Patents by Inventor Ambarish Chhatre
Ambarish Chhatre has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240077138Abstract: An edge seal for sealing an outer surface of a lower electrode assembly configured to support a semiconductor substrate in a plasma processing chamber, the lower electrode assembly including an annular groove defined between a lower member and an upper member of the lower electrode assembly. The edge seal includes an elastomeric band configured to be arranged within the groove, the elastomeric band having an annular upper surface, an annular lower surface, an inner surface, and an outer surface. When the elastomeric band is in an uncompressed state, the outer surface of the elastomeric band is concave. When the upper and lower surfaces are axially compressed at least 1% such that the elastomeric band is in a compressed state, an outward bulging of the outer surface is not greater than a predetermined distance. The predetermined distance corresponds to a maximum outer diameter of the elastomeric band in the uncompressed state.Type: ApplicationFiled: October 6, 2023Publication date: March 7, 2024Inventors: David SCHAEFER, Ambarish Chhatre, Keith William Gaff, Sung Je Kim, Brooke Mesler Lai
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Publication number: 20230402264Abstract: A gas distribution assembly for a processing chamber in a substrate processing system includes a gas plate including a plurality of holes configured to supply a gas mixture into an interior of the processing chamber and a carrier ring configured to support the gas plate. The carrier ring includes an annular body and a radially inwardly projecting portion. The radially inwardly projecting portion has a first inner diameter and the annular body has a second inner diameter greater than the first inner diameter, the radially inwardly projecting portion defines a ledge, and the gas plate is arranged on the ledge of the carrier ring. A dielectric window is arranged on the gas plate above the gas plate and the carrier ring such that the gas plate is supported between the carrier ring and the dielectric window.Type: ApplicationFiled: September 14, 2021Publication date: December 14, 2023Inventors: Gordon PENG, Ambarish CHHATRE, Craig ROSSLEE, Dan MAROHL, David SETTON
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Publication number: 20230395359Abstract: An electrostatic chuck is provided. In one example, the electrostatic chuck includes a base plate, a bond layer disposed over the base plate, a ceramic plate, and a heater. The ceramic plate includes a bottom surface disposed over the bond layer and a raised top surface for supporting a substrate. The raised top surface includes an outer diameter. The heater is disposed between the bottom surface of the ceramic plate and the bond layer. The heater element includes an inner heating element and an outer heating element. The inner heating element is arranged in a central circular area adjacent to the bottom surface of the ceramic plate and the outer heating element is arranged in an annular area that surrounds the central circular area and is adjacent to the bottom surface of the ceramic plate. An outer diameter of the outer heating element is inset from an annual heater setback region of the ceramic plate.Type: ApplicationFiled: September 9, 2021Publication date: December 7, 2023Inventors: Ambarish Chhatre, Patrick Chung, Dan Marohl, Craig A. Rosslee, David A. Setton, Mohammad Sohail Shaik
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Patent number: 11781650Abstract: An edge seal for sealing an outer surface of a lower electrode assembly configured to support a semiconductor substrate in a plasma processing chamber, the lower electrode assembly including an annular groove defined between a lower member and an upper member of the lower electrode assembly. The edge seal includes an elastomeric band configured to be arranged within the groove, the elastomeric band having an annular upper surface, an annular lower surface, an inner surface, and an outer surface. When the elastomeric band is in an uncompressed state, the outer surface of the elastomeric band is concave. When the upper and lower surfaces are axially compressed at least 1% such that the elastomeric band is in a compressed state, an outward bulging of the outer surface is not greater than a predetermined distance. The predetermined distance corresponds to a maximum outer diameter of the elastomeric band in the uncompressed state.Type: GrantFiled: December 15, 2017Date of Patent: October 10, 2023Assignee: LAM RESEARCH CORPORATIONInventors: David Schaefer, Ambarish Chhatre, Keith William Gaff, Sung Je Kim, Brooke Mesler Lai
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Publication number: 20230298929Abstract: A thin shadow ring for a substrate processing system includes an annular body having an inner diameter and an outer diameter. The inner diameter and the outer diameter define a cross-sectional width of the annular body between the inner diameter and the outer diameter. At least two tabs extend radially outward from the annular body. The cross-sectional width of the annular body between the inner diameter and the outer diameter is less than 1.0 inch.Type: ApplicationFiled: July 30, 2021Publication date: September 21, 2023Inventors: David SETTON, Ambarish CHHATRE, Justin Charles CANNIFF, Dan MAROHL, Craig ROSSLEE
