Patents by Inventor Amaresh Mahapatra

Amaresh Mahapatra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11580466
    Abstract: A device may receive data that identifies applications utilized by users, databases utilized by the applications, and the users, and may process the received data, with first models, to determine context data that matches the users and events associated with the applications, and task data that identifies tasks to be performed by the users in response to the events. The device may process the received data and the context data, with a second model, to generate role data that identifies user interfaces utilized by the users to access the applications, and credentials of the users, and may process the context data, the task data, and the role data, with a third model, to generate persona data that identifies personas, and assignment data that assigns each of the users to one of the personas. The device may perform actions based on the persona data and the assignment data.
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: February 14, 2023
    Assignee: Accenture Global Solutions Limited
    Inventors: Amaresh Mahapatra, Balaji Chandrashekar, Ruth Shanthini, Satish Kumar, Sujit Ganguly, Suresh Kumar Ramaswamy
  • Publication number: 20220067604
    Abstract: A device may receive data that identifies applications utilized by users, databases utilized by the applications, and the users, and may process the received data, with first models, to determine context data that matches the users and events associated with the applications, and task data that identifies tasks to be performed by the users in response to the events. The device may process the received data and the context data, with a second model, to generate role data that identifies user interfaces utilized by the users to access the applications, and credentials of the users, and may process the context data, the task data, and the role data, with a third model, to generate persona data that identifies personas, and assignment data that assigns each of the users to one of the personas. The device may perform actions based on the persona data and the assignment data.
    Type: Application
    Filed: August 26, 2020
    Publication date: March 3, 2022
    Inventors: Amaresh MAHAPATRA, Balaji CHANDRASHEKAR, Ruth SHANTHINI, Satish KUMAR, Sujit GANGULY, Suresh Kumar RAMASWAMY
  • Patent number: 8943641
    Abstract: Methods and apparatus for the removal of foreign matter, such as oil and dust, from the end faces of optical fiber and optical fiber connectors. Cleaning is effected by bringing carbon nanotube material into contact with an end face to create a differential adhesion in the proximity of the end face that more strongly attracts foreign matter residing on the end face to the carbon nanotube material than its attraction to the end face. The carbon nanotube material is applied with cleaning swabs or tapes that are used to clean end faces with swiping actions.
    Type: Grant
    Filed: May 30, 2011
    Date of Patent: February 3, 2015
    Assignee: Linden Photonics, Inc.
    Inventors: Amaresh Mahapatra, Stephen M. O'Riorden
  • Patent number: 8842956
    Abstract: A non-kink, non-hockling optical cable comprising an optical fiber capable of propagating light along its longitudinal axis. A buffer layer made of a soft plastic material surrounds the silica core and cladding, and a supplemental layer surrounds the buffer layer. The supplemental layer consists essentially of a liquid crystal polymer (LCP) material to enhance the tensile strength of the optical fiber. Finally, an encasing polymer layer with a breaking strain greater than 30%, surrounds the supplemental layer, to increase the flexibility of the optical cable.
    Type: Grant
    Filed: March 20, 2012
    Date of Patent: September 23, 2014
    Assignee: Linden Photonics, Inc.
    Inventors: Stephen M. O'Riorden, Amaresh Mahapatra
  • Publication number: 20130233348
    Abstract: Carbon nanotube based cleaning material and associated methodology for cleaning surfaces by contacting the surface with the cleaning media. An assembly of carbon nanotubes attracts unwanted foreign matter that may be present on the surface by differential adhesion to the carbon nanotubes. Afterwards, separating the assembly of carbon nanotubes from the surface operates to carry away foreign matter with the carbon nanotubes.
    Type: Application
    Filed: March 5, 2013
    Publication date: September 12, 2013
    Inventors: STEPHEN O'RIORDEN, AMARESH MAHAPATRA, DAVID M. GELDART
  • Publication number: 20120257863
    Abstract: A non-kink, non-hockling optical cable comprising an optical fiber capable of propagating light along its longitudinal axis. A buffer layer made of a soft plastic material surrounds the silica core and cladding, and a supplemental layer surrounds the buffer layer. The supplemental layer consists essentially of a liquid crystal polymer (LCP) material to enhance the tensile strength of the optical fiber. Finally, an encasing polymer layer with a breaking strain greater than 30%, surrounds the supplemental layer, to increase the flexibility of the optical cable.
