Patents by Inventor Amber S. Bedi

Amber S. Bedi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat transfer apparatus
    Patent number: 6765797
    Abstract: The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: July 20, 2004
    Assignee: Intel Corporation
    Inventors: Mark D. Summers, Karl H. Mauritz, Amber S. Bedi, William Handley, Carol Miller, Javier Leija, Daniel Dragoon
  • Heat transfer apparatus
    Publication number: 20030076657
    Abstract: The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.
    Type: Application
    Filed: December 19, 2002
    Publication date: April 24, 2003
    Applicant: Intel Corporation
    Inventors: Mark D. Summers, Karl H. Mauritz, Amber S. Bedi, William Handley, Carol Miller, Javier Leija, Daniel Dragoon
  • Heat transfer apparatus
    Patent number: 6535387
    Abstract: The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.
    Type: Grant
    Filed: June 28, 2001
    Date of Patent: March 18, 2003
    Assignee: Intel Corporation
    Inventors: Mark D. Summers, Karl H. Mauritz, Amber S. Bedi, William Handley, Carol Miller, Javier Leija, Daniel Dragoon
  • HEAT TRANSFER APPARATUS
    Publication number: 20030011993
    Abstract: The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.
    Type: Application
    Filed: June 28, 2001
    Publication date: January 16, 2003
    Applicant: Intel Corporation
    Inventors: Mark D. Summers, Karl H. Mauritz, Amber S. Bedi, William Handley, Carol Miller, Javier Leija, Daniel Dragoon