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Publication number: 20230178342Abstract: A flow optimizer is disclosed for use in plasma chamber. The flow optimizer includes a ring that is disposed between a wafer support and a dielectric window defined in the plasma chamber. The ring of the flow optimizer is configured to be positioned between the wafer support and the dielectric window so that an outer edge of the ring is adjacent to side walls of the plasma chamber and an opening of the ring is substantially aligned with a diameter of the wafer support.Type: ApplicationFiled: April 30, 2021Publication date: June 8, 2023Inventors: Craig Rosslee, Ambarish Chhatre, Ming-Te Lin, Dan Marohl
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Patent number: 10804081Abstract: An edge ring configured to surround an outer periphery of a substrate support in a plasma processing chamber wherein plasma is generated and used to process a substrate is disclosed, the substrate support comprising a base plate, a top plate, an elastomer seal assembly between the base plate and the top plate, and an elastomer seal configured to surround the elastomer seal assembly. The edge ring includes an upper inner surface having an edge step directed towards an interior portion of the edge ring and arranged to extend from an outer periphery of a top surface of the top plate to an outer periphery of an upper surface of the base plate, a lower inner surface, an outer surface, a lower surface extending from the lower inner surface to the outer surface, and a top surface extending from the outer surface to the upper inner surface.Type: GrantFiled: December 20, 2013Date of Patent: October 13, 2020Assignee: LAM RESEARCH CORPORATIONInventors: Ambarish Chhatre, David Schaefer, Keith Gaff
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Publication number: 20200234920Abstract: An apparatus for processing substrates is provided. A plasma processing chamber is provided. At least one substrate support for supporting at least one substrate is in the plasma processing chamber. At least one gas inlet is provided for flowing gas into the plasma processing chamber. A dielectric window forms a cover for the plasma processing chamber. The dielectric window comprises an outer dielectric window ring with a central aperture and an inner concaved dielectric window extending across the central aperture, wherein the inner concaved dielectric window forms a volume in fluid communication with an interior of the plasma processing chamber, and wherein the at least one gas inlet flows gas into the volume of the inner concaved dielectric window. An outer coil assembly is adjacent to the outer dielectric window ring. An inner coil assembly surrounds the inner concaved dielectric window.Type: ApplicationFiled: January 22, 2019Publication date: July 23, 2020Inventors: Shen PENG, Dan MAROHL, Ambarish CHHATRE, Ming-Te LIN, Andras KUTHI
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Publication number: 20180106371Abstract: An edge seal for sealing an outer surface of a lower electrode assembly configured to support a semiconductor substrate in a plasma processing chamber, the lower electrode assembly including an annular groove defined between a lower member and an upper member of the lower electrode assembly. The edge seal includes an elastomeric band configured to be arranged within the groove, the elastomeric band having an annular upper surface, an annular lower surface, an inner surface, and an outer surface. When the elastomeric band is in an uncompressed state, the outer surface of the elastomeric band is concave. When the upper and lower surfaces are axially compressed at least 1% such that the elastomeric band is in a compressed state, an outward bulging of the outer surface is not greater than a predetermined distance. The predetermined distance corresponds to a maximum outer diameter of the elastomeric band in the uncompressed state.Type: ApplicationFiled: December 15, 2017Publication date: April 19, 2018Inventors: David Schaefer, Ambarish Chhatre, Keith William Gaff, Sung Lee, Brooke Mesler Lai
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Patent number: 9869392Abstract: A lower electrode assembly useful for supporting a semiconductor substrate in a plasma processing chamber includes a temperature controlled lower base plate, an upper plate, a mounting groove surrounding a bond layer and an edge seal comprising an elastomeric band having an outer concave surface in an uncompressed state, the band mounted in the groove such that upper and lower ends of the band are axially compressed and a maximum outward bulging of the band is no greater than a predetermined distance.Type: GrantFiled: June 20, 2012Date of Patent: January 16, 2018Assignee: LAM RESEARCH CORPORATIONInventors: David Schaefer, Ambarish Chhatre, Keith William Gaff, Sung Lee, Brooke Mesler Lai
