Patents by Inventor Ameen K. Saafir

Ameen K. Saafir has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8264157
    Abstract: An electronic device can include an organic diode and a shunt that allows a significant current to bypass the organic diode, wherein the shunt is separate from the organic diode. Alternatively, an electronic device can include an organic diode lying along a first conduction path. The electronic device can also include a resistive member lying along a second conduction path that is parallel to the first conduction path. In another aspect, a process of forming an electronic device can include forming a first conductive member, forming a resistive member over the first conductive member, and forming an organic semiconductor layer over the first conductive member. The process can also include forming a second conductive member over the resistive member and the organic semiconductor layer, such that the resistive member and the organic semiconductor layer lie along parallel conduction paths between the first and second conductive members.
    Type: Grant
    Filed: March 25, 2009
    Date of Patent: September 11, 2012
    Inventors: Dmitry Kolosov, Johann Thomas Trujillo, Andrew Wesley Johnson, Ameen K. Saafir
  • Publication number: 20110025212
    Abstract: An electronic device can include an organic diode and a shunt that allows a significant current to bypass the organic diode, wherein the shunt is separate from the organic diode. Alternatively, an electronic device can include an organic diode lying along a first conduction path. The electronic device can also include a resistive member lying along a second conduction path that is parallel to the first conduction path. In another aspect, a process of forming an electronic device can include forming a first conductive member, forming a resistive member over the first conductive member, and forming an organic semiconductor layer over the first conductive member. The process can also include forming a second conductive member over the resistive member and the organic semiconductor layer, such that the resistive member and the organic semiconductor layer lie along parallel conduction paths between the first and second conductive members.
    Type: Application
    Filed: March 25, 2009
    Publication date: February 3, 2011
    Applicant: E. I. DU PONT DE NEMOURS AND COMPANY
    Inventors: DMITRY KOLOSOV, Johann Thomas Trujillo, Andrew Wesley Johnson, Ameen K. Saafir