Patents by Inventor Amber C. Abare

Amber C. Abare has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10439112
    Abstract: Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A light emitter chip can be disposed over the submount such that the light emitter chip is mounted over at least a portion of the cathode and wirebonded to at least a portion of the anode.
    Type: Grant
    Filed: July 20, 2012
    Date of Patent: October 8, 2019
    Assignee: Cree, Inc.
    Inventors: Joseph G. Clark, Jeffrey Carl Britt, Amber C. Abare, Raymond Rosado, Harsh Sundani, David T. Emerson, Jeremy Scott Nevins
  • Publication number: 20190237638
    Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.
    Type: Application
    Filed: April 10, 2019
    Publication date: August 1, 2019
    Inventors: Peter Scott Andrews, Jesse Colin Reiherzer, Amber C. Abare
  • Patent number: 10290777
    Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: May 14, 2019
    Assignee: CREE, INC.
    Inventors: Peter Scott Andrews, Jesse Colin Reiherzer, Amber C. Abare
  • Publication number: 20180033924
    Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.
    Type: Application
    Filed: July 21, 2017
    Publication date: February 1, 2018
    Inventors: Peter Scott Andrews, Jesse Colin Reiherzer, Amber C. Abare
  • Patent number: 9349929
    Abstract: Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A first light emitter chip can mounted over at least a portion of the cathode, and a second light emitter chip can be wirebonded to at least a portion of the anode. Multiple light emitter chips can be disposed between the first and second light emitter chips.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: May 24, 2016
    Assignee: Cree, Inc.
    Inventors: Joseph G. Clark, Amber C. Abare, David T. Emerson, Jeremy S. Nevins, Raymond Rosado, Michael Bergmann
  • Publication number: 20160013164
    Abstract: Light emitter devices for light emitting diodes (LED chips) and related methods are disclosed. In one embodiment a light emitter device includes a substrate and a chip on board (COB) array of LED chips disposed over the substrate. A layer having wavelength conversion material provided therein is disposed over the array of LED chips for forming a light emitting surface from which light is emitted upon activation of the LED chips. In some aspects, the wavelength conversion material includes phosphoric or lumiphoric material that is settled and/or more densely concentrated within one or more predetermined portions of the layer. In some aspects, the devices and methods provided herein can comprise a lumen density of approximately 30 lm/mm2 or greater.
    Type: Application
    Filed: April 6, 2015
    Publication date: January 14, 2016
    Inventors: Florin A. Tudorica, Christopher P. Hussell, Amber C. Abare, Peter Scott Andrews, Sung Chul Joo
  • Patent number: 9041042
    Abstract: High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: May 26, 2015
    Assignee: Cree, Inc.
    Inventors: Peter Scott Andrews, Raymond Rosado, Michael P. Laughner, David T. Emerson, Amber C. Abare, Jeffrey C. Britt
  • Patent number: 9000470
    Abstract: Light emitter devices for light emitting diodes (LED chips) and related methods are disclosed. In one embodiment a light emitter device includes a substrate and a chip on board (COB) array of LED chips disposed over the substrate. A layer having wavelength conversion material provided therein is disposed over the array of LED chips for forming a light emitting surface from which light is emitted upon activation of the LED chips. In some aspects, the wavelength conversion material includes phosphoric or lumiphoric material that is settled and/or more densely concentrated within one or more predetermined portions of the layer. In some aspects, the devices and methods provided herein can comprise a lumen density of approximately 30 lm/mm2 or greater.
    Type: Grant
    Filed: January 30, 2014
    Date of Patent: April 7, 2015
    Assignee: Cree, Inc.
    Inventors: Florin A. Tudorica, Christopher P. Hussell, Amber C. Abare, Peter Scott Andrews, Sung Chul Joo
  • Publication number: 20150048393
    Abstract: High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.
    Type: Application
    Filed: November 3, 2014
    Publication date: February 19, 2015
    Inventors: Peter Scott Andrews, Raymond Rosado, Michael P. Laughner, David T. Emerson, Amber C. Abare, Jeffrey C. Britt
  • Patent number: 8896013
    Abstract: High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: November 25, 2014
    Assignee: Cree, Inc.