    Type: Application
    Filed: March 20, 2012
    Publication date: October 11, 2012
    Inventors: Stephen M. O'RIORDEN, Amaresh MAHAPATRA
  • Patent number: 8263862
    Abstract: A packaging system having a housing for providing a hermetically sealed interior space for receiving and supporting optoelectronic components. The housing has at least one section of wall comprising a layer of liquid crystal polymer (LCP). At least one hermetically sealed electrical port is formed in the LCP wall section over a predetermined area and comprises a layer of metal adhered to and overlying the predetermined area on the of the LCP wall section. An electrode passes through the metal from the exterior of the system to the interior space to provide an electrical communication path between the optoelectronic components and the exterior of said packaging system. A solder joint is formed between the electrode and the layer of metal to provide a hermetic connection between the layer of metal and the electrode to assure that the hermeticity of the housing remains unchanged with the electrical port present.
    Type: Grant
    Filed: December 16, 2009
    Date of Patent: September 11, 2012
    Assignee: Linden Photonics, Inc.
    Inventors: Amaresh Mahapatra, Stephen M. O'Riorden
  • Publication number: 20110297184
    Abstract: Methods and apparatus for the removal of foreign matter, such as oil and dust, from the end faces of optical fiber and optical fiber connectors. Cleaning is effected by bringing carbon nanotube material into contact with an end face to create a differential adhesion in the proximity of the end face that more strongly attracts foreign matter residing on the end face to the carbon nanotube material than its attraction to the end face. The carbon nanotube material is applied with cleaning swabs or tapes that are used to clean end faces with swiping actions.
    Type: Application
    Filed: May 30, 2011
    Publication date: December 8, 2011
    Inventors: AMARESH MAHAPATRA, STEPHEN M. O'RIORDEN
  • Publication number: 20100326696
    Abstract: An electrically conducting wire structure and a method for its manufacture where the wire structure has at least one elongated electrically conducting wire and a liquid crystal polymer and thermoplastic blended coating of insulation preferably formed by cross-head extrusion as a layer around the electrically conducting wire. An abrasion layer is preferably formed over the liquid crystal polymer coating to increase abrasion resistance, the elongated electrically conducting wire is selected from the group comprising copper, silver, tinned copper, aluminum, and conducting polymers, and the liquid crystal polymer material comprises a thermotropic thermoplastic.
    Type: Application
    Filed: March 5, 2009
    Publication date: December 30, 2010
    Inventor: AMARESH MAHAPATRA
  • Patent number: 7838765
    Abstract: An electrically conducting wire structure and a method for its manufacture where the wire structure has at least one elongated electrically conducting wire and a liquid crystal polymer coating of insulation formed by cross-head extrusion as a layer around the electrically conducting wire. An abrasion layer is preferably formed over the liquid crystal polymer coating, the elongated electrically conducting wire is selected from the group that includes copper, silver, tinned copper, aluminum, and conducting polymers, and the liquid crystal polymer material is a thermotropic thermoplastic.
    Type: Grant
    Filed: April 22, 2008
    Date of Patent: November 23, 2010
    Assignee: Linden Photonics, Inc.
    Inventor: Amaresh Mahapatra
  • Publication number: 20100200262
    Abstract: A packaging system having a housing for providing a hermetically sealed interior space for receiving and supporting optoelectronic components. The housing has at least one section of wall comprising a layer of liquid crystal polymer (LCP). At least one hermetically sealed electrical port is formed in the LCP wall section over a predetermined area and comprises a layer of metal adhered to and overlying the predetermined area on the of the LCP wall section. An electrode passes through the metal from the exterior of the system to the interior space to provide an electrical communication path between the optoelectronic components and the exterior of said packaging system. A solder joint is formed between the electrode and the layer of metal to provide a hermetic connection between the layer of metal and the electrode to assure that the hermeticity of the housing remains unchanged with the electrical port present.