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Patent number: 9859142Abstract: A lower electrode assembly useful for supporting a semiconductor substrate in a plasma processing chamber includes a temperature controlled lower base plate, an upper plate, a mounting groove surrounding a bond layer and an edge seal comprising an elastomeric band having an outer concave surface in an uncompressed state, the band mounted in the groove such that upper and lower ends of the band are axially compressed and a maximum outward bulging of the band is no greater than a predetermined distance.Type: GrantFiled: October 20, 2011Date of Patent: January 2, 2018Assignee: LAM RESEARCH CORPORATIONInventors: David Schaefer, Ambarish Chhatre, Keith William Gaff, Sung Lee
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Publication number: 20150235889Abstract: A method is provided for treating a bipolar ESC having a front surface and a back surface, the front surface including an anodized layer. The method includes eliminating the anodized layer, disposing a new anodized layer onto the front surface, and treating the new anodized layer with water to seal the new anodized layer.Type: ApplicationFiled: May 5, 2015Publication date: August 20, 2015Applicant: LAM RESEARCH CORPORATIONInventors: Hong Shih, Tuochuan Huang, David Schaefer, Ambarish Chhatre, John Daugherty, MingHang Wu, Clifford La Croix
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Publication number: 20150179412Abstract: An edge ring configured to surround an outer periphery of a substrate support in a plasma processing chamber wherein plasma is generated and used to process a substrate is disclosed, the substrate support comprising a base plate, a top plate, an elastomer seal assembly between the base plate and the top plate, and an elastomer seal configured to surround the elastomer seal assembly. The edge ring includes an upper inner surface having an edge step directed towards an interior portion of the edge ring and arranged to extend from an outer periphery of a top surface of the top plate to an outer periphery of an upper surface of the base plate, a lower inner surface, an outer surface, a lower surface extending from the lower inner surface to the outer surface, and a top surface extending from the outer surface to the upper inner surface.Type: ApplicationFiled: December 20, 2013Publication date: June 25, 2015Applicant: Lam Research CorporationInventors: Ambarish Chhatre, David Schaefer, Keith Gaff
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Patent number: 9054148Abstract: A method is provided for treating a bipolar ESC having a front surface and a back surface, the front surface including an anodized layer. The method includes eliminating the anodized layer, disposing a new anodized layer onto the front surface, and treating the new anodized layer with water to seal the new anodized layer.Type: GrantFiled: August 26, 2011Date of Patent: June 9, 2015Assignee: Lam Research CorporationInventors: Hong Shih, Tuochuan Huang, David Schaefer, Ambarish Chhatre, John Daugherty, MingHang Wu, Clifford La Croix
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Publication number: 20130340942Abstract: A lower electrode assembly useful for supporting a semiconductor substrate in a plasma processing chamber includes a temperature controlled lower base plate, an upper plate, a mounting groove surrounding a bond layer and an edge seal comprising an elastomeric band having an outer concave surface in an uncompressed state, the band mounted in the groove such that upper and lower ends of the band are axially compressed and a maximum outward bulging of the band is no greater than a predetermined distance.Type: ApplicationFiled: June 20, 2012Publication date: December 26, 2013Applicant: Lam Research CorporationInventors: David Schaefer, Ambarish Chhatre, Keith William Gaff, Brooke Mesler Lai
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Publication number: 20130097840Abstract: A lower electrode assembly useful for supporting a semiconductor substrate in a plasma processing chamber includes a temperature controlled lower base plate, an upper plate, a mounting groove surrounding a bond layer and an edge seal comprising an elastomeric band having an outer concave surface in an uncompressed state, the band mounted in the groove such that upper and lower ends of the band are axially compressed and a maximum outward bulging of the band is no greater than a predetermined distance.Type: ApplicationFiled: October 20, 2011Publication date: April 25, 2013Applicant: Lam Research CorporationInventors: David Schaefer, Ambarish Chhatre, Keith William Gaff, Sung Lee
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Publication number: 20130052339Abstract: A method is provided for treating a bipolar ESC having a front surface and a back surface, the front surface including an anodized layer. The method includes eliminating the anodized layer, disposing a new anodized layer onto the front surface, and treating the new anodized layer with water to seal the new anodized layer.Type: ApplicationFiled: August 26, 2011Publication date: February 28, 2013Inventors: Hong Shih, Tuochuan Huang, David Schaefer, Ambarish Chhatre, John Daugherty, MingHang Wu, Clifford La Croix