    Inventors: Peter Scott Andrews, Raymond Rosado, Michael P. Laughner, David T. Emerson, Amber C. Abare, Jeffrey C. Britt
  • Publication number: 20140217433
    Abstract: Light emitter devices for light emitting diodes (LED chips) and related methods are disclosed. In one embodiment a light emitter device includes a substrate and a chip on board (COB) array of LED chips disposed over the substrate. A layer having wavelength conversion material provided therein is disposed over the array of LED chips for forming a light emitting surface from which light is emitted upon activation of the LED chips. In some aspects, the wavelength conversion material includes phosphoric or lumiphoric material that is settled and/or more densely concentrated within one or more predetermined portions of the layer. In some aspects, the devices and methods provided herein can comprise a lumen density of approximately 30 lm/mm2 or greater.
    Type: Application
    Filed: January 30, 2014
    Publication date: August 7, 2014
    Inventors: Florin A. Tudorica, Christopher P. Hussell, Amber C. Abare, Peter Scott Andrews, Sung Chul Joo
  • Patent number: 8686445
    Abstract: A light emission package includes at least one solid state emitter, a leadframe including at least one electrical lead and a body structure encasing a portion of the leadframe. A thermal transfer material can be isolated from the at least one electrical lead. The body structure can include a plastic body structure wherein a rim portion can be disposed along a portion of the upper surface of the body structure. The light emission package can also include the at least one solid state emitter mounted over thermal transfer material using a direct metal-to-metal bond such as by eutectic die attachment. The light emission package is operable to emit light with an output of approximately 70% or greater of an initial light output for an extrapolated time of at least approximately 150,000 hours or more.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: April 1, 2014
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, Amber C. Abare, Jesse Colin Reiherzer
  • Publication number: 20130322070
    Abstract: Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A first light emitter chip can mounted over at least a portion of the cathode, and a second light emitter chip can be wirebonded to at least a portion of the anode. Multiple light emitter chips can be disposed between the first and second light emitter chips.
    Type: Application
    Filed: December 13, 2012
    Publication date: December 5, 2013
    Applicant: CREE, Inc.
    Inventors: Joseph G. Clark, Amber C. Abare, David T. Emerson, Jeremy S. Nevins, Raymond Rosado
  • Publication number: 20130322068
    Abstract: Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A light emitter chip can be disposed over the submount such that the light emitter chip is mounted over at least a portion of the cathode and wirebonded to at least a portion of the anode.
    Type: Application
    Filed: July 20, 2012
    Publication date: December 5, 2013
    Applicant: CREE, Inc.
    Inventors: JOSEPH G. CLARK, JEFFREY CARL BRITT, AMBER C. ABARE, RAYMOND ROSADO, HARSH SUNDANI, DAVID T. EMERSON, JEREMY SCOTT NEVINS
  • Publication number: 20120068198
    Abstract: High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.
    Type: Application
    Filed: January 31, 2011
    Publication date: March 22, 2012
    Applicant: CREE, INC.
    Inventors: Peter Scott Andrews, Raymond Rosado, Michael P. Laughner, David T. Emerson, Amber C. Abare, Jeffrey C. Britt
  • Patent number: D658139
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: April 24, 2012
    Assignee: Cree, Inc.
    Inventors: Peter Scott Andrews, Raymond Rosado, Michael P. Laughner, David T. Emerson, Amber C. Abare, Jeffrey C. Britt
  • Patent number: D709464
    Type: Grant
    Filed: May 31, 2012
    Date of Patent: July 22, 2014
    Assignee: Cree, Inc.
    Inventors: Amber C. Abare, Jeffrey Carl Britt, Joseph G. Clark, Raymond Rosado, Harsh Sundani
  • Patent number: D749051
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: February 9, 2016
    Assignee: Cree, Inc.
    Inventors: Joseph G Clark, Amber C Abare, David T Emerson, Jeremy S Nevins, Raymond Rosado