Abstract: A microcontact printing tool having a print unit including a stamp head with a stamp and a wafer chuck for retaining a substrate. The stamp contained by the stamped head movable relative to the substrate by an actuator and a stage. A plurality of sensors detect the position of the stamp relative to substrate. A method of using the printing tool that includes a real-time feedback for consistent and accurate application of force during the printing of the substrate. The stamp head includes a pressure chamber carrying the stamp. The stamp backing is deflected prior to contact of the stamp with the substrate to form a minimum point and the stamp backing and the stamp is returned to a plane to create a printing propagation contact. An apparatus has a master backing and a stamping backing in close proximity and the stamp material drawn in through a vacuum. The stamp is separated from the master by use of a parting fluid.

Abstract: A microcontact printing tool having a print unit including a stamp head with a stamp and a wafer chuck for retaining a substrate. The stamp contained by the stamped head movable relative to the substrate by an actuator and a stage. A plurality of sensors detect the position of the stamp relative to substrate. A method of using the printing tool that includes a real-time feedback for consistent and accurate application of force during the printing of the substrate. The stamp head includes a pressure chamber carrying the stamp. The stamp backing is deflected prior to contact of the stamp with the substrate to form a minimum point and the stamp backing and the stamp is returned to a plane to create a printing propagation contact. An apparatus and method of producing the stamp on a stamp backing. The apparatus has a master backing and a stamping backing in close proximity and the stamp material drawn in through a vacuum. The stamp is separated from the master by use of a parting fluid.

Abstract: A microcontact printing tool having a print unit including a stamp head with a stamp and a wafer chuck for retaining a substrate. The stamp contained by the stamped head movable relative to the substrate by an actuator and a stage. A plurality of sensors detect the position of the stamp relative to substrate. A method of using the printing tool that includes a real-time feedback for consistent and accurate application of force during the printing of the substrate. The stamp head includes a pressure chamber carrying the stamp. The stamp backing is deflected prior to contact of the stamp with the substrate to form a minimum point and the stamp backing and the stamp is returned to a plane to create a printing propagation contact. An apparatus and method of producing the stamp on a stamp backing. The apparatus has a master backing and a stamping backing in close proximity and the stamp material drawn in through a vacuum. The stamp is separated from the master by use of a parting fluid.