    Type: Application
    Filed: December 16, 2009
    Publication date: August 12, 2010
    Inventors: AMARESH MAHAPATRA, STEPHEN M. O'RIORDEN
  • Patent number: 7766561
    Abstract: The invention relates to high-strength, abrasion-resistant optical fiber cable having a supplemental layer consisting essentially of a liquid crystal polymer (LCP) to enhance the cable's tensile strength and hermetically seal it, and an outermost encasing layer to protect the LCP supplemental layer from damage that could otherwise diminish the tensile strength or destroy the moisture barrier properties of the cable gained by adding the supplemental liquid crystal polymer layer. The encasing layer is preferably a thin layer of a smooth, non-crystalline thermoplastic that can be easily removed with chemicals that do not affect the properties of the supplemental layer so that the supplemental layer can be made accessible for promoting the formation of hermetically sealed interfaces between the cable and other structures. Cross-head extrusion methods for coating optical fibers with LCP and encasing layers are described along with laser and ultrasonic bonding techniques for fabricating hermetic packages.
    Type: Grant
    Filed: June 24, 2009
    Date of Patent: August 3, 2010
    Assignee: Linden Photonics, Inc.
    Inventors: Amaresh Mahapatra, Robert J. Mansfield
  • Publication number: 20100183269
    Abstract: The invention relates to high-strength, abrasion-resistant optical fiber cable having a supplemental layer consisting essentially of a liquid crystal polymer (LCP) to enhance the cable's tensile strength and hermetically seal it, and an outermost encasing layer to protect the LCP supplemental layer from damage that could otherwise diminish the tensile strength or destroy the moisture barrier properties of the cable gained by adding the supplemental liquid crystal polymer layer. The encasing layer is preferably a thin layer of a smooth, non-crystalline thermoplastic that can be easily removed with chemicals that do not affect the properties of the supplemental layer so that the supplemental layer can be made accessible for promoting the formation of hermetically sealed interfaces between the cable and other structures. Cross-head extrusion methods for coating optical fibers with LCP and encasing layers are described along with laser and ultrasonic bonding techniques for fabricating hermetic packages.
    Type: Application
    Filed: June 24, 2009
    Publication date: July 22, 2010
    Applicant: LINDEN PHOTONICS, INC.
    Inventors: Amaresh Mahapatra, Robert J. Mansfield
  • Publication number: 20100046896
    Abstract: This invention relates to the use of liquid crystal (LCP) blends for use as buffer layers in optical fiber cables to enhance strength and flexibility so as to meet the demanding requirements imposed on such cables for use in aircraft and the like. The inventive optical fiber cable comprises one or more optical fibers having a core having a given index of refraction and a cladding layer surrounding the core and having an index of refraction lower than that of the core so that the two in combination are capable of propagating light along the length of the fiber cable. At least one exterior buffer layer surrounds the cladding, the exterior buffer layer comprising a liquid crystal polymer and thermoplastic blended coating formed as a layer around the cladding, preferably by cross-head extrusion. The thermoplastic has properties such that the blended coating has a strain at break larger than the liquid crystal polymer would otherwise have acting alone.
    Type: Application
    Filed: August 10, 2009
    Publication date: February 25, 2010
    Inventors: Amaresh Mahapatra, Stephen M. O'riorden
  • Publication number: 20100025074
    Abstract: An electrically conducting wire structure and a method for its manufacture where the wire structure has at least one elongated electrically conducting wire and a liquid crystal polymer coating of insulation formed by cross-head extrusion as a layer around the electrically conducting wire. An abrasion layer is preferably formed over the liquid crystal polymer coating to increase abrasion resistance, the elongated electrically conducting wire is selected from the group comprising copper, silver, tinned copper, aluminum, and conducting polymers, and the liquid crystal polymer material comprises a thermotropic thermoplastic.
