors in interconnects between surface mount technology (SMT) connectors and printed circuit boards (PCBs). The connectors are adapted to maintain their connection even when the printed circuit board and/or the SMT connector expands or contracts.

Abstract: A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).

Abstract: Ferrite cores are provided with rounded, convex head ends and complimentary rounded, concave tail ends. The configuration of the head and tail ends permits a reduction in gap width between adjacent cores when they are joined together into a core assembly that suppresses electromagnetic interference emitted from a cable.

Abstract: A connector coupling mechanism comprises a housing coupled to a first connector; and, a force applying device connected to the housing and being movable between docking and undocking positions; wherein in response to the force applying device moving to the docking position, a mechanical advantage is provided for facilitating a firm coupling of the first and second connector assemblies. In addition, the force applying device provides a mechanical advantage in response to the force applying device moving to undocking position for facilitating easy unplugging. The coupling mechanism provides a latching arrangement for releasable and positive retention of the force applying device in the docked position for preventing against inadvertent unplugging. A connector assembly coupling system is provided as well as a method of coupling connector assemblies.

Abstract: A connector coupling mechanism comprises a housing coupled to a first connector; and, a force applying device connected to the housing and being movable between docking and undocking positions; wherein in response to the force applying device moving to the docking position, a mechanical advantage is provided for facilitating a firm coupling of the first and second connector assemblies. In addition, the force applying device provides a mechanical advantage in response to the force applying device moving to undocking position for facilitating easy unplugging. The coupling mechanism provides a latching arrangement for releasable and positive retention of the force applying device in the docked position for preventing against inadvertent unplugging. A connector assembly coupling system is provided as well as a method of coupling connector assemblies.