Abstract: A device comprises a substrate and a stacked bond ball structure. The substrate comprises a bond pad, and the stacked bond ball structure comprises a first and a second bond ball. The first bond ball is in contact with the bond pad, and the second bond ball is positioned on the first bond ball. The stacked bond ball structure is configured to be coupled to a resistance-sensing circuit, such that a resistance of an interface between the first bond ball and the bond pad can be measured to determine an amount of degradation of the interface between the first bond ball and the bond pad. In some implementations, the device further comprises a controller configured to obtain a measured resistance of the interface from the resistance-sensing circuit and determine the amount of degradation of the interface based at least in part on the measured resistance.

Abstract: A semiconductor device comprising a substrate, a first integrated circuit package mounted on the substrate, the first integrated circuit package comprising a first antenna sub-array having a uniform pitch, and a second integrated circuit package mounted on the substrate, the second integrated circuit package comprising a second antenna sub-array having a uniform pitch. The second integrated circuit package is mounted adjacent to the first integrated circuit package to form a multi-package module having an antenna array formed of the first antenna sub-array and the second antenna sub-array, wherein the antenna array has a uniform pitch. Also provided is a method of manufacturing a multi-package module and a method of providing package-to-package grounding.

Abstract: Embodiments of packaged semiconductor devices and methods of making thereof are provided herein, which include a semiconductor die having a plurality of pads on an active side; a dummy die having a plurality of openings that extend from a first major surface to a second major surface opposite the first major surface, wherein the plurality of openings are aligned with the plurality of pads; and a silicone-based glue attaching the dummy die to the active side of the semiconductor die, wherein a plurality of bondable surfaces of the semiconductor die are exposed through the plurality of openings of the dummy die.

Abstract: Embodiments are provided for a multi-die packaged semiconductor device including: a panel of embedded dies including a plurality of radio frequency (RF) dies, wherein each RF die includes RF front-end circuitry, each RF die has an active side that includes a plurality of pads, each RF die has a back side exposed in a back side of the panel; a plurality of antenna connectors formed on a subset of the plurality of pads of each RF die; and an array of antennas formed over a front side of the panel and connected to the plurality of antenna connectors.

Abstract: Embodiments of packaged semiconductor devices and methods of making thereof are provided herein, which include a semiconductor die having a plurality of pads on an active side; a dummy die having a plurality of openings that extend from a first major surface to a second major surface opposite the first major surface, wherein the plurality of openings are aligned with the plurality of pads; and a silicone-based glue attaching the dummy die to the active side of the semiconductor die, wherein a plurality of bondable surfaces of the semiconductor die are exposed through the plurality of openings of the dummy die.

Abstract: Embodiments are provided for a multi-die packaged semiconductor device including: a panel of embedded dies including a plurality of radio frequency (RF) dies, wherein each RF die includes RF front-end circuitry, each RF die has an active side that includes a plurality of pads, each RF die has a back side exposed in a back side of the panel; a plurality of antenna connectors formed on a subset of the plurality of pads of each RF die; and an array of antennas formed over a front side of the panel and connected to the plurality of antenna connectors.

Abstract: Embodiments are provided that include a method for fabricating a multi-die package including: placing a plurality of flip chip dies and splitter dies on the sacrificial carrier; performing solder reflow to join solder bumps of each flip chip die and each splitter die to the sacrificial carrier that includes test probe circuitry; testing the flip chip and splitter dies; replacing any faulty dies; overmolding the flip chip and splitter dies on the sacrificial carrier to form a panel of embedded dies; planarizing the panel of embedded dies to expose back surfaces of the embedded dies; forming a metallization layer across the back surface of the panel of embedded dies; and removing the sacrificial carrier to expose a front surface of the panel of embedded dies, wherein a contact surface of each solder bump of each flip chip die and splitter die is exposed in the front surface.

Abstract: Embodiments are provided that include a method for fabricating a multi-die package including: placing a plurality of flip chip dies and splitter dies on the sacrificial carrier; performing solder reflow to join solder bumps of each flip chip die and each splitter die to the sacrificial carrier that includes test probe circuitry; testing the flip chip and splitter dies; replacing any faulty dies; overmolding the flip chip and splitter dies on the sacrificial carrier to form a panel of embedded dies; planarizing the panel of embedded dies to expose back surfaces of the embedded dies; forming a metallization layer across the back surface of the panel of embedded dies; and removing the sacrificial carrier to expose a front surface of the panel of embedded dies, wherein a contact surface of each solder bump of each flip chip die and splitter die is exposed in the front surface.

Abstract: An RF package including: an RF circuit; a non-gaseous dielectric material coupled to the RF circuit, and having a thickness based on a magnetic field in the RF circuit; and an encapsulant material coupled to cover the RF circuit and non-gaseous dielectric material on at least one side of the RF circuit. A package manufacturing method, including: identifying an RF circuit; dispensing a non-gaseous dielectric material upon the RF circuit, wherein at least a portion of the non-gaseous dielectric material has a thickness based on a magnetic field in the RF circuit; and covering the RF circuit and non-gaseous dielectric material with an encapsulant material on at least one side of the RF circuit.

Abstract: An RF package including: an RF circuit; a non-gaseous dielectric material coupled to the RF circuit, and having a thickness based on a magnetic field in the RF circuit; and an encapsulant material coupled to cover the RF circuit and non-gaseous dielectric material on at least one side of the RF circuit. A package manufacturing method, including: identifying an RF circuit; dispensing a non-gaseous dielectric material upon the RF circuit, wherein at least a portion of the non-gaseous dielectric material has a thickness based on a magnetic field in the RF circuit; and covering the RF circuit and non-gaseous dielectric material with an encapsulant material on at least one side of the RF circuit.

Abstract: The invention relates to a compound to improve wrinkle resistance in fabrics, comprising: a wrinkle reducing agent, comprising at least one fusible elastomer, and a liquid carrier for carrying said agent and a salt composition for physical crosslinking said fusible elastomer. The invention also relates to a fabric provided with said wrinkle resistance improving compound. The invention further relates to a method of improving wrinkle resistance in a fabric by use of such a compound.

Abstract: The invention relates to an iron having means for moistening fabric to be ironed. According to the invention, the moistening means comprise a device for generating foam and means for applying said generated foam to the fabric. For example, foam may be generated by means of a nozzle (21) having a first inlet (8) for a foaming liquid (6) and a second inlet (12) for supplying pressurized air to the nozzle so as to mix air with said liquid, thereby creating foam (42). Applying foam to the fabric (50) can be realized by means of a doctor blade (51) to break up the foam.