    Type: Application
    Filed: April 22, 2008
    Publication date: February 4, 2010
    Inventor: Amaresh Mahapatra
  • Patent number: 7570853
    Abstract: The invention relates to high-strength, abrasion-resistant optical fiber cable having a supplemental layer consisting essentially of a liquid crystal polymer (LCP) to enhance the cable's tensile strength and hermetically seal it, and an outermost encasing layer to protect the LCP supplemental layer from damage that could otherwise diminish the tensile strength or destroy the moisture barrier properties of the cable gained by adding the supplemental liquid crystal polymer layer. The encasing layer is preferably a thin layer of a smooth, non-crystalline thermoplastic that can be easily removed with chemicals that do not affect the properties of the supplemental layer so that the supplemental layer can be made accessible for promoting the formation of hermetically sealed interfaces between the cable and other structures. Cross-head extrusion methods for coating optical fibers with LCP and encasing layers are described along with laser and ultrasonic bonding techniques for fabricating hermetic packages.
    Type: Grant
    Filed: November 27, 2007
    Date of Patent: August 4, 2009
    Assignee: Linden Photonics, Inc.
    Inventors: Amaresh Mahapatra, Robert J. Mansfield
  • Publication number: 20080095507
    Abstract: The invention relates to high-strength, abrasion-resistant optical fiber cable having a supplemental layer consisting essentially of a liquid crystal polymer (LCP) to enhance the cable's tensile strength and hermetically seal it, and an outermost encasing layer to protect the LCP supplemental layer from damage that could otherwise diminish the tensile strength or destroy the moisture barrier properties of the cable gained by adding the supplemental liquid crystal polymer layer. The encasing layer is preferably a thin layer of a smooth, non-crystalline thermoplastic that can be easily removed with chemicals that do not affect the properties of the supplemental layer so that the supplemental layer can be made accessible for promoting the formation of hermetically sealed interfaces between the cable and other structures. Cross-head extrusion methods for coating optical fibers with LCP and encasing layers are described along with laser and ultrasonic bonding techniques for fabricating hermetic packages.
    Type: Application
    Filed: November 27, 2007
    Publication date: April 24, 2008
    Inventors: Amaresh Mahapatra, Robert Mansfield
  • Publication number: 20040240804
    Abstract: The invention relates to optical fibers provided with exterior buffer layers of liquid crystal polymer to enhance optical fiber cable strength and promote the fabrication of hermetically sealed ported packages for housing electro-optical components. Cross-head extrusion methods for coating optical fibers with LCP buffers are described along with laser and ultrasonic bonding techniques for fabricating hermetic packages.
    Type: Application
    Filed: May 27, 2004
    Publication date: December 2, 2004
    Inventors: Amaresh Mahapatra, Robert J. Mansfield
  • Patent number: 6301399
    Abstract: The present invention relates to integrated optic modulator devices and methods for their fabrication. Lithium niobate substrates have waveguides fabricated in them for propagating light energy, preferably in Mach Zhender architectures. The waveguides are bordered by adjacent electrode metallizations of low resistivity, such as copper and silver, to provide the devices with high gain bandwidth products to reduce the cost of drive electronics and simplify processing procedures. Gain bandwidth products exceed 4.5×105.
    Type: Grant
    Filed: February 11, 1999
    Date of Patent: October 9, 2001
    Assignee: JDS Uniphase Corporation
    Inventors: Amaresh Mahapatra, Peter F. Hallemeier, Hai Qing Li
  • Patent number: 6163395
    Abstract: A high fidelity, multi-output optical transmission system is configured utilizing a high power continuous wave YAG laser, multiport splitters, and linearized external modulation. An electro-optical modulator design in combination with a continuous wave laser, power splits and couplers attains a multi-octave bandwidth transmitter possessing improved second and third order distortion characteristics. The system includes multiple individually modulated transmitter outputs which effectively provides bandwidth multiplication with full redundancy for increased transmission reliability.
    Type: Grant
    Filed: March 12, 1998
    Date of Patent: December 19, 2000
    Assignee: Fiber Optics Network Solutions Corp.
    Inventors: Joseph E. Nemecek, Michael J. Noonan, Amaresh Mahapatra