Patents by Inventor Amar J. Amin

Amar J. Amin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8129759
    Abstract: Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate which can have an integrated circuit die attached thereto. The package includes a dedicated high-speed ground plane that is electrically isolated from the ground plane used to ground the low speed circuitry of the package.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: March 6, 2012
    Assignee: LSI Logic Corporation
    Inventors: Maurice O. Othieno, Chok J. Chia, Amar J. Amin
  • Publication number: 20100067207
    Abstract: Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate which can have an integrated circuit die attached thereto. The package includes a dedicated high-speed ground plane that is electrically isolated from the ground plane used to ground the low speed circuitry of the package.
    Type: Application
    Filed: November 24, 2009
    Publication date: March 18, 2010
    Applicant: LSI CORPORATION
    Inventors: Maurice O. Othieno, Chok J. Chia, Amar J. Amin
  • Patent number: 7646091
    Abstract: Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate which can have an integrated circuit die attached thereto. The package includes a dedicated high-speed ground plane that is electrically isolated from the ground plane used to ground the low speed circuitry of the package.
    Type: Grant
    Filed: April 6, 2006
    Date of Patent: January 12, 2010
    Assignee: LSI Corporation
    Inventors: Maurice O. Othieno, Chok J. Chia, Amar J